AU2020102558A4 - A laser processing method and device with infinite field - Google Patents
A laser processing method and device with infinite field Download PDFInfo
- Publication number
- AU2020102558A4 AU2020102558A4 AU2020102558A AU2020102558A AU2020102558A4 AU 2020102558 A4 AU2020102558 A4 AU 2020102558A4 AU 2020102558 A AU2020102558 A AU 2020102558A AU 2020102558 A AU2020102558 A AU 2020102558A AU 2020102558 A4 AU2020102558 A4 AU 2020102558A4
- Authority
- AU
- Australia
- Prior art keywords
- processed
- coordinates
- line segment
- processing
- scanning galvanometer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
- H01S3/101—Lasers provided with means to change the location from which, or the direction in which, laser radiation is emitted
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Electromagnetism (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a laser processing method and device with infinite field. The procesing
process comprises the following steps: fixing a workpiece to be processed on a servo platform,
controlling the servo platform to movably collect and identify a positioning point on the
workpiece, and determining initial coordinates of a starting point and an end point of each line
segment to be processed on the workpiece in the kinetic coordinate system according to the
positioning point; determining lengths and directions of all line segments to be processed and
initial processing points according to the initial coordinates, and determining processing
sequences of all line segments and movement tracks of the servo platform and a scanning
vibrating mirror; and realizing the processing of the workpiece to be processed according to
the determined processing sequences and the movement track control servo platform as well
as the synergy movement of scanning galvanometer. The laser processing device has the
advantages of simple in structure and convenient to use, which is suitable for continuous laser
processing of large field workpieces, and greatly improves the laser processing efficiency; and
the servo platform and the scanning galvanometer are adopted to move synchronously, which
has the advantages of precision, infinite format and high speed
Figures
6
1
FIGURE 1
Description
Figures
6
1 FIGURE 1
A laser processing method and device with infinite field
The invention relates to a laser processing method and a device, which belongs to the technical field of laser processing, and particularly relates to an a laser processing method and device with infinite field.
The laser processing system can be classified into fixed light type and moving light type according to whether the laser moves or not. The processing principle of the fixed light type laser cutting system is: the optical path is fixed in the working process and the workpiece is processed by the relative movement between the servo platform and the laser head, and the conventional lamp pumped Nd: YAG fixed light type laser cutting system is a typical representative. The processing method of fixed light laser cutting system has the advantages of small error, simple principle, low cost and high precision, which is suitable for small batch and scattered processing as well as occasions with low requirements on speed and efficiency; and the disadvantage of the fixed light laser cutting system is due to the slow movement speed of the servo platform. The fastest speed of the servo platform is 200 mm/s, which can not be overcome because of the defect of the system.
The processing principle of the moving light type laser cutting system is to realize the 2D high speed scanning of the laser by two galvanometers controlled by a computer so as to complete the high-speed cutting processing. The scanning speed of the galvanometer is much faster than the movement speed of the worktable, which generally can reach more than 1,000 mm/s. The moving light type laser cutting system has the advantages of high precision, fast processing speed, and capability of processing small holes and micropores; and the moving light type laser cutting system has the disadvantage of small single processing field of the vibrating mirror.
Because the processing efficiency of the moving light type laser cutting is much higher than that of the fixed light type laser cutting, the general objects to be processed are all processed by adoption of moving light type laser cutting. When the moving light laser cutting processing is adopted, the object to be processed must be divided into grid blocks. Each grid block is used as a unit to complete the cutting process through galvanometer scanning, and then the object to be processed is moved to the next block. The processing is carried out block by block in sequence so as to complete the cutting processing of the whole part. For example, a high-precision splicing method between grids of a laser cutting flexible printed circuit board disclosed in the Chinese invention patent CN101480759B, the method is not suitable for continuously processing of large field objects although the efficiency is improved.
The objective of the invention is to solve the shortcomings in the aforesaid background technology,
and provide an infinite field laser processing method and a laser processing device, which have a
simple structure and are particularly suitable for rapid and precise seamless cutting of a large-size
flexible printed circuit board.
The technical scheme adopted by the invention is as follows: a laser processing method with infinite
field that comprises the following steps:
Step 1, defining a servo platform coordinate system as a kinetic coordinate system and scanning
galvanometer coordinate system as a static coordinate system, fixing a workpiece to be processed
on the servo platform, and controlling the servo platform to movably collect and identify initial
coordinates of a starting point and an end point of each line segment to be processed on the whole
workpiece in the kinetic coordinate system;
Step 2, determining the lengths and directions of all line segments to be processed and initial
processing points according to the initial coordinates obtained in the step 1;
Step 3, respectively determining the processing sequence of all the line segments and the movement
tracks of the servo platform and the scanning galvanometer according to the data determined in the
step 1 and the step 2;
And step 4, realizing the processing of the workpiece to be processed according to the determined
processing sequence and the movement track as well as scanning galvanometer synergy movement.
Further, determining the processing sequence of all the line segments to be processed comprises the
following steps:
1). respectively calculating the time of jumping from the end point of the last line segment to the
starting point of all unprocessed line segments according to the initial coordinates of the end point
of the last completed processing line segment;
2). comparing the calculating all the time, and taking the line segment where the starting point with
the minimum time is located as the next line segment to be processed;
3). repeating the step 1) and the step 2) on the basis of the end point of the next line segment to be
processed until the processing sequence of all the line segments to be processed is determined.
Further, adopting the time ti, ti=max (ti, t2) jumping from the end point of the previous line segment
to the starting point of the remaining ith unprocessed line segment by adoption of the following
formula,
Where,
When L x > 0, if L x < a-xo, then
If Lx> a-x o, then
When L x <0, if |L x 1< xo, then
If lL x 1> xo, then
When Ly > 0, if L y < b-yo, then
If Ly> b-y o, then
When L y <0, if |L yl< yo, then
If|Lyl> yo, then
Coordinates Po (Uo ,Vo) are the initial coordinates of the end point of the last processed line segment in the kinetic coordinate system, and coordinates Po (Ui ,Vi) are the initial coordinates of the starting point of the remaining ith unprocessed line segment, the coordinates Zo (xo, yo) are the actual coordinates of the end point of the last processed line segment in the static coordinate system, and t 1 and t2 are the time of jumping from the end point of the last line segment to horizontal and vertical direction of starting point of the remaining ith unprocessed line segment; a and b are the length and width of the scanning galvanometer processing range respectively, Vzx and Vzy are the moving speed of the scanning galvanometer in the x and y directions, Vpx and Vpy are the moving speeds of the servo platform in the x and y directions respectively, and i takes the values of 1, 2...n, and n is the number of remaining unprocessed line segments.
Further, the movement track of the servo platform is determined to be: the track formed by means of the servo platform moving in turn along the processing sequence of all the line segments to be processed at the set speed, of which the track on each line segment to be processed is a track formed by a straight line segment between the starting and end points.
Further, the actual coordinates P'i(U'i, V'i) of the starting point of each line segment to be processed are determined by the following formula
If Lx > 0 and Lx <a-x o, then AU x =Vpx t i
If Lx > 0 and L x > a-xo, then
If L<x<O and |L < xl<=xo, then AUx=-V px t i,
If L x <0 and Lxl> xo, then
If L y>0 and Ly 5b-yo, then AUy =Vpy t 2,
If L y>0 and Ly> b-yo, then
If Ly <0 and |Lyl< yo, then AUy =-Vpy t 2,
If L y<O and Lyl> yo, then
Wherein the coordinates Po (Uo,Vo) are the initial coordinates of the end point of the last processed line segment in the kinetic coordinate system, and coordinates Pi (Ui,Vi) are the initial coordinates of the starting point of the remaining ith unprocessed line segment in the kinetic coordinate system, the coordinates P'o (U'o,V'o ) are the actual coordinates of the end point of the last processed line segment in the static coordinate system, . the coordinates ZO (xo, Vo) are the actual coordinates of the end point of the last processing line in the static coordinate system, Vzx and Vzy are the moving speed of scanning galvanometer in X and Y directions respectively, Vpx and Vpy are the moving speed of servo platform in X and Y direction, and a and b are the length and width of scanning galvanometer processing range.
Further, the actual coordinate of the end point of each line segment to be processed is determined by the actual coordinate of the starting point of the line segment to be processed, the length and the direction of the line segment to be processed, and the moving length of the scanning galvanometer.
5. Further, the movement track of the scanning galvanometer is determined as follows: the track formed by the scanning galvanometer moving in turn along the processing sequence of all the line segments to be processed at a set speed, and the track formed by straight line between the starting point and end point on each line segment to be processed.
Further, the actual coordinate Zi(xi, yi) of the starting point of each line segment to be processed is determined by the following formula
If Lx >0 and L x <a-xo, then xi =xo +Vzxti,
If Lx > 0 and Lx> a-xo, then xi=a;
If Lx< and |Lx 1< xo, thenxi=xo-Vzxti,
If L x <0 and Lxl> xo, then xi=O;
If L y >0 and Ly <b-yo, then yi =yo +Vzyt2,
If L y>0 and Ly> b-yo, then yi=b;
If L y<0 and Lyls yo, then yi=yo -Vzyt2,
If L y <0 and |Lyl>yo, then yi=O;
Wherein the coordinates Po (Uo,Vo) are the initial coordinates of the end point of the last processed line segment in the kinetic coordinate system, and coordinates Pi (Ui,V1 ) are the initial coordinates of the starting point of the line segment to be processed in the kinetic coordinate system, the coordinates Zo (xo, Vo) are the actual coordinates of the end point of the last processing line in the static coordinate system, Vzx and Vzy are the moving speed of scanning galvanometer in X and Y directions respectively, Vpx and Vpy are the moving speed of servo platform in X and Y direction, and a and b are the length and width of scanning galvanometer processing range.
Further, the actual coordinate Z 2 (x2, y2) of the nd point of each line segment to be processed is determined by the following formula
If Lx>O and Lx <a-xi, then X2 --xi +Vzxti,
If L x > 0 and Lx > a-xi, then x 2=a;
If Lx<O and |Lx |<=xi, then X2 = xi -Vzxti,
If Lx<O and Lxl> xi, thenx2=0;
If L y>0 and Ly b-yi, then y2- yi -Vzyt2,
If L y> 0 and L y > b-yi, theny2=b;
If L y<0 and Lyls yi, theny2 -yi -Vzyt2,
If L y<0 and Lyl> yi, then y2=0;
Wherein the coordinates Pi(Vi, Vi) are the initial coordinate of the starting point of the line segment to be processed in the kinetic coordinate system, the coordinate P 2 (V 2 , V 2 ) is the initial coordinate of the end point of the line segment to be processed in the kinetic coordinate system, the coordinate Zi(xi, yi) is the actual coordinate of the starting point of the line segment to be processed in the static coordinate system, Vzx and Vzy are respectively the moving speeds of the scanning galvanometer in the x and y directions, Vpx and Vpy are respectively the moving speeds of the servo platform in the x and y directions, and a and b are respectively the length and width of the processing range of the scanning galvanometer.
Further, the method of determining the starting processing point comprises the following steps:
comparing the horizontal and vertical coordinates in each initial coordinate value, selecting a
coordinate point with the smallest horizontal coordinate in the initial coordinate value, taking the
coordinate point with the largest vertical coordinate corresponding to the selected coordinate point
as the initial processing point, and taking a line segment where the initial processing point is located
as the first processing line segment.
A laser processing method with infinite field comprises a moving light type laser cutting device,
wherein the moving light type laser cutting device comprises a laser and a scanning galvanometer,
and comprises,
The image acquisition and recognition system, which is used for acquiring and recognizing the
positioning points on the whole workpiece according to the acquisition control instruction and
sending the positioning points to the control system;
The control system is used for sending the acquisition control instruction to the image acquisition
and recognition system, determining initial coordinates of a starting point and an end point of each
line segment to be processed on the workpiece in a kinetic coordinate system according to the
received positioning points, determining the processing sequence of all the line segments to be
processed and the motion tracks of the servo platform and the scanning galvanometer according to
the initial coordinates, and sending the movement instruction to the servo platform and the scanning
galvanometer respectively;
The servo platform is used for moving along the determined movement track according to the
movement control instruction;
Wherein the scanning galvanometer moves along the determined motion track according to the
movement control instruction.
