AU5141999A - A system and a method for plating of a conductive pattern - Google Patents
A system and a method for plating of a conductive patternInfo
- Publication number
- AU5141999A AU5141999A AU51419/99A AU5141999A AU5141999A AU 5141999 A AU5141999 A AU 5141999A AU 51419/99 A AU51419/99 A AU 51419/99A AU 5141999 A AU5141999 A AU 5141999A AU 5141999 A AU5141999 A AU 5141999A
- Authority
- AU
- Australia
- Prior art keywords
- plating
- conductive pattern
- conductive
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000000034 method Methods 0.000 title 1
- 238000007747 plating Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
- H01L21/2885—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition using an external electrical current, i.e. electro-deposition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electroplating Methods And Accessories (AREA)
- Electrodes Of Semiconductors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US9397498P | 1998-07-24 | 1998-07-24 | |
US06093974 | 1998-07-24 | ||
PCT/BE1999/000090 WO2000007229A1 (en) | 1998-07-24 | 1999-07-14 | A system and a method for plating of a conductive pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
AU5141999A true AU5141999A (en) | 2000-02-21 |
Family
ID=22242015
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU51419/99A Abandoned AU5141999A (en) | 1998-07-24 | 1999-07-14 | A system and a method for plating of a conductive pattern |
Country Status (4)
Country | Link |
---|---|
EP (1) | EP1114450A1 (en) |
JP (1) | JP2002521575A (en) |
AU (1) | AU5141999A (en) |
WO (1) | WO2000007229A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6782116B2 (en) * | 2016-08-02 | 2020-11-11 | 古河電気工業株式会社 | Silver coating material |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NL6701136A (en) * | 1967-01-25 | 1968-07-26 | ||
DE2830761A1 (en) * | 1978-07-13 | 1980-01-24 | Bosch Gmbh Robert | Thickened anode contact Schottky diode production - involves electroplating by passing current in forward direction through diode to plating anode |
JPS57153431A (en) * | 1981-03-17 | 1982-09-22 | Mitsubishi Electric Corp | Electroplating method for semiconductor wafer |
JPS60128615A (en) * | 1983-12-15 | 1985-07-09 | Sumitomo Electric Ind Ltd | Electrolyte plating method for semiconductor wafer |
KR900008647B1 (en) * | 1986-03-20 | 1990-11-26 | 후지쓰 가부시끼가이샤 | A method for manufacturing three demensional i.c. |
FR2742452B1 (en) * | 1995-12-18 | 1998-01-16 | Commissariat Energie Atomique | SUPPORT FOR ELECTROCHEMICAL DEPOSIT |
-
1999
- 1999-07-14 AU AU51419/99A patent/AU5141999A/en not_active Abandoned
- 1999-07-14 EP EP99936188A patent/EP1114450A1/en not_active Withdrawn
- 1999-07-14 WO PCT/BE1999/000090 patent/WO2000007229A1/en active Application Filing
- 1999-07-14 JP JP2000562941A patent/JP2002521575A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
WO2000007229A1 (en) | 2000-02-10 |
JP2002521575A (en) | 2002-07-16 |
EP1114450A1 (en) | 2001-07-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |