AU3084600A - Luminescent diode device - Google Patents
Luminescent diode deviceInfo
- Publication number
- AU3084600A AU3084600A AU30846/00A AU3084600A AU3084600A AU 3084600 A AU3084600 A AU 3084600A AU 30846/00 A AU30846/00 A AU 30846/00A AU 3084600 A AU3084600 A AU 3084600A AU 3084600 A AU3084600 A AU 3084600A
- Authority
- AU
- Australia
- Prior art keywords
- diode device
- luminescent diode
- luminescent
- diode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/RU1999/000387 WO2001029904A1 (en) | 1999-10-18 | 1999-10-18 | Luminescent diode device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU3084600A true AU3084600A (en) | 2001-04-30 |
Family
ID=20130405
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU30846/00A Abandoned AU3084600A (en) | 1999-10-18 | 1999-10-18 | Luminescent diode device |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2003512727A (en) |
AU (1) | AU3084600A (en) |
WO (1) | WO2001029904A1 (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7347603B2 (en) | 2002-11-05 | 2008-03-25 | Matsushita Electric Industrial Co., Ltd. | Light-emitting diode |
JP2004265977A (en) * | 2003-02-28 | 2004-09-24 | Noritsu Koki Co Ltd | Light emitting diode light source unit |
US6856717B2 (en) | 2003-03-24 | 2005-02-15 | Hymite A/S | Package with a light emitting device |
US6995402B2 (en) * | 2003-10-03 | 2006-02-07 | Lumileds Lighting, U.S., Llc | Integrated reflector cup for a light emitting device mount |
CN202056570U (en) * | 2011-01-20 | 2011-11-30 | 木林森股份有限公司 | Surface-mounted LED (light-emitting diode) with lens |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3981023A (en) * | 1974-09-16 | 1976-09-14 | Northern Electric Company Limited | Integral lens light emitting diode |
JPS6037260U (en) * | 1983-08-22 | 1985-03-14 | 舶用電球株式会社 | Light emitting part of light emitting diode lamp |
DE58909888C5 (en) * | 1989-05-31 | 2017-03-02 | Osram Gesellschaft mit beschränkter Haftung | A method of manufacturing a surface mount opto-device and surface mount opto-device |
JPH07211943A (en) * | 1994-01-25 | 1995-08-11 | Nikon Corp | Light source device |
RU2114492C1 (en) * | 1996-03-19 | 1998-06-27 | Владимир Семенович Абрамов | Light-emitting diode |
JPH10284757A (en) * | 1997-04-04 | 1998-10-23 | Toyoda Gosei Co Ltd | Light-emitting diode device |
RU2133068C1 (en) * | 1997-07-30 | 1999-07-10 | Абрамов Владимир Семенович | Light-emitting diode unit |
RU2134000C1 (en) * | 1997-12-31 | 1999-07-27 | Абрамов Владимир Семенович | Light-emitting diode unit |
RU2137978C1 (en) * | 1998-03-26 | 1999-09-20 | Открытое акционерное общество "ЛОМО" | Lighting fixture with asymmetric distribution of light flux relative to optical axis |
-
1999
- 1999-10-18 AU AU30846/00A patent/AU3084600A/en not_active Abandoned
- 1999-10-18 WO PCT/RU1999/000387 patent/WO2001029904A1/en active Application Filing
- 1999-10-18 JP JP2001531151A patent/JP2003512727A/en active Pending
Also Published As
Publication number | Publication date |
---|---|
JP2003512727A (en) | 2003-04-02 |
WO2001029904A1 (en) | 2001-04-26 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase | ||
TH | Corrigenda |
Free format text: IN VOL 15, NO 32, PAGE(S) 6822-6826 UNDER THE HEADING APPLICATIONS LAPSED, REFUSED OR WITHDRAWN PLEASE DELETE ALL REFERENCE TO APPLICATION NO. 30846/00, 30847/00, 30848/00, 72743/00 AND 78006/00 |
|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |