AU6256601A - Semiconductor component, electrically conductive structure therefor, and processfor production thereof - Google Patents
Semiconductor component, electrically conductive structure therefor, and processfor production thereofInfo
- Publication number
- AU6256601A AU6256601A AU62566/01A AU6256601A AU6256601A AU 6256601 A AU6256601 A AU 6256601A AU 62566/01 A AU62566/01 A AU 62566/01A AU 6256601 A AU6256601 A AU 6256601A AU 6256601 A AU6256601 A AU 6256601A
- Authority
- AU
- Australia
- Prior art keywords
- processfor
- production
- electrically conductive
- conductive structure
- semiconductor component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/568—Temporary substrate used as encapsulation process aid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05599—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8538—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/85399—Material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10027492 | 2000-06-02 | ||
DE10027492 | 2000-06-02 | ||
PCT/IB2001/000891 WO2001093327A1 (en) | 2000-06-02 | 2001-05-22 | Semiconductor component, electrically conductive structure therefor, and process for production thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6256601A true AU6256601A (en) | 2001-12-11 |
Family
ID=7644540
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU62566/01A Abandoned AU6256601A (en) | 2000-06-02 | 2001-05-22 | Semiconductor component, electrically conductive structure therefor, and processfor production thereof |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU6256601A (en) |
WO (1) | WO2001093327A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008059301A1 (en) * | 2006-11-14 | 2008-05-22 | Infineon Technologies Ag | An electronic component and method for its production |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59208756A (en) * | 1983-05-12 | 1984-11-27 | Sony Corp | Manufacture of semiconductor device package |
US5200362A (en) * | 1989-09-06 | 1993-04-06 | Motorola, Inc. | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
EP1213756A3 (en) * | 1994-03-18 | 2005-05-25 | Hitachi Chemical Co., Ltd. | Fabrication process of semiconductor package and semiconductor package |
US6072239A (en) * | 1995-11-08 | 2000-06-06 | Fujitsu Limited | Device having resin package with projections |
US6001671A (en) * | 1996-04-18 | 1999-12-14 | Tessera, Inc. | Methods for manufacturing a semiconductor package having a sacrificial layer |
JP3521758B2 (en) * | 1997-10-28 | 2004-04-19 | セイコーエプソン株式会社 | Method for manufacturing semiconductor device |
-
2001
- 2001-05-22 AU AU62566/01A patent/AU6256601A/en not_active Abandoned
- 2001-05-22 WO PCT/IB2001/000891 patent/WO2001093327A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2001093327A1 (en) | 2001-12-06 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001289210A1 (en) | Electrical conductive substrate | |
AU2002322116A1 (en) | Semiconductor die including conductive columns | |
AU2001275984A1 (en) | Self-assembled electrical networks | |
AU2001295067A1 (en) | Jar with electrical conductor | |
AU2002225863A1 (en) | Securing electrical conductors | |
AU2002350894A1 (en) | High density planar electrical interface | |
AU4781900A (en) | Conductive contact | |
AU2001245337A1 (en) | Electrical cells, components and methods | |
AU2002256562A1 (en) | Electrical connectors | |
AU5666501A (en) | Electrically conductive resin composition | |
AU2001252349A1 (en) | Electrical wire insulation | |
AU2318100A (en) | Electrically conductive compositions and methods for producing same | |
AU6634901A (en) | Conductive contact | |
AU2001271293A1 (en) | Semiconductor structure, device, circuit, and process | |
AU6874300A (en) | Conductive contact | |
GB2353713B (en) | Adjustable,electrically conductive bracelet | |
AU6474700A (en) | Electrode structure, electric component and production methods | |
AU2001249173A1 (en) | Improved crimpable electrical connector | |
AU6256601A (en) | Semiconductor component, electrically conductive structure therefor, and processfor production thereof | |
AU2002307059A1 (en) | Electrical terminal tail aligner | |
AU2001252695A1 (en) | Method of manufacturing conductive structure | |
AU2002360893A1 (en) | Electrical contact element | |
EP1167953A4 (en) | Electric conductometer, electrode for measuring electric conductivity, and method for producing the same | |
AU2001244016A1 (en) | Method for fabricating electrical connecting elements, and connecting element | |
EP1455366A4 (en) | Proton conductor, single-ion conductor, and processes for producing these |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |