AU6705900A - Minicard with integrated circuit and method for obtaining same - Google Patents

Minicard with integrated circuit and method for obtaining same

Info

Publication number
AU6705900A
AU6705900A AU67059/00A AU6705900A AU6705900A AU 6705900 A AU6705900 A AU 6705900A AU 67059/00 A AU67059/00 A AU 67059/00A AU 6705900 A AU6705900 A AU 6705900A AU 6705900 A AU6705900 A AU 6705900A
Authority
AU
Australia
Prior art keywords
minicard
integrated circuit
obtaining same
obtaining
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU67059/00A
Inventor
Bernard Calvas
Jean-Christophe Fidalgo
Philippe Patrice
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gemplus SA
Original Assignee
Gemplus Card International SA
Gemplus SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gemplus Card International SA, Gemplus SA filed Critical Gemplus Card International SA
Publication of AU6705900A publication Critical patent/AU6705900A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/145—Organic substrates, e.g. plastic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Power Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
AU67059/00A 1999-07-23 2000-07-13 Minicard with integrated circuit and method for obtaining same Abandoned AU6705900A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR9909771A FR2796759B1 (en) 1999-07-23 1999-07-23 MINICARD WITH INTEGRATED CIRCUIT AND METHOD FOR OBTAINING SAME
FR9909771 1999-07-23
PCT/FR2000/002049 WO2001008093A1 (en) 1999-07-23 2000-07-13 Minicard with integrated circuit and method for obtaining same

Publications (1)

Publication Number Publication Date
AU6705900A true AU6705900A (en) 2001-02-13

Family

ID=9548605

Family Applications (1)

Application Number Title Priority Date Filing Date
AU67059/00A Abandoned AU6705900A (en) 1999-07-23 2000-07-13 Minicard with integrated circuit and method for obtaining same

Country Status (3)

Country Link
AU (1) AU6705900A (en)
FR (1) FR2796759B1 (en)
WO (1) WO2001008093A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60022096T2 (en) 2000-01-19 2006-06-01 Fractus, S.A. ROOM FILLING MINIATURE ANTENNA
KR101166000B1 (en) 2002-01-28 2012-07-16 교와 핫꼬 기린 가부시키가이샤 Methods of treating patients suffering from movement disorders
CN1723587A (en) 2002-11-07 2006-01-18 碎云股份有限公司 Integrated circuit package including miniature antenna
EP1771919A1 (en) 2004-07-23 2007-04-11 Fractus, S.A. Antenna in package with reduced electromagnetic interaction with on chip elements
US8738103B2 (en) 2006-07-18 2014-05-27 Fractus, S.A. Multiple-body-configuration multimedia and smartphone multifunction wireless devices

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5155068A (en) * 1989-08-31 1992-10-13 Sharp Kabushiki Kaisha Method for manufacturing an IC module for an IC card whereby an IC device and surrounding encapsulant are thinned by material removal
DE4034225C2 (en) * 1990-10-26 1994-01-27 Reinhard Jurisch Data carriers for identification systems
FR2735284B1 (en) * 1995-06-12 1997-08-29 Solaic Sa CHIP FOR ELECTRONIC CARD COATED WITH A LAYER OF INSULATING MATERIAL AND ELECTRONIC CARD CONTAINING SUCH A CHIP
US5731222A (en) * 1995-08-01 1998-03-24 Hughes Aircraft Company Externally connected thin electronic circuit having recessed bonding pads
US5965933A (en) * 1996-05-28 1999-10-12 Young; William R. Semiconductor packaging apparatus
DE19713641A1 (en) * 1997-04-02 1998-10-08 Ods Gmbh & Co Kg Mini chip card and process for its manufacture
FR2769389B1 (en) * 1997-10-07 2000-01-28 Rue Cartes Et Systemes De MICROCIRCUIT CARD COMBINING EXTERIOR CONTACT RANGES AND AN ANTENNA, AND METHOD FOR MANUFACTURING SUCH A CARD

Also Published As

Publication number Publication date
FR2796759A1 (en) 2001-01-26
WO2001008093A1 (en) 2001-02-01
FR2796759B1 (en) 2001-11-02

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase