AU2546499A - Ic card and its frame - Google Patents
Ic card and its frameInfo
- Publication number
- AU2546499A AU2546499A AU25464/99A AU2546499A AU2546499A AU 2546499 A AU2546499 A AU 2546499A AU 25464/99 A AU25464/99 A AU 25464/99A AU 2546499 A AU2546499 A AU 2546499A AU 2546499 A AU2546499 A AU 2546499A
- Authority
- AU
- Australia
- Prior art keywords
- flat coil
- semiconductor device
- card
- conductor
- terminals
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
- H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01046—Palladium [Pd]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Credit Cards Or The Like (AREA)
- Electrochromic Elements, Electrophoresis, Or Variable Reflection Or Absorption Elements (AREA)
Abstract
An IC card suited to low-cost mass production, comprising a flat coil formed on a press or by etching. The flat coil (10), formed on press, includes a plurality of turns of a conductor (11) wound in substantially the same plane, and its ends (10a and 10b) are connected electrically with terminals (12a and 12b) of a semiconductor device (12). One end (10a) of the flat coil (10) is located outside, while the other end (10b) is inside. The semiconductor device (12) is opposed on its front or rear side to the conductor (11) of the flat coil (10). The terminals (12a and 12b) of the semiconductor device (12) are located adjacent to, and connected electrically with, the outside and inside ends (10a and 10b) of the flat coil (10), respectively. <IMAGE>
Applications Claiming Priority (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3162498A JP3542266B2 (en) | 1998-02-13 | 1998-02-13 | IC card and frame |
JP10-31624 | 1998-02-13 | ||
JP10-60916 | 1998-03-12 | ||
JP6091698 | 1998-03-12 | ||
JP10-252920 | 1998-09-07 | ||
JP25292098A JP3542281B2 (en) | 1998-03-12 | 1998-09-07 | IC card and IC card frame |
PCT/JP1999/000581 WO1999041699A1 (en) | 1998-02-13 | 1999-02-10 | Ic card and its frame |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2546499A true AU2546499A (en) | 1999-08-30 |
Family
ID=27287385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU25464/99A Abandoned AU2546499A (en) | 1998-02-13 | 1999-02-10 | Ic card and its frame |
Country Status (10)
Country | Link |
---|---|
US (2) | US6252777B1 (en) |
EP (1) | EP0996082B1 (en) |
KR (1) | KR100594829B1 (en) |
CN (1) | CN1217396C (en) |
AT (1) | ATE307363T1 (en) |
AU (1) | AU2546499A (en) |
DE (1) | DE69927765T2 (en) |
HK (1) | HK1028660A1 (en) |
NO (1) | NO994964D0 (en) |
WO (1) | WO1999041699A1 (en) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3484356B2 (en) * | 1998-09-28 | 2004-01-06 | 新光電気工業株式会社 | IC card, antenna for IC card, and antenna frame for IC card |
JP2001188891A (en) * | 2000-01-05 | 2001-07-10 | Shinko Electric Ind Co Ltd | Non-contact type ic card |
JP3809056B2 (en) * | 2000-09-14 | 2006-08-16 | 新光電気工業株式会社 | IC card |
JP2002319011A (en) * | 2001-01-31 | 2002-10-31 | Canon Inc | Semiconductor device, method of manufacturing it, and electrophotographic device |
DE10117994A1 (en) * | 2001-04-10 | 2002-10-24 | Orga Kartensysteme Gmbh | Carrier foil for electronic components to be laminated into smart cards, includes inter-joined part surfaces of connection zones made of conductive material |
DE10122416A1 (en) | 2001-05-09 | 2002-11-14 | Giesecke & Devrient Gmbh | Method and semi-finished product for producing a chip card with a coil |
JP4789348B2 (en) * | 2001-05-31 | 2011-10-12 | リンテック株式会社 | Planar coil component, method for adjusting characteristic of planar coil component, ID tag, and method for adjusting resonance frequency of ID tag |
WO2003007232A1 (en) * | 2001-07-12 | 2003-01-23 | Sokymat S.A. | Lead frame antenna |
JP4114446B2 (en) * | 2002-09-13 | 2008-07-09 | ソニー株式会社 | ANTENNA DEVICE, READ / WRITE DEVICE USING THE SAME, INFORMATION PROCESSING DEVICE, COMMUNICATION METHOD, AND ANTENNA DEVICE MANUFACTURING METHOD |
JP4141857B2 (en) * | 2003-02-18 | 2008-08-27 | 日立マクセル株式会社 | Semiconductor device |
JP4350093B2 (en) * | 2003-08-05 | 2009-10-21 | リンテック株式会社 | Flip chip mounting board |
TWI457835B (en) * | 2004-02-04 | 2014-10-21 | Semiconductor Energy Lab | An article carrying a thin flim integrated circuit |
US7061769B1 (en) * | 2005-03-11 | 2006-06-13 | Jung-Che Chang | USB/OTG-interface storage card |
KR100956683B1 (en) * | 2007-09-20 | 2010-05-10 | 삼성전기주식회사 | Method for connecting electrode of hydrogen generating apparatus and hydrogen generating apparatus using the same |
JP5248224B2 (en) * | 2008-07-09 | 2013-07-31 | リンテック株式会社 | Electronic circuit and IC tag |
CN113921238A (en) * | 2018-01-12 | 2022-01-11 | 乾坤科技股份有限公司 | Electronic device and manufacturing method thereof |
CN109192470A (en) * | 2018-08-27 | 2019-01-11 | 昆山联滔电子有限公司 | A kind of coil device |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62104128A (en) * | 1985-10-31 | 1987-05-14 | Toshiba Corp | Position detector |
JPS63104128A (en) | 1986-10-21 | 1988-05-09 | Nec Corp | Storing system for screen format of terminal equipment |
JPH06310324A (en) | 1993-04-21 | 1994-11-04 | Nippon Mektron Ltd | Plane coil |
FR2716281B1 (en) * | 1994-02-14 | 1996-05-03 | Gemplus Card Int | Method of manufacturing a contactless card. |
DE4431606A1 (en) * | 1994-09-05 | 1996-03-07 | Siemens Ag | Chip card module with copper coil on a carrier |
DE4437721A1 (en) * | 1994-10-21 | 1996-04-25 | Giesecke & Devrient Gmbh | Contactless electronic module |
DE4446369A1 (en) * | 1994-12-23 | 1996-06-27 | Giesecke & Devrient Gmbh | Data carrier with an electronic module |
US5671525A (en) * | 1995-02-13 | 1997-09-30 | Gemplus Card International | Method of manufacturing a hybrid chip card |
JP2814477B2 (en) * | 1995-04-13 | 1998-10-22 | ソニーケミカル株式会社 | Non-contact IC card and method of manufacturing the same |
DE19527359A1 (en) * | 1995-07-26 | 1997-02-13 | Giesecke & Devrient Gmbh | Circuit unit and method for manufacturing a circuit unit |
KR19990035991A (en) * | 1995-08-01 | 1999-05-25 | 노버트 토마셰크, 요셉 발크너 | Non-contact action card type data carrier with non-contact action transmission system and components, and production method of such card type data carrier and its module |
EP0868706A1 (en) | 1995-12-22 | 1998-10-07 | Sempac SA | Process for producing a chip card for contactless operation |
DE19710144C2 (en) * | 1997-03-13 | 1999-10-14 | Orga Kartensysteme Gmbh | Method for producing a chip card and chip card produced according to the method |
US6255725B1 (en) * | 1998-05-28 | 2001-07-03 | Shinko Electric Industries Co., Ltd. | IC card and plane coil for IC card |
DE19923807A1 (en) * | 1999-05-19 | 2000-11-23 | Deutsche Telekom Ag | Procedures to increase security with digital signatures |
-
1999
- 1999-02-10 CN CN998001341A patent/CN1217396C/en not_active Expired - Fee Related
- 1999-02-10 AT AT99905190T patent/ATE307363T1/en not_active IP Right Cessation
- 1999-02-10 AU AU25464/99A patent/AU2546499A/en not_active Abandoned
- 1999-02-10 US US09/402,946 patent/US6252777B1/en not_active Expired - Fee Related
- 1999-02-10 WO PCT/JP1999/000581 patent/WO1999041699A1/en active IP Right Grant
- 1999-02-10 EP EP99905190A patent/EP0996082B1/en not_active Expired - Lifetime
- 1999-02-10 DE DE69927765T patent/DE69927765T2/en not_active Expired - Fee Related
- 1999-02-10 KR KR1019997009241A patent/KR100594829B1/en not_active IP Right Cessation
- 1999-10-12 NO NO994964A patent/NO994964D0/en unknown
-
2000
- 2000-12-13 HK HK00107996A patent/HK1028660A1/en not_active IP Right Cessation
-
2001
- 2001-01-25 US US09/768,607 patent/US6452806B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO1999041699A1 (en) | 1999-08-19 |
DE69927765D1 (en) | 2006-03-02 |
KR100594829B1 (en) | 2006-07-03 |
US6452806B2 (en) | 2002-09-17 |
HK1028660A1 (en) | 2001-02-23 |
EP0996082A1 (en) | 2000-04-26 |
NO994964D0 (en) | 1999-10-12 |
EP0996082A4 (en) | 2001-10-31 |
EP0996082B1 (en) | 2005-10-19 |
US6252777B1 (en) | 2001-06-26 |
US20010004136A1 (en) | 2001-06-21 |
ATE307363T1 (en) | 2005-11-15 |
DE69927765T2 (en) | 2006-07-06 |
KR20010006162A (en) | 2001-01-26 |
CN1217396C (en) | 2005-08-31 |
CN1256776A (en) | 2000-06-14 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |