AU5448294A - Composite substrates for preparation of printed circuits - Google Patents

Composite substrates for preparation of printed circuits

Info

Publication number
AU5448294A
AU5448294A AU54482/94A AU5448294A AU5448294A AU 5448294 A AU5448294 A AU 5448294A AU 54482/94 A AU54482/94 A AU 54482/94A AU 5448294 A AU5448294 A AU 5448294A AU 5448294 A AU5448294 A AU 5448294A
Authority
AU
Australia
Prior art keywords
preparation
printed circuits
composite substrates
substrates
composite
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU54482/94A
Inventor
Miguel Albert Capote
Michael George Todd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toranaga Technologies Inc
Original Assignee
Toranaga Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toranaga Technologies Inc filed Critical Toranaga Technologies Inc
Publication of AU5448294A publication Critical patent/AU5448294A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0129—Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
AU54482/94A 1993-10-22 1993-10-22 Composite substrates for preparation of printed circuits Abandoned AU5448294A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/US1993/010148 WO1995011129A1 (en) 1993-10-22 1993-10-22 Composite substrates for preparation of printed circuits
CN93112824.2A CN1104014A (en) 1993-10-22 1993-12-14 Composite substrates for preparation of printed circuits

Publications (1)

Publication Number Publication Date
AU5448294A true AU5448294A (en) 1995-05-08

Family

ID=36940015

Family Applications (1)

Application Number Title Priority Date Filing Date
AU54482/94A Abandoned AU5448294A (en) 1993-10-22 1993-10-22 Composite substrates for preparation of printed circuits

Country Status (3)

Country Link
CN (1) CN1104014A (en)
AU (1) AU5448294A (en)
WO (1) WO1995011129A1 (en)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19952246A1 (en) * 1998-11-04 2000-05-31 Thomson Brandt Gmbh Electromechanical component includes covering and support layers composed of inflammable plastic material
EP1397946A1 (en) * 2001-04-02 2004-03-17 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
GB0616934D0 (en) 2006-08-26 2006-10-04 Hexcel Composites Ltd Composite material
DE102007038217A1 (en) * 2007-08-13 2009-02-19 Behr Gmbh & Co. Kg Method for soldering a workpiece, device for carrying out the method and workpiece, soldered according to the method
US10293956B2 (en) * 2016-09-16 2019-05-21 The Boeing Company Method for placing electrical conductors interior to a composite structure prior to curing
US10052847B2 (en) 2016-09-16 2018-08-21 The Boeing Company Method for promoting electrical conduction between metallic components and composite materials
EP3718374A4 (en) * 2017-12-01 2021-06-23 Jabil Inc. Apparatus, system and method of providing a conformable heater system
ES2884900T3 (en) * 2018-06-13 2021-12-13 Airbus Operations Slu Procedure for installing printed cables in aircraft cable collector systems, and composite element with an integrated cable collector system
CN111548194A (en) * 2020-05-29 2020-08-18 南京凯泰化学科技有限公司 Preparation method of printed circuit board

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5002818A (en) * 1989-09-05 1991-03-26 Hughes Aircraft Company Reworkable epoxy die-attach adhesive

Also Published As

Publication number Publication date
WO1995011129A1 (en) 1995-04-27
CN1104014A (en) 1995-06-21

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