AU657824B2 - Power distribution arrangement - Google Patents

Power distribution arrangement Download PDF

Info

Publication number
AU657824B2
AU657824B2 AU30215/92A AU3021592A AU657824B2 AU 657824 B2 AU657824 B2 AU 657824B2 AU 30215/92 A AU30215/92 A AU 30215/92A AU 3021592 A AU3021592 A AU 3021592A AU 657824 B2 AU657824 B2 AU 657824B2
Authority
AU
Australia
Prior art keywords
circuit board
power distribution
partition
printed circuit
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU30215/92A
Other versions
AU3021592A (en
Inventor
Mark Stephen Andrews
Sidney Burton
Avtar Singh Chana
Morten Hattessen
John Vernon Patnter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Services Ltd
Original Assignee
Fujitsu Services Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Services Ltd filed Critical Fujitsu Services Ltd
Publication of AU3021592A publication Critical patent/AU3021592A/en
Application granted granted Critical
Publication of AU657824B2 publication Critical patent/AU657824B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0213Electrical arrangements not otherwise provided for
    • H05K1/0263High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/14Structural association of two or more printed circuits
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04Assemblies of printed circuits
    • H05K2201/044Details of backplane or midplane for mounting orthogonal PCBs
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10272Busbars, i.e. thick metal bars mounted on the PCB as high-current conductors
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227Other objects, e.g. metallic pieces
    • H05K2201/10295Metallic connector elements partly mounted in a hole of the PCB

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Description

AUSTRALIA Patents Act 1990 O/UU/U11 2tasio Regulation 3.2(2)
ORIGINAL
COMPLETE SPECIFICATION STANDARD PATENT Application Number: Lodged: Invention Title: POWER DISTRIBUTION ARRANGEMENT The following statement is a full description of this Invention, Including the best method of performing it known to :-US -1- C1189 POWER DISTRIBUTION ARRANGEMENT Background to the Invention The present invention relates to a power distribution arrangements for electronic apparatus.
Electronic apparatus, such as computer equipment, normally requires to be supplied with power at one or more voltage levels. This can be achieved by the provision of a separate power supply nit supplying power through cables connected, for example, to bus bars mounted on a printed circuit board. The cables are of necessity bulky because of the heavy currents they are required to carry and accommodating these cables together with other wiring ass-iiated with the assembly is sometimes difficult.
An object of the present invention is to provide an improved power distribution arrangement in an electronic apparatus which overcomes this problem.
Summary of the Invention According to the invention there is provided electronic apparatus comprising: a cabinet having at least one internal metal partition; a first printed circuit board mounted within the cabinet in a plane substantially parallel to said partition; &4j
J
Y- -1 ~ra;u~rcslWr;rrrr -2a power distribution bus mounted on said 2irst printed circuit board, for distributing power to components on said first printed circuit board, said power distribution bus being a laminated structure comprising a plurality of separate conductors, insulated from each other; a power distribution circuit board disposed within said cabinet on the opposite side of the partition to said first printed circuit board; and a plurality of conductive rods extending through said partition and electrically insulated from said partition, for conveying electrical power from said power distribution circuit board to said power distribution bus.
Brief Description of the Drawings An embodiment of the invention will now be described, by way of example, with reference to the i accompanying drawings in which: Fig 1 shows a printed circuit board assembly, forming part of I an electronic apparatus, and Fig 2 is a view of a printed circuit board forming part of the assembly.
Description of an embodiment of the Invention Referring to the drawings, an electronic apparatus 1 comprises a motherboard 2, a power distribution board 3, and an input/output board 4. The motherboard carries a plurality of daughter boards 5 (only one shown), mounted at right angles to the motherboard. In order to preserve clarity, and as they do not form part of the invention, the components and printed wiring on the circuit boards have been
_I
-3omitted from the drawings. The circuit board assembly 1 is housed in a cabinet having a metal partition 6. The motherboard 2 and the power distribution board 3 are mounted on opposite sides of the partition 6 in spaced relationship therewith by spacers (not shown).
Edge connectors 7 mounted on the input/output board 4 contain rows of contacts which engage corresponding contact areas 9 on the circuit boards 2 and 3 to electrically interconnect the three circuit boards 2, 3, and 4. Further edge connectors 7 mounted on the motherboard 2 engage similar contact areas on the daughter boards 5 to provide interconnections between the boards 2 and A bus bar 10 is mounted on ont face of the motherboard 2 and is of a laminated structure comprising three separate conductors insulated from one another. Each of the separate conductors has an extended lug 11 containing an aperture 12. Further lugs 13 extending from the bus bar conductors provide voltage supply connections from the bus bar to appropriate points of the circuitry on the motherboard 2. The lugs 13 are electrically connected to the circuitry by conductive rivets 14. The rivets pass through spacers interposed between the lugs 13 and the surface of the motherboard 2. Thus the spacers in conjunction with t,.
rivets serve to support the bus bar in spaced relationship to the surface of the motherboard.
Three power cables 16 (only one shown), one carrying +5 volts, one carrying +12 volts and the third being grounded, are electrically connected one to each of the lugs 11 by respective threaded conductive rods 17. The rods 17 extend through the power distribution board 3, the partition 6 and the apertures 12 in the lugs 11. As the partition 6 is formed from conductive material, it will be realised that the -4rods 17 must pass through the partition without contacting it. This may be accomplished, for example, by providing the rods 17 with insulating sleeves 18, or simply by providing clearance holes in the partition. Each of the power cables 16 has a connector which is secured to one end of each rod 17 by nuts 19. Further nuts 20 secure the other end of each of the rods 17 to the lugs 11 on the bus bar conductors. The rods 17 are manufactured from a material having good electrical conductivity, such as for example, brass and it will be understood that their cross sectional area must be sufficient to carry the required currents.
It will be realised that by providing direct connections from the distribution board 3 to the bus bar on the motherboard 2, power supply cables are no longer required to be routed around the partition 6 between the circuit boards 2, 3 of the assembly, thereby relieving the wiring congestion.
r I-

Claims (4)

1. Electronic apparatus comprising: a cabinet having at least one internal metal partition; a first printed circuit board mounted within the cabinet in a plane substantially parallel to said partition; a power distribution bus mounted on said first printed circuit board, for distributing power to components on said first printed circuit board, said power distribution bus being a laminated structure comprising a plurality of separate conductors, insulated from each other; a power distribution circuit board disposed within said cabinet on the opposite side of the partition to said first printed circuit board; and a plurality of conductive rods extending through said partition and electrically insulated from said partition, for conveying electrical power from said power distribution circuit board to said power distribution bus.
2. Apparatus according to Claim I wherein said power distribution printed circuit board is mounted in a plane substantially parallel to said partition. 3~' 'i
3. Apparatus according to Claim 1 wherein said first printed circuit board is a motherboard, carrying a plurality of daughter boards mounted at right angles to the mo'- irboard on the side of the motherboard remote from the partition.
4. Electronic apparatus substantially as hereinbefore described with reference to the accompanying drawings. Dated this third day of January, 1995. INTERNATIONAL COMPUTERS LIMITED 1 FHGH STREET PUTNEY LONDON SW15 1SW UK WATEIRMARK DATENT TRADEMARK ATTORNEYS LEVEL 4 ~O RY GARDENS 2 CAVILL AVENUE ASHFIELD NSW 2131 -6- ABSTRACT A power distribution arrangement in a printed circuit board assembly which reduces wiring congestion around the assembly by removing the necessity to route cables from an external power supply to a bus bar on one of the circuit boards of the assembly. Conductive rods extend from conductors of the bus bar through the circuit assembly to form terminals on an outer face of the assembly to which the power cables are connected. it L UI
AU30215/92A 1991-12-20 1992-12-17 Power distribution arrangement Ceased AU657824B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB9127027 1991-12-20
GB919127027A GB9127027D0 (en) 1991-12-20 1991-12-20 Power distribution arrangement

Publications (2)

Publication Number Publication Date
AU3021592A AU3021592A (en) 1993-06-24
AU657824B2 true AU657824B2 (en) 1995-03-23

Family

ID=10706562

Family Applications (1)

Application Number Title Priority Date Filing Date
AU30215/92A Ceased AU657824B2 (en) 1991-12-20 1992-12-17 Power distribution arrangement

Country Status (3)

Country Link
AU (1) AU657824B2 (en)
GB (2) GB9127027D0 (en)
ZA (1) ZA929594B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110972394B (en) * 2019-12-31 2021-03-23 中科可控信息产业有限公司 Circuit board structure and electronic equipment

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1449369A (en) * 1973-03-29 1976-09-15 Telemecanique Electrique Circuit connections for electronic or electrical automation systems
GB2187335A (en) * 1986-02-21 1987-09-03 Alps Electric Co Ltd RF modulators
AU1004392A (en) * 1991-01-09 1992-07-16 Gpt Limited Orthogonal equipment interconnection

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS614172A (en) * 1984-06-18 1986-01-10 ファナック株式会社 Ac motor control board
FR2588696B1 (en) * 1985-10-16 1988-10-07 Thomson Csf HYBRID CIRCUIT AND METHOD FOR MANUFACTURING SUCH A CIRCUIT

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1449369A (en) * 1973-03-29 1976-09-15 Telemecanique Electrique Circuit connections for electronic or electrical automation systems
GB2187335A (en) * 1986-02-21 1987-09-03 Alps Electric Co Ltd RF modulators
AU1004392A (en) * 1991-01-09 1992-07-16 Gpt Limited Orthogonal equipment interconnection

Also Published As

Publication number Publication date
ZA929594B (en) 1993-06-10
GB9223965D0 (en) 1993-01-06
GB2262660B (en) 1995-03-29
GB2262660A (en) 1993-06-23
AU3021592A (en) 1993-06-24
GB9127027D0 (en) 1992-02-19

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Legal Events

Date Code Title Description
MK14 Patent ceased section 143(a) (annual fees not paid) or expired