AU8807891A - Method of preparing a printed substrate - Google Patents
Method of preparing a printed substrateInfo
- Publication number
- AU8807891A AU8807891A AU88078/91A AU8807891A AU8807891A AU 8807891 A AU8807891 A AU 8807891A AU 88078/91 A AU88078/91 A AU 88078/91A AU 8807891 A AU8807891 A AU 8807891A AU 8807891 A AU8807891 A AU 8807891A
- Authority
- AU
- Australia
- Prior art keywords
- preparing
- printed substrate
- printed
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/244—Finish plating of conductors, especially of copper conductors, e.g. for pads or lands
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/48—Coating with alloys
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3473—Plating of solder
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/03—Metal processing
- H05K2203/0392—Pretreatment of metal, e.g. before finish plating, etching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0562—Details of resist
- H05K2203/0571—Dual purpose resist, e.g. etch resist used as solder resist, solder resist used as plating resist
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0703—Plating
- H05K2203/072—Electroless plating, e.g. finish plating or initial plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2-321183 | 1990-11-27 | ||
JP32118390 | 1990-11-27 | ||
JP3-285718 | 1991-10-04 | ||
JP3285718A JPH04363093A (en) | 1990-11-27 | 1991-10-04 | Manufacture of printed board |
Publications (1)
Publication Number | Publication Date |
---|---|
AU8807891A true AU8807891A (en) | 1992-06-04 |
Family
ID=26556002
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU88078/91A Abandoned AU8807891A (en) | 1990-11-27 | 1991-11-22 | Method of preparing a printed substrate |
Country Status (6)
Country | Link |
---|---|
JP (1) | JPH04363093A (en) |
KR (1) | KR940009173B1 (en) |
AU (1) | AU8807891A (en) |
CA (1) | CA2056218A1 (en) |
DE (1) | DE4139031A1 (en) |
GB (1) | GB2250866A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4142658A1 (en) * | 1991-12-19 | 1993-06-24 | Siemens Ag | Deposition of solder pattern on circuit boards - applying charge drum collecting pattern of soldered powder particles for transfer to board. |
CN114885510B (en) * | 2022-04-18 | 2023-07-04 | 安捷利美维电子(厦门)有限责任公司 | Method for reducing black dot pollution of copper surface ink |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1690274A1 (en) * | 1967-06-28 | 1971-05-13 | Telefunken Patent | Process for the production of wiring boards with more than two line levels (multilayer circuit boards) |
GB1310880A (en) * | 1969-06-13 | 1973-03-21 | Microponent Dev Ltd | Multi-layer printed circuit board assemblies |
US4093466A (en) * | 1975-05-06 | 1978-06-06 | Amp Incorporated | Electroless tin and tin-lead alloy plating baths |
GB2137421A (en) * | 1983-03-15 | 1984-10-03 | Standard Telephones Cables Ltd | Printed circuits |
DE3425214A1 (en) * | 1984-07-09 | 1986-02-06 | Riedel-De Haen Ag, 3016 Seelze | MEANS FOR THE DEFLECTIVE DEPOSITION OF TIN AND / OR LEAD |
DE3716640C2 (en) * | 1986-05-19 | 1996-03-28 | Harima Chemicals Inc | Process for producing a metal coating on a substrate metal |
JPH02197580A (en) * | 1989-01-24 | 1990-08-06 | Okuno Seiyaku Kogyo Kk | Electroless solder plating bath |
-
1991
- 1991-10-04 JP JP3285718A patent/JPH04363093A/en active Pending
- 1991-11-22 AU AU88078/91A patent/AU8807891A/en not_active Abandoned
- 1991-11-26 KR KR1019910021292A patent/KR940009173B1/en not_active IP Right Cessation
- 1991-11-26 CA CA002056218A patent/CA2056218A1/en not_active Abandoned
- 1991-11-27 DE DE4139031A patent/DE4139031A1/en not_active Ceased
- 1991-11-27 GB GB9125275A patent/GB2250866A/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
JPH04363093A (en) | 1992-12-15 |
CA2056218A1 (en) | 1992-05-28 |
GB9125275D0 (en) | 1992-01-29 |
DE4139031A1 (en) | 1992-06-11 |
GB2250866A (en) | 1992-06-17 |
KR940009173B1 (en) | 1994-10-01 |
KR920011299A (en) | 1992-06-27 |
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