AU3089697A - Method and device for producing wire-written printed circuit boards - Google Patents

Method and device for producing wire-written printed circuit boards

Info

Publication number
AU3089697A
AU3089697A AU30896/97A AU3089697A AU3089697A AU 3089697 A AU3089697 A AU 3089697A AU 30896/97 A AU30896/97 A AU 30896/97A AU 3089697 A AU3089697 A AU 3089697A AU 3089697 A AU3089697 A AU 3089697A
Authority
AU
Australia
Prior art keywords
printed circuit
insulating compound
filled
layer
contact elements
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU30896/97A
Inventor
Jurgen Gottlieb
Markus Wolfel
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Publication of AU3089697A publication Critical patent/AU3089697A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/06—Arrangements of circuit components or wiring on supporting structure on insulating boards, e.g. wiring harnesses
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Monitoring And Testing Of Exchanges (AREA)
  • Coating With Molten Metal (AREA)

Abstract

The invention relates to a printed circuit board (1) which is wire-written inside. The inventive printed circuit board is characterised in terms of how it is produced in that after a mould has been partially filled with a curable insulating compound, electrically conductive contact elements (2, 3) are positioned and said insulating compound is then cured. The corresponding contact elements are then wired inside the board on this layer. The casting mould is subsequently further filled with curable insulating compound as far as the top of the printed circuit board, in line with the first layer (4), and the upper and lower faces are surface-ground. Other wiring levels (5, 6) filled with insulating compound can be added. Prefabricated boards which are already filled with insulating material (7) and have recesses for the contact elements can also be provided. Adhesive coatings can be used so that the wires (8) are easier to fix on the layer (s). This method can also be used to produce three-dimensional, non-planar printed circuit boards.
AU30896/97A 1997-06-02 1997-06-02 Method and device for producing wire-written printed circuit boards Abandoned AU3089697A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/DE1997/001099 WO1998056216A1 (en) 1997-06-02 1997-06-02 Method and device for producing wire-written printed circuit boards

Publications (1)

Publication Number Publication Date
AU3089697A true AU3089697A (en) 1998-12-21

Family

ID=6918496

Family Applications (1)

Application Number Title Priority Date Filing Date
AU30896/97A Abandoned AU3089697A (en) 1997-06-02 1997-06-02 Method and device for producing wire-written printed circuit boards

Country Status (6)

Country Link
EP (1) EP1004226B1 (en)
JP (1) JP2002501677A (en)
AT (1) ATE217473T1 (en)
AU (1) AU3089697A (en)
DE (2) DE19781878D2 (en)
WO (1) WO1998056216A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102006004320A1 (en) * 2006-01-31 2007-08-09 Häusermann GmbH Printed circuit board with functional elements and selectively filled and thermally conductive through-holes as well as manufacturing process and application
DE102006037093B3 (en) * 2006-08-07 2008-03-13 Reinhard Ulrich Joining method and apparatus for laying thin wire
DE102006053697A1 (en) * 2006-11-13 2008-05-29 Häusermann GmbH Circuit board with additive and integrated and ultrasonically contacted copper elements and method of manufacture and application
DE102007016672B4 (en) 2007-04-04 2016-11-03 Conti Temic Microelectronic Gmbh Measuring device for determining electromagnetic radiofrequent radiation of a cable harness
DE102007037165A1 (en) 2007-08-07 2009-02-12 Mühlbauer Ag Wire installing method for smart card, involves providing connection of thin conducting wire and substrate surface, and fixing up wire for hardening connecting material by utilizing electrostatic pressing force on substrate
DE102012223077A1 (en) 2012-12-13 2014-06-18 Robert Bosch Gmbh Contact arrangement for a multilayer circuit carrier
CN113049854A (en) * 2021-03-04 2021-06-29 内蒙古电力(集团)有限责任公司内蒙古电力科学研究院分公司 Multi-purpose high-voltage test fastener connecting piece

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES511684A0 (en) * 1981-04-27 1983-08-01 Fairchild Camera Instr Co "A SET OF WELDING ELECTRODES, AND CORRESPONDING INSTALLATION AND PROCEDURE".
US4450623A (en) * 1981-12-18 1984-05-29 Kollmorgen Technologies Corporation Process for the manufacture of circuit boards
US5156557A (en) * 1990-11-06 1992-10-20 Yazaki Corporation Electrical interconnection assembly, process of and apparatus for manufacturing the same and wire laying jig therefor
DE4431254A1 (en) * 1994-09-02 1996-03-07 Broekelmann Jaeger & Busse Method and device for wiring connection points of components of electrical devices

Also Published As

Publication number Publication date
DE19781878D2 (en) 1999-07-01
ATE217473T1 (en) 2002-05-15
EP1004226B1 (en) 2002-05-08
DE59707245D1 (en) 2002-06-13
EP1004226A1 (en) 2000-05-31
WO1998056216A1 (en) 1998-12-10
JP2002501677A (en) 2002-01-15

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase