AU5877694A - Non lead soldering in a substantially oxygen free atmosphere - Google Patents
Non lead soldering in a substantially oxygen free atmosphereInfo
- Publication number
- AU5877694A AU5877694A AU58776/94A AU5877694A AU5877694A AU 5877694 A AU5877694 A AU 5877694A AU 58776/94 A AU58776/94 A AU 58776/94A AU 5877694 A AU5877694 A AU 5877694A AU 5877694 A AU5877694 A AU 5877694A
- Authority
- AU
- Australia
- Prior art keywords
- oxygen free
- free atmosphere
- substantially oxygen
- lead soldering
- non lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
- B23K35/383—Selection of media, e.g. special atmospheres for surrounding the working area mainly containing noble gases or nitrogen
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/008—Soldering within a furnace
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/38—Selection of media, e.g. special atmospheres for surrounding the working area
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3468—Applying molten solder
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/086—Using an inert gas
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US1442793A | 1993-02-05 | 1993-02-05 | |
US014427 | 1993-02-05 | ||
PCT/CA1994/000040 WO1994023888A1 (en) | 1993-02-05 | 1994-01-26 | Non lead soldering in a substantially oxygen free atmosphere |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5877694A true AU5877694A (en) | 1994-11-08 |
Family
ID=21765422
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU58776/94A Abandoned AU5877694A (en) | 1993-02-05 | 1994-01-26 | Non lead soldering in a substantially oxygen free atmosphere |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU5877694A (en) |
WO (1) | WO1994023888A1 (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6179935B1 (en) * | 1997-04-16 | 2001-01-30 | Fuji Electric Co., Ltd. | Solder alloys |
US6264093B1 (en) * | 1998-11-02 | 2001-07-24 | Raymond W. Pilukaitis | Lead-free solder process for printed wiring boards |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2536160A1 (en) * | 1982-11-17 | 1984-05-18 | Piezo Ceram Electronique | CONTINUOUS BURNER OF ELECTRONIC COMPONENTS |
EP0361507B1 (en) * | 1988-09-30 | 1995-06-07 | Praxair Technology, Inc. | Process for reflow coating using an atmosphere having a controlled oxidation capability |
CA2011030C (en) * | 1989-03-20 | 1994-10-18 | Nikhiles Bandyopadhyay | Process for reflow soldering |
US5044542A (en) * | 1989-11-22 | 1991-09-03 | Electrovert Ltd. | Shield gas wave soldering |
US5009725A (en) * | 1990-03-30 | 1991-04-23 | Air Products And Chemicals, Inc. | Fluxing agents comprising β-diketone and β-ketoimine ligands and a process for using the same |
US5121875A (en) * | 1991-02-22 | 1992-06-16 | Union Carbide Industrial Gases Technology Corporation | Wave soldering in a protective atmosphere enclosure over a solder pot |
-
1994
- 1994-01-26 WO PCT/CA1994/000040 patent/WO1994023888A1/en active Application Filing
- 1994-01-26 AU AU58776/94A patent/AU5877694A/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO1994023888A1 (en) | 1994-10-27 |
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