AU6534298A - Apparatus and method of protecting electronics - Google Patents

Apparatus and method of protecting electronics

Info

Publication number
AU6534298A
AU6534298A AU65342/98A AU6534298A AU6534298A AU 6534298 A AU6534298 A AU 6534298A AU 65342/98 A AU65342/98 A AU 65342/98A AU 6534298 A AU6534298 A AU 6534298A AU 6534298 A AU6534298 A AU 6534298A
Authority
AU
Australia
Prior art keywords
protecting electronics
electronics
protecting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU65342/98A
Inventor
James T. Moore
Timothy A. Reese
Jeremy L. Walter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Penn State Research Foundation
Original Assignee
Penn State Research Foundation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Penn State Research Foundation filed Critical Penn State Research Foundation
Publication of AU6534298A publication Critical patent/AU6534298A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20463—Filling compound, e.g. potted resin
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • H05K7/1434—Housings for electronics exposed to high gravitational force; Cylindrical housings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
AU65342/98A 1997-02-05 1998-02-05 Apparatus and method of protecting electronics Abandoned AU6534298A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US80094297A 1997-02-05 1997-02-05
US08800942 1997-02-05
PCT/US1998/002385 WO1998036628A1 (en) 1997-02-05 1998-02-05 Apparatus and method of protecting electronics

Publications (1)

Publication Number Publication Date
AU6534298A true AU6534298A (en) 1998-09-08

Family

ID=25179780

Family Applications (1)

Application Number Title Priority Date Filing Date
AU65342/98A Abandoned AU6534298A (en) 1997-02-05 1998-02-05 Apparatus and method of protecting electronics

Country Status (2)

Country Link
AU (1) AU6534298A (en)
WO (1) WO1998036628A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2001273843B2 (en) * 2000-05-04 2005-06-30 Robert Bosch Gmbh Electronic control module for a vehicle
AUPQ729400A0 (en) * 2000-05-04 2000-05-25 Robert Bosch Gmbh An electronic control module for a vehicle
EP2792224B1 (en) 2011-12-16 2017-10-25 Telefonaktiebolaget LM Ericsson (publ) Plug-in unit protection
CN106686923A (en) * 2015-11-11 2017-05-17 上海英硕自动化科技有限公司 Reinforced enhancement mode programmable computer controller

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5060113A (en) * 1987-04-09 1991-10-22 Raychem Corporation Connector assembly
US5181167A (en) * 1991-12-02 1993-01-19 Sun Microsystems, Inc. Stacking heatpipe for three dimensional electronic packaging
CA2120468A1 (en) * 1993-04-05 1994-10-06 Kenneth Alan Salisbury Electronic module containing an internally ribbed, integral heat sink and bonded, flexible printed wiring board with two-sided component population

Also Published As

Publication number Publication date
WO1998036628A1 (en) 1998-08-20

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