AU7958700A - Package for high-frequency device - Google Patents

Package for high-frequency device

Info

Publication number
AU7958700A
AU7958700A AU79587/00A AU7958700A AU7958700A AU 7958700 A AU7958700 A AU 7958700A AU 79587/00 A AU79587/00 A AU 79587/00A AU 7958700 A AU7958700 A AU 7958700A AU 7958700 A AU7958700 A AU 7958700A
Authority
AU
Australia
Prior art keywords
package
frequency device
frequency
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU79587/00A
Inventor
Makoto Aoki
Masakiyo Horioka
Kiyoshi Mizushima
Yoshihisa Okumura
Kunio Tochi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nikko Co Ltd
Original Assignee
Nikko Co Ltd
Nikko KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikko Co Ltd, Nikko KK filed Critical Nikko Co Ltd
Publication of AU7958700A publication Critical patent/AU7958700A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
AU79587/00A 1999-10-29 2000-10-26 Package for high-frequency device Abandoned AU7958700A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP11/309893 1999-10-29
JP30989399 1999-10-29
PCT/JP2000/007498 WO2001033631A1 (en) 1999-10-29 2000-10-26 Package for high-frequency device

Publications (1)

Publication Number Publication Date
AU7958700A true AU7958700A (en) 2001-05-14

Family

ID=17998597

Family Applications (1)

Application Number Title Priority Date Filing Date
AU79587/00A Abandoned AU7958700A (en) 1999-10-29 2000-10-26 Package for high-frequency device

Country Status (2)

Country Link
AU (1) AU7958700A (en)
WO (1) WO2001033631A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100568312B1 (en) 2004-09-23 2006-04-05 삼성전기주식회사 Laminated balun transformer
JP2007300173A (en) * 2006-04-27 2007-11-15 Epson Toyocom Corp Package for electronic device, and electronic device
DE102006024551A1 (en) 2006-05-23 2007-11-29 Siemens Ag Electrical device with shielding
DE102006033709B4 (en) * 2006-07-20 2010-01-14 Epcos Ag Electric module
JP2012222537A (en) * 2011-04-07 2012-11-12 Seiko Epson Corp Package, vibrator, oscillator and electronic device
EP2725715B1 (en) * 2012-10-29 2018-12-12 Optosys SA Proximity sensor
JP6374163B2 (en) * 2013-12-27 2018-08-15 京セラ株式会社 Piezoelectric oscillator
JP7226274B2 (en) * 2019-11-29 2023-02-21 株式会社デンソー radar equipment
TWI802991B (en) * 2021-09-13 2023-05-21 日商雅馬哈智能機器控股股份有限公司 Ultrasonic vibration type defect detection device and wire defect detection system

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60181917U (en) * 1984-05-11 1985-12-03 クラリオン株式会社 surface acoustic wave device
JPS63174341A (en) * 1987-01-14 1988-07-18 Hitachi Ltd Semiconductor device
JPH01165148A (en) * 1987-12-21 1989-06-29 Mitsubishi Electric Corp Semiconductor device
JPH0770640B2 (en) * 1988-09-24 1995-07-31 株式会社村田製作所 IC chip manufacturing method
JPH0669306A (en) * 1992-08-18 1994-03-11 Sumitomo Kinzoku Ceramics:Kk Sheetlike ceramic package
JPH07135270A (en) * 1993-11-11 1995-05-23 Hitachi Ltd Manufacture of semiconductor integrated circuit device
JPH09232461A (en) * 1996-02-23 1997-09-05 Nikko Co Manufacture of electronic part having hollow package structure having ceramic lid

Also Published As

Publication number Publication date
WO2001033631A1 (en) 2001-05-10

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase