AU4681697A - Component module - Google Patents

Component module

Info

Publication number
AU4681697A
AU4681697A AU46816/97A AU4681697A AU4681697A AU 4681697 A AU4681697 A AU 4681697A AU 46816/97 A AU46816/97 A AU 46816/97A AU 4681697 A AU4681697 A AU 4681697A AU 4681697 A AU4681697 A AU 4681697A
Authority
AU
Australia
Prior art keywords
component module
module
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU46816/97A
Inventor
Mats Hedberg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Telefonaktiebolaget LM Ericsson AB
Original Assignee
Telefonaktiebolaget LM Ericsson AB
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Telefonaktiebolaget LM Ericsson AB filed Critical Telefonaktiebolaget LM Ericsson AB
Publication of AU4681697A publication Critical patent/AU4681697A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/424—Mounting of the optical light guide
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4236—Fixing or mounting methods of the aligned elements
    • G02B6/4245—Mounting of the opto-electronic elements
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4246—Bidirectionally operating package structures
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4274—Electrical aspects
    • G02B6/428—Electrical aspects containing printed circuit boards [PCB]
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4285—Optical modules characterised by a connectorised pigtail
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49838—Geometry or layout
    • G—PHYSICS
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    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4266—Thermal aspects, temperature control or temperature monitoring
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    • G02B6/42—Coupling light guides with opto-electronic elements
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    • G02B6/4286—Optical modules with optical power monitoring
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    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
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    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
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    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
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    • H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Geometry (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Transceivers (AREA)
  • Combinations Of Printed Boards (AREA)
  • Glass Compositions (AREA)
AU46816/97A 1992-07-06 1997-12-01 Component module Abandoned AU4681697A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
SE9202077A SE9202077L (en) 1992-07-06 1992-07-06 component Module
SE9202077 1992-07-06

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
AU45171/93A Division AU4517193A (en) 1992-07-06 1993-06-02 Component module

Publications (1)

Publication Number Publication Date
AU4681697A true AU4681697A (en) 1998-02-05

Family

ID=20386708

Family Applications (2)

Application Number Title Priority Date Filing Date
AU45171/93A Abandoned AU4517193A (en) 1992-07-06 1993-06-02 Component module
AU46816/97A Abandoned AU4681697A (en) 1992-07-06 1997-12-01 Component module

Family Applications Before (1)

Application Number Title Priority Date Filing Date
AU45171/93A Abandoned AU4517193A (en) 1992-07-06 1993-06-02 Component module

Country Status (11)

Country Link
EP (1) EP0649590A1 (en)
JP (1) JPH08501657A (en)
KR (1) KR950702790A (en)
CN (1) CN1041479C (en)
AU (2) AU4517193A (en)
BR (1) BR9306685A (en)
FI (1) FI950058A (en)
MX (1) MXPA93003941A (en)
NO (1) NO950038L (en)
SE (1) SE9202077L (en)
WO (1) WO1994001987A1 (en)

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EP0936485A1 (en) * 1998-02-12 1999-08-18 Alcatel Optoelectronic device
US6381283B1 (en) * 1998-10-07 2002-04-30 Controlnet, Inc. Integrated socket with chip carrier
DE10008340A1 (en) * 2000-02-23 2001-08-30 Siemens Ag Electronic circuit board for electronic devices, in particular communication terminals
EP1369002A2 (en) * 2001-01-17 2003-12-10 Honeywell International Inc. Adaptor for plastic-leaded chip carrier (plcc) and other surface mount technology (smt) chip carriers
US6894903B2 (en) 2001-02-28 2005-05-17 Sumitomo Electric Industries, Ltd. Optical data link
TW529181B (en) * 2001-02-28 2003-04-21 Sumitomo Electric Industries Optical data connector
FR2822246B1 (en) * 2001-03-15 2003-05-16 Opsitech Optical Sys On A Chip METHOD FOR MANUFACTURING AN OPTICAL PACKAGE AND OPTO-ELECTRONIC DEVICE
GB2385664B (en) * 2001-10-19 2004-03-10 Visteon Global Tech Inc LCC-Based strain-gage sensor integrated with cylinder-head gasket
US20040156149A1 (en) * 2002-09-05 2004-08-12 Odd Steijer Method of and apparatus for plastic optical-chip encapsulation
CN101378624B (en) * 2007-08-29 2010-11-10 海华科技股份有限公司 Module structure integrating perimeter circuit and manufacturing method thereof
CN101965104A (en) * 2010-04-20 2011-02-02 力帆实业(集团)股份有限公司 Circuit packaging device
US20130230272A1 (en) * 2012-03-01 2013-09-05 Oracle International Corporation Chip assembly configuration with densely packed optical interconnects
CN103413797B (en) * 2013-07-29 2015-10-14 中国科学院电工研究所 A kind of power semiconductor modular of three-dimensional structure unit assembling
CN103984065B (en) * 2014-05-30 2015-07-15 武汉光迅科技股份有限公司 Optical transmission module
CN106298761A (en) * 2016-09-24 2017-01-04 苏州捷研芯纳米科技有限公司 Photosensor package part, semi-finished product and batch method for packing

Family Cites Families (6)

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US4447857A (en) * 1981-12-09 1984-05-08 International Business Machines Corporation Substrate with multiple type connections
JPS59180514A (en) * 1983-03-31 1984-10-13 Toshiba Corp Light receiving module
US4911519A (en) * 1989-02-01 1990-03-27 At&T Bell Laboratories Packaging techniques for optical transmitters/receivers
JPH02306690A (en) * 1989-05-22 1990-12-20 Toshiba Corp Manufacture of wiring substrate for surface mounting
US5039194A (en) * 1990-01-09 1991-08-13 International Business Machines Corporation Optical fiber link card
US4979787A (en) * 1990-01-12 1990-12-25 Pco, Inc. Optical-electronic interface module

Also Published As

Publication number Publication date
NO950038D0 (en) 1995-01-05
EP0649590A1 (en) 1995-04-26
NO950038L (en) 1995-01-05
SE9202077D0 (en) 1992-07-06
KR950702790A (en) 1995-07-29
AU4517193A (en) 1994-01-31
SE9202077L (en) 1994-01-07
MXPA93003941A (en) 2010-11-12
CN1081297A (en) 1994-01-26
BR9306685A (en) 1998-12-08
JPH08501657A (en) 1996-02-20
WO1994001987A1 (en) 1994-01-20
CN1041479C (en) 1998-12-30
FI950058A0 (en) 1995-01-05
FI950058A (en) 1995-01-05

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Legal Events

Date Code Title Description
MK4 Application lapsed section 142(2)(d) - no continuation fee paid for the application