AU3641993A - Treatment chamber - Google Patents
Treatment chamberInfo
- Publication number
- AU3641993A AU3641993A AU36419/93A AU3641993A AU3641993A AU 3641993 A AU3641993 A AU 3641993A AU 36419/93 A AU36419/93 A AU 36419/93A AU 3641993 A AU3641993 A AU 3641993A AU 3641993 A AU3641993 A AU 3641993A
- Authority
- AU
- Australia
- Prior art keywords
- treatment chamber
- chamber
- treatment
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67103—Apparatus for thermal treatment mainly by conduction
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- General Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB9206442 | 1992-03-25 | ||
GB929206442A GB9206442D0 (en) | 1992-03-25 | 1992-03-25 | Treatment chamber |
Publications (1)
Publication Number | Publication Date |
---|---|
AU3641993A true AU3641993A (en) | 1993-10-21 |
Family
ID=10712771
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU36419/93A Abandoned AU3641993A (en) | 1992-03-25 | 1993-03-05 | Treatment chamber |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0586651A1 (en) |
JP (1) | JPH06508661A (en) |
AU (1) | AU3641993A (en) |
GB (1) | GB9206442D0 (en) |
WO (1) | WO1993019222A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8889565B2 (en) | 2009-02-13 | 2014-11-18 | Asm International N.V. | Selective removal of oxygen from metal-containing materials |
US9127340B2 (en) | 2009-02-13 | 2015-09-08 | Asm International N.V. | Selective oxidation process |
US7829457B2 (en) | 2009-02-20 | 2010-11-09 | Asm International N.V. | Protection of conductors from oxidation in deposition chambers |
US8507388B2 (en) | 2010-04-26 | 2013-08-13 | Asm International N.V. | Prevention of oxidation of substrate surfaces in process chambers |
US11390950B2 (en) * | 2017-01-10 | 2022-07-19 | Asm Ip Holding B.V. | Reactor system and method to reduce residue buildup during a film deposition process |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61275192A (en) * | 1985-05-31 | 1986-12-05 | Furukawa Electric Co Ltd:The | Vapor-phase growing method for semiconductor thin film |
JPS63227011A (en) * | 1987-03-17 | 1988-09-21 | Fujitsu Ltd | Chemical vapor deposition system |
US5002011A (en) * | 1987-04-14 | 1991-03-26 | Kabushiki Kaisha Toshiba | Vapor deposition apparatus |
US5108792A (en) * | 1990-03-09 | 1992-04-28 | Applied Materials, Inc. | Double-dome reactor for semiconductor processing |
-
1992
- 1992-03-25 GB GB929206442A patent/GB9206442D0/en active Pending
-
1993
- 1993-03-05 JP JP5516341A patent/JPH06508661A/en active Pending
- 1993-03-05 AU AU36419/93A patent/AU3641993A/en not_active Abandoned
- 1993-03-05 WO PCT/GB1993/000461 patent/WO1993019222A1/en not_active Application Discontinuation
- 1993-03-05 EP EP19930905518 patent/EP0586651A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
GB9206442D0 (en) | 1992-05-06 |
WO1993019222A1 (en) | 1993-09-30 |
EP0586651A1 (en) | 1994-03-16 |
JPH06508661A (en) | 1994-09-29 |
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