AU2662097A - Curing liquid resin encapsulants of microelectronics components with microwave energy - Google Patents

Curing liquid resin encapsulants of microelectronics components with microwave energy

Info

Publication number
AU2662097A
AU2662097A AU26620/97A AU2662097A AU2662097A AU 2662097 A AU2662097 A AU 2662097A AU 26620/97 A AU26620/97 A AU 26620/97A AU 2662097 A AU2662097 A AU 2662097A AU 2662097 A AU2662097 A AU 2662097A
Authority
AU
Australia
Prior art keywords
microwave energy
liquid resin
curing liquid
microelectronics components
resin encapsulants
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU26620/97A
Inventor
Zakaryae Fathi
Richard S. Garard
Denise A. Tucker
Jianghua Wei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lambda Technologies Inc
Original Assignee
Lambda Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lambda Technologies Inc filed Critical Lambda Technologies Inc
Publication of AU2662097A publication Critical patent/AU2662097A/en
Abandoned legal-status Critical Current

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    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
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    • H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01043—Technetium [Tc]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01047—Silver [Ag]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01065—Terbium [Tb]
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    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01084—Polonium [Po]
    • H—ELECTRICITY
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
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    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Wire Bonding (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
AU26620/97A 1996-04-08 1997-04-04 Curing liquid resin encapsulants of microelectronics components with microwave energy Abandoned AU2662097A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US1500296P 1996-04-08 1996-04-08
US60015002 1996-04-08
PCT/US1997/005828 WO1997038441A1 (en) 1996-04-08 1997-04-04 Curing liquid resin encapsulants of microelectronics components with microwave energy

Publications (1)

Publication Number Publication Date
AU2662097A true AU2662097A (en) 1997-10-29

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WO (1) WO1997038441A1 (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5738915A (en) * 1996-09-19 1998-04-14 Lambda Technologies, Inc. Curing polymer layers on semiconductor substrates using variable frequency microwave energy
DE102007041229A1 (en) * 2007-08-31 2009-03-05 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Circuit arrangement and a method for encapsulating the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2916929A1 (en) * 1979-04-26 1980-11-06 Bosch Gmbh Robert METHOD FOR CURING REACTION RESIN
US5313365A (en) * 1992-06-30 1994-05-17 Motorola, Inc. Encapsulated electronic package
KR100280762B1 (en) * 1992-11-03 2001-03-02 비센트 비.인그라시아 Thermally Reinforced Semiconductor Devices Having Exposed Backsides and Methods of Manufacturing the Same
US5314983A (en) * 1992-11-09 1994-05-24 Enichem S.P.A. Process for curing polymerizable liquid compositions based on polyisocyanates and epoxides
US5644837A (en) * 1995-06-30 1997-07-08 Lambda Technologies, Inc. Process for assembling electronics using microwave irradiation

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WO1997038441A1 (en) 1997-10-16

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