AU6165700A - Heatsink and method of manufacture - Google Patents
Heatsink and method of manufactureInfo
- Publication number
- AU6165700A AU6165700A AU61657/00A AU6165700A AU6165700A AU 6165700 A AU6165700 A AU 6165700A AU 61657/00 A AU61657/00 A AU 61657/00A AU 6165700 A AU6165700 A AU 6165700A AU 6165700 A AU6165700 A AU 6165700A
- Authority
- AU
- Australia
- Prior art keywords
- heatsink
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
- F28F3/025—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements
- F28F3/027—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being corrugated, plate-like elements with openings, e.g. louvered corrugated fins; Assemblies of corrugated strips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9915752A GB9915752D0 (en) | 1999-07-03 | 1999-07-03 | Heatsink and method of manufacture |
GB9915752 | 1999-07-03 | ||
PCT/GB2000/002378 WO2001003182A1 (en) | 1999-07-03 | 2000-07-03 | Heatsink and method of manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
AU6165700A true AU6165700A (en) | 2001-01-22 |
Family
ID=10856701
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU61657/00A Abandoned AU6165700A (en) | 1999-07-03 | 2000-07-03 | Heatsink and method of manufacture |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU6165700A (en) |
GB (1) | GB9915752D0 (en) |
WO (1) | WO2001003182A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1328020A1 (en) * | 2002-01-10 | 2003-07-16 | Wen-Chen Wei | Fin piece structure for heat dissipater |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2571631A (en) * | 1947-02-26 | 1951-10-16 | Kellogg M W Co | Heat exchange element |
US2656158A (en) * | 1948-07-23 | 1953-10-20 | Air Preheater | Plate type heat exchanger and method of manufacturing same |
FR1462160A (en) * | 1963-05-28 | 1966-04-15 | Chausson Usines Sa | Method of manufacturing a heat exchanger element, element obtained by this process and application of this element to the constitution of particular heat exchangers |
DE3203609C2 (en) | 1982-02-03 | 1985-02-14 | Siemens AG, 1000 Berlin und 8000 München | Cooling element for integrated components |
US5029636A (en) * | 1990-11-05 | 1991-07-09 | General Motors Corporation | Oil cooler with louvered center |
JPH0492166U (en) * | 1990-12-04 | 1992-08-11 | ||
JPH06244328A (en) * | 1993-02-19 | 1994-09-02 | Fujitsu Ltd | Heat sink |
DE4328353C2 (en) * | 1993-08-17 | 1996-06-05 | Schulz Harder Juergen | Multi-layer substrate |
JP3158983B2 (en) | 1994-10-03 | 2001-04-23 | 住友精密工業株式会社 | Corrugated radiator fin for cooling LSI package |
EP0809287A1 (en) * | 1996-05-22 | 1997-11-26 | Jean Amigo | Heat dissipation device for an integrated circuit |
US6401807B1 (en) * | 1997-04-03 | 2002-06-11 | Silent Systems, Inc. | Folded fin heat sink and fan attachment |
-
1999
- 1999-07-03 GB GB9915752A patent/GB9915752D0/en not_active Ceased
-
2000
- 2000-07-03 AU AU61657/00A patent/AU6165700A/en not_active Abandoned
- 2000-07-03 WO PCT/GB2000/002378 patent/WO2001003182A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
GB9915752D0 (en) | 1999-09-08 |
WO2001003182A1 (en) | 2001-01-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |