AU2501801A - Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer - Google Patents

Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer

Info

Publication number
AU2501801A
AU2501801A AU25018/01A AU2501801A AU2501801A AU 2501801 A AU2501801 A AU 2501801A AU 25018/01 A AU25018/01 A AU 25018/01A AU 2501801 A AU2501801 A AU 2501801A AU 2501801 A AU2501801 A AU 2501801A
Authority
AU
Australia
Prior art keywords
support layer
printed conductor
conductor support
producing
laminating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU25018/01A
Inventor
Carsten Senge
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Idemia Germany GmbH
Original Assignee
Orga Kartensysteme GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Orga Kartensysteme GmbH filed Critical Orga Kartensysteme GmbH
Publication of AU2501801A publication Critical patent/AU2501801A/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/101—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by casting or moulding of conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1258—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by using a substrate provided with a shape pattern, e.g. grooves, banks, resist pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H05K1/095—Dispersed materials, e.g. conductive pastes or inks for polymer thick films, i.e. having a permanent organic polymeric binder
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09827—Tapered, e.g. tapered hole, via or groove
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/025—Abrading, e.g. grinding or sand blasting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1173—Differences in wettability, e.g. hydrophilic or hydrophobic areas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
AU25018/01A 1999-11-18 2000-11-10 Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer Abandoned AU2501801A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19955538 1999-11-18
DE1999155538 DE19955538B4 (en) 1999-11-18 1999-11-18 Printed conductor carrier layer for lamination into a chip card, method for producing a conductor carrier layer Injection molding tool for carrying out the method for producing a conductor carrier layer
PCT/DE2000/003933 WO2001037622A2 (en) 1999-11-18 2000-11-10 Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer

Publications (1)

Publication Number Publication Date
AU2501801A true AU2501801A (en) 2001-05-30

Family

ID=7929509

Family Applications (1)

Application Number Title Priority Date Filing Date
AU25018/01A Abandoned AU2501801A (en) 1999-11-18 2000-11-10 Printed conductor support layer for laminating into a chip card, method for producing a printed conductor support layer and injection molding tool for carrying out the method for producing a printed conductor support layer

Country Status (3)

Country Link
AU (1) AU2501801A (en)
DE (1) DE19955538B4 (en)
WO (1) WO2001037622A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2820548A1 (en) * 2001-02-02 2002-08-09 Schlumberger Systems & Service PORTABLE CHIP AND ANTENNA OBJECT, MODULE FOR FORMING PORTABLE CHIP AND ANTENNA OBJECT AND METHODS OF MAKING SAME
DE10118487A1 (en) * 2001-04-12 2002-10-17 Demag Ergotech Gmbh Plastic component with electrical functions, e.g. a chip card, contains functional elements, e.g. an antenna, made of electrically conducting plastic
DE10148525B4 (en) * 2001-10-01 2017-06-01 Morpho Cards Gmbh Chip card and a method for producing such a chip card
US7051429B2 (en) * 2003-04-11 2006-05-30 Eastman Kodak Company Method for forming a medium having data storage and communication capabilities
US7370808B2 (en) * 2004-01-12 2008-05-13 Symbol Technologies, Inc. Method and system for manufacturing radio frequency identification tag antennas
DE102004030749A1 (en) * 2004-06-25 2006-01-19 Giesecke & Devrient Gmbh Chip module for a portable data carrier
GB0605239D0 (en) * 2006-03-16 2006-04-26 Uvasol Ltd Improvements in the application of conductive tracks to substrates
DE102007002199A1 (en) * 2007-01-16 2008-06-19 Siemens Ag Method for manufacturing carrier fitted with components, involves applying electrical conducting structure including component connection areas on surface of electrically non-conducting carrier
DE102013007042A1 (en) * 2013-04-24 2014-10-30 Gottfried Wilhelm Leibniz Universität Hannover Printed circuit board and method for producing a printed circuit board
EP2871596A1 (en) * 2013-11-12 2015-05-13 Gemalto SA Interconnected electronic device and method for manufacturing same

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB583285A (en) * 1944-10-13 1946-12-13 Murrayfield Nominees Ltd Improvements in or relating to electrical apparatus, particularly for radio communication
US4080513A (en) * 1975-11-03 1978-03-21 Metropolitan Circuits Incorporated Of California Molded circuit board substrate
US5271887A (en) * 1980-08-04 1993-12-21 Witec Cayman Patents, Ltd. Method of fabricating complex micro-circuit boards, substrates and microcircuits and the substrates and microcircuits
FR2527036A1 (en) * 1982-05-14 1983-11-18 Radiotechnique Compelec METHOD FOR CONNECTING A SEMICONDUCTOR TO ELEMENTS OF A SUPPORT, PARTICULARLY A PORTABLE CARD
US4645733A (en) * 1983-11-10 1987-02-24 Sullivan Donald F High resolution printed circuits formed in photopolymer pattern indentations overlaying printed wiring board substrates
DE3518975A1 (en) * 1985-05-25 1986-11-27 Bayer Ag, 5090 Leverkusen PLASTIC PART
GB2212332A (en) * 1987-11-11 1989-07-19 Gen Electric Co Plc Fabrication of electrical circuits
DE3821121A1 (en) * 1988-06-23 1990-02-08 Ullmann Ulo Werk Method of manufacture of contact carriers
DE3901402A1 (en) * 1989-01-19 1990-07-26 Telefonbau & Normalzeit Gmbh Method for the manufacture of a chip card
US5595771A (en) * 1994-11-04 1997-01-21 Foltuz; Eugene L. Modular mold for injection molding and method of use thereof
DE19601202A1 (en) * 1996-01-15 1997-03-06 Siemens Ag Data carrier card using moulded interconnect device technology
JPH11161760A (en) * 1997-11-26 1999-06-18 Hitachi Ltd Thin electronic circuit component and its manufacture and manufacturing device

Also Published As

Publication number Publication date
DE19955538B4 (en) 2014-06-05
WO2001037622A2 (en) 2001-05-25
DE19955538A1 (en) 2003-08-28
WO2001037622A3 (en) 2002-05-23

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase