AU3784299A - Wet processing methods for the manufacture of electronic components - Google Patents

Wet processing methods for the manufacture of electronic components

Info

Publication number
AU3784299A
AU3784299A AU37842/99A AU3784299A AU3784299A AU 3784299 A AU3784299 A AU 3784299A AU 37842/99 A AU37842/99 A AU 37842/99A AU 3784299 A AU3784299 A AU 3784299A AU 3784299 A AU3784299 A AU 3784299A
Authority
AU
Australia
Prior art keywords
manufacture
electronic components
processing methods
wet processing
wet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU37842/99A
Inventor
Christopher F McConnell
Lawrence J. Myland
Steven Verhaverbeke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CFMT Inc
Original Assignee
CFMT Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CFMT Inc filed Critical CFMT Inc
Publication of AU3784299A publication Critical patent/AU3784299A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67075—Apparatus for fluid treatment for etching for wet etching
    • H01L21/6708—Apparatus for fluid treatment for etching for wet etching using mainly spraying means, e.g. nozzles

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
AU37842/99A 1998-05-04 1999-05-04 Wet processing methods for the manufacture of electronic components Abandoned AU3784299A (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US8409798P 1998-05-04 1998-05-04
US09304587 1998-05-04
US60084097 1998-05-04
US30458799A 1999-05-04 1999-05-04
PCT/US1999/009722 WO1999057754A1 (en) 1998-05-04 1999-05-04 Wet processing methods for the manufacture of electronic components

Publications (1)

Publication Number Publication Date
AU3784299A true AU3784299A (en) 1999-11-23

Family

ID=26770609

Family Applications (1)

Application Number Title Priority Date Filing Date
AU37842/99A Abandoned AU3784299A (en) 1998-05-04 1999-05-04 Wet processing methods for the manufacture of electronic components

Country Status (2)

Country Link
AU (1) AU3784299A (en)
WO (1) WO1999057754A1 (en)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4633893A (en) * 1984-05-21 1987-01-06 Cfm Technologies Limited Partnership Apparatus for treating semiconductor wafers
JPS6377569A (en) * 1986-09-19 1988-04-07 Dainippon Screen Mfg Co Ltd Rotary type surface treatment device for substrate
US4906328A (en) * 1987-07-16 1990-03-06 Texas Instruments Incorporated Method for wafer treating
US5868854A (en) * 1989-02-27 1999-02-09 Hitachi, Ltd. Method and apparatus for processing samples
US5090432A (en) * 1990-10-16 1992-02-25 Verteq, Inc. Single wafer megasonic semiconductor wafer processing system
US5227001A (en) * 1990-10-19 1993-07-13 Integrated Process Equipment Corporation Integrated dry-wet semiconductor layer removal apparatus and method
US5318632A (en) * 1992-05-25 1994-06-07 Kawasaki Steel Corporation Wafer process tube apparatus and method for vertical furnaces
EP0722540B1 (en) * 1993-10-04 1998-12-23 Research International, Inc. Micromachined fluid flow regulators
US5745946A (en) * 1994-07-15 1998-05-05 Ontrak Systems, Inc. Substrate processing system

Also Published As

Publication number Publication date
WO1999057754A1 (en) 1999-11-11

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase