AU5407698A - A printed circuit board and a method for manufacturing the printed circuit board - Google Patents

A printed circuit board and a method for manufacturing the printed circuit board

Info

Publication number
AU5407698A
AU5407698A AU54076/98A AU5407698A AU5407698A AU 5407698 A AU5407698 A AU 5407698A AU 54076/98 A AU54076/98 A AU 54076/98A AU 5407698 A AU5407698 A AU 5407698A AU 5407698 A AU5407698 A AU 5407698A
Authority
AU
Australia
Prior art keywords
circuit board
printed circuit
manufacturing
printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU54076/98A
Inventor
Frank Kelley Davies
Joachim Robitzki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JERSEYFIELD Ltd
Original Assignee
JERSEYFIELD Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JERSEYFIELD Ltd filed Critical JERSEYFIELD Ltd
Publication of AU5407698A publication Critical patent/AU5407698A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
    • H05K1/056—Insulated conductive substrates, e.g. insulated metal substrate the metal substrate being covered by an organic insulating layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0257—Brushing, e.g. cleaning the conductive pattern by brushing or wiping

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laminated Bodies (AREA)
AU54076/98A 1996-11-22 1997-11-20 A printed circuit board and a method for manufacturing the printed circuit board Abandoned AU5407698A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
IE960825 1996-11-22
IE960825 1996-11-22
PCT/IE1997/000078 WO1998023137A1 (en) 1996-11-22 1997-11-20 A printed circuit board and a method for manufacturing the printed circuit board

Publications (1)

Publication Number Publication Date
AU5407698A true AU5407698A (en) 1998-06-10

Family

ID=11041313

Family Applications (1)

Application Number Title Priority Date Filing Date
AU54076/98A Abandoned AU5407698A (en) 1996-11-22 1997-11-20 A printed circuit board and a method for manufacturing the printed circuit board

Country Status (2)

Country Link
AU (1) AU5407698A (en)
WO (1) WO1998023137A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMO20030200A1 (en) * 2003-07-10 2005-01-11 Nuova Laelvi S R L PROCEDURE FOR ASSEMBLING A PRINTED CIRCUIT
JP7521388B2 (en) * 2020-11-25 2024-07-24 三菱マテリアル株式会社 Heat sink integrated insulating circuit board and method for manufacturing the same

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4086114A (en) * 1975-05-27 1978-04-25 International Business Machines Corporation Aluminum surface treatment to enhance adhesion in a given direction
JPS6450592A (en) * 1987-08-21 1989-02-27 Shinko Chem Super-heat dissipation type composite circuit board
JPH01166956A (en) * 1987-12-24 1989-06-30 Shin Kobe Electric Mach Co Ltd Manufacture of laminated sheet whose metallic base is plated with metallic foil
JPH0239930A (en) * 1988-07-29 1990-02-08 Shin Kobe Electric Mach Co Ltd Metal foil-plated laminate with metal core and its manufacture
JPH0258887A (en) * 1988-08-25 1990-02-28 Mitsubishi Plastics Ind Ltd Aluminum based copper-clad lamination board
JPH0441236A (en) * 1990-06-07 1992-02-12 Hitachi Chem Co Ltd Treatment of copper or copper alloy plate and metal base board and metal base wiring board using same metal plate
DE59206797D1 (en) * 1991-04-10 1996-08-29 Dyconex Ag Metal foil with a textured surface
JPH0645715A (en) * 1992-07-22 1994-02-18 Mitsui Toatsu Chem Inc Wiring substrate

Also Published As

Publication number Publication date
WO1998023137A1 (en) 1998-05-28

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