The laser processing device with infinite field has the advantages of simple in structure and
convenient to use, which is suitable for continuous laser processing of large field workpieces, and
greatly improves the laser processing efficiency; and the servo platform and the scanning
galvanometer are adopted to move synchronously, that is, the cutting point is controlled by the
movement of galvanometer and processing platform simultaneously when being processed, which has the advantages of two methods: precision, infinite field and high speed. When the object to be processed is far larger than the scanning range of the galvanometer, the servo platform and the galvanometer simultaneously move to realize the strengthening mode of combining the movement of the workpiece with the movement of the laser beam, thereby meeting the requirement of laser processing of large-size even infinite field workpieces.
Figure 1 Schematic structural diagram of the invention.
In the figure: 1-a moving light type laser cutting device, 2-a laser, 3-a scanning galvanometer, 4-an image acquisition and recognition system, 5-a control system and 6-a servo platform.
The invention will be described in detail further with reference to the attached drawings and description of embodiments thereof, which do not constitute a limitation of the invention.
As shown in figure 1, a laser processing method and device with infinite field comprises a moving light type laser cutting device, wherein the moving light type laser cutting device comprises a laser and a scanning galvanometer, and comprises
the image acquisition and recognition system 4, which is used for acquiring and recognizing the positioning points on the whole workpiece according to the acquisition control instruction and sending the positioning points to the control system;
The control system 5 is used for sending the acquisition control instruction to the image acquisition and recognition system, determining initial coordinates of a starting point and an end point of each line segment to be processed on the workpiece in a kinetic coordinate system according to the received positioning points, determining the processing sequence of all the line segments to be processed and the motion tracks of the servo platform and the scanning galvanometer according to the initial coordinates, and sending the movement instruction to the servo platform and the scanning galvanometer respectively;
And the servo platform 6 is used for moving along the determined motion track according to the movement control instruction.
The scanning galvanometer 3 moves along the determined motion trajectory according to a movement control instruction.
The laser processing method and device with infinite field comprises the following steps:
Step 1, defining a servo platform coordinate system as a kinetic coordinate system, scanning a galvanometer coordinate system as a static coordinate system, fixing a workpiece to be processed on the servo platform, and controlling the servo platform to movably collect and recognize initial coordinates of a starting point and an end point of each line segment to be processed on the whole workpiece in the kinetic coordinate system;
Step 2, determining the lengths and directions of all line segments to be processed and starting processing points according to the initial coordinates obtained in the step 1;
Step 3, respectively determining the processing sequence of all the line segments and the motion tracks of the servo platform and the scanning galvanometer according to the data determined in the step 1 and the step 2;
Step 4, realizing the processing of workpieces to be processed according to the processing sequence and the movement track controlled servo platform as well as the scanning galvanometer synergy movement;
In the scheme, determining the processing sequence of all the line segments to be processed comprises the following steps:
1). respectively calculating the time ti, t i =max(ti, t2) which is used for jumping from the end point of the last line segment to the starting point of all remaining unprocessed line segments according to the initial coordinates of the end point of the last finished line segment,
Where,
When Lx > 0, if L x < a-xo, then
If L x > a-xo, then
When L x <0, if Lxs xo, then
If Lxl> xo, then
When Ly>, if Ly < b-yo, then
If L y> b-yo, then
When Ly <0, if |Lyl< yo, then
If Lyl> yo, then
Coordinates Po (Uo,Vo) are the initial coordinates of the end point of the last processed line
segment in the kinetic coordinate system, and coordinates Pi (Ui,Vi) are the initial coordinates of the
starting point of the remaining ith unprocessed line segment in the kinetic coordinates, the
coordinates Zo (xo, yo) are the actual coordinates of the end point of the last processed line segment
in the static coordinate system, and ti and t2 are the time of jumping from the end point of the last
line segment to horizontal and vertical direction of starting point of the remaining ith unprocessed
line segment; a and b are the length and width of the scanning galvanometer processing range
respectively, Vzx and Vzy are the moving speed of the scanning galvanometer in the x and y
directions, Vpx and Vpy are the moving speeds of the servo platform in the x and y directions
respectively, and i takes the values of 1, 2...n, and n is the number of remaining unprocessed line
segments.
2). Comparing the calculating all the time, and taking the line segment where the starting point
with the minimum time is located as the next line segment to be processed;
3). Repeating the step 1) and the step 2) on the basis of the end point of the next line segment
to be processed until the processing sequence of all the line segments to be processed is determined.
In the scheme, the movement track of the servo platform is determined to be: the track formed
by means of the servo platform moving in turn along the processing sequence of all the line
segments to be processed at the set speed, the track on each line segment to be processed is a track formed by a straight line segment between the starting and end points, of which the actual coordinates P'i (U'i, V') of the starting point of each line to be processed in the kinetic coordinate system are determined by the following formula,
If Lx > 0 and Lx <a-xo, then AUx =Vpxti,
If Lx > 0 and Lx > a-xo, then
If L<x<0 and |L< xl<=x <0, then AUx =-Vpxt <1 >,
If Lx<O and |Lx |>xo, then
If Ly> 0 and Lysb-yo, then AUy =Vpyt2,
If L y>0 and Ly> b-yo, then
If L y<O and Lyls yo, then AUy =-Vpyt2,
If Ly <0 and Lyl> yo, then
Wherein the coordinates Po (Uo, Vo) are the initial coordinates of the end point of the last
processed line segment in the kinetic coordinate, the coordinates Pi> (Vi, VI) is the initial
coordinates of the starting point of the line segment to be processed in the kinetic coordinate, the
coordinates Po (Uo, Vo) is the actual coordinates of the end point of the last processed line segment
in the kinetic coordinate, the coordinates Zo (xo , Vo) are the actual coordinates of the end point of
the last processing line in the static coordinate system, Vzx and Vzy are the moving speed of
scanning galvanometer in X and Y directions respectively, Vpx and Vpy are the moving speed of
servo platform in X and Y direction, and a and B are the length and width of scanning galvanometer
processing range.
The actual coordinate of the end point of each line segment to be processed is determined by
the actual coordinate of the starting point of the line segment to be processed, the total length and
the direction of the line segment to be processed, and the moving length of the scanning
galvanometer, that is, the starting point and direction of the servo platform are known, and the moving length is the total length of the line segment to be processed minus the moving length of the scanning galvanometer, so that the moving end point of the servo platform can be determined.
In the scheme, the movement track of the scanning galvanometer is determined as follows: the
movement track of the scanning galvanometer is determined as follows: the track formed by the
scanning galvanometer moving in turn along the processing sequence of all the line segments to be
processed at a set speed, and the track formed by straight line between the starting point and end
point on each line segment to be processed, where:
The actual coordinates Zi(xi, yi) of the starting point of each line segment to be processed in
the static coordinate system are determined by the following formula
If Lx>O and Lx <a-xo, then xi= xo +Vzxti,
If Lx > 0 and Lx> a-xo, then xi=a;
If Lx < 0 and Lxj< xo, then xi=x o-Vzxti,
If Lx <0 and Lxl> xo, then xi=0;
If Ly<0 and Ly < b-yo, then yi = yo +Vzyt2,
If Ly > 0 and Ly > b-yo, yi=b;
If Ly <0 and Lyls yo, yi=yo -Vzyt2,
If Ly <0 and Lyl> yo, then yi=0;
Wherein the coordinates Po (Uo, Vo) are the initial coordinates of the end point of the last
processed line segment in the kinetic coordinate, the coordinates Pi> (Vi, VI) is the initial
coordinates of the starting point of the line segment to be processed in the kinetic coordinate, the
coordinates Zo (xo , Vo) are the actual coordinates of the end point of the last processing line in the
static coordinate system, Vzx and Vzy are the moving speed of scanning galvanometer in X and Y
directions respectively, Vpx and Vpy are the moving speed of servo platform in X and Y direction,
and a and B are the length and width of scanning galvanometer processing range.
The actual coordinates Z2(x2, y2) of the end point of each line segment to be processed in the
static coordinate system are determined by the following formula
If Lx > 0 and Lx < a-xi, thenX2 -x +Vzxt 1
, If Lx > 0 and Lx> a-xi, thenx2=a;
If Lx <0 and |L< xjSx <1, thenX2 -x1 -Vzxti,
If Lx < xo and Lxl> xi, thenx2=0;
If L y>0 and LySb-yi, then y2 -yi -Vzyt2,
If L y>0 and Ly> b-yi, theny2=b;
If L y<O and Lyls yi, then y2- yi -Vzyt2,
If L y<O and Lyj> yi, then y2=0;
Wherein the coordinates Pi (Ui, Vi) are the initial coordinates of the end point of the last processed line segment in the kinetic coordinate, the coordinates P 2 > (V2 , V 2 ) is the initial coordinates of the starting point of the line segment to be processed in the kinetic coordinate, the coordinates Zi (xi, VI) are the actual coordinates of the end point of the last processing line in the static coordinate system, Vzx and Vzy are the moving speed of scanning galvanometer in X and Y directions respectively, Vpx and Vpy are the moving speed of servo platform in X and Y direction, and a and b are the length and width of scanning galvanometer processing range.
In the scheme, the method for determining the initial processing point comprises the following steps of: comparing the horizontal and vertical coordinates in each initial coordinate value, selecting a coordinate point with the smallest horizontal coordinate in the initial coordinate value, taking the coordinate point with the largest vertical coordinate corresponding to the selected coordinate point as the initial processing point, and taking a line segment where the initial processing point is located as the first processing line segment. That is, first compare the horizontal ordinate, take the line segment with the smallest horizontal ordinate. When there is only one selected line segment, the line segment is the first line segment to be processed; and when there are more than one selected line segment, compare the longitudinal ordinate corresponding to the horizontal ordinate among the multiple line segments, and take the largest line segment as the first line segment to be processed.
It should be understood that the foregoing is merely embodiments of the invention, but that the protection scope of the invention is not limited thereto. Any readily conceivable variations or substitutions within the scope of the invention shall be intended to be within the protection scope of the invention.
The contents that are not described in detail in this specification is within the prior art known to those skilled in the art.
Claims (9)
1. The invention discloses an infinite field laser machine method, which is characterized by the
following steps:
Step 1, defining a servo platform coordinate system as a kinetic coordinate system, scanning a
galvanometer coordinate system as a static coordinate system, fixing a workpiece to be processed
on the servo platform, controlling the servo platform to movably collect and identify a positioning
point on the workpiece, and determining initial coordinates of a starting point and an end point of
each line segment to be processed on the workpiece in the kinetic coordinate system according to
the positioning point;
Step 2, determining the lengths and directions of all line segments to be processed and initial
processing points according to the initial coordinates obtained in the step 1;
Step 3, respectively determining the processing sequence of all the line segments and the
movement tracks of the servo platform and the scanning galvanometer according to the data
determined in the step 1 and the step 2;
Step 4, realizing the processing of workpieces to be processed according to the processing
sequence and the movement track controlled servo platform as well as the scanning galvanometer
synergy movement;
Determining the processing sequence of all the line segments to be processed comprises the
following steps:
1). respectively calculating the time for jumping from the end point of the previous line
segment to the starting point of all remaining unprocessed line segments according to the initial
coordinates of the end point of the line segment completed in the previous processing;
2). comparing the size of all calculated time, and taking the line segment where the starting
point with the minimum time is located as the next line segment to be processed;
3). repeating the steps 1) and 2) on the basis of the end point of the sequent line segment to be
processed until the processing sequence of all the line segments to be processed is determined;
Adopting the time ti, t i=max (ti, t2) jumping from the end point of the previous line segment to
the starting point of the remaining ith unprocessed line segment by adoption of the following
formula,
Where,
When L x > 0, if L x < a-xo, then
If Lx> a-x o, then
When L x <0, if |L x 1< xo, then
If |L x 1> x o, then
When Ly > 0, if L y < b-yo, then
If Ly> b-yo, then
When L y <0, if |L yl< yo, then
If Lyl> y 0, then
Coordinates Po (Uo ,Vo) are the initial coordinates of the end point of the last processed line
segment in the kinetic coordinate system, and coordinates Pi (Ui ,Vi) are the initial coordinates of
the starting point of the remaining ith unprocessed line segment in the kinetic coordinates, the
coordinates Zo (xo, yo) are the actual coordinates of the end point of the last processed line segment
in the static coordinate system, and ti and t2 are the time of jumping from the end point of the last
line segment to horizontal and vertical direction of starting point of the remaining ith unprocessed
line segment; a and b are the length and width of the scanning galvanometer processing range
respectively, Vzx and Vzy are the moving speed of the scanning galvanometer in the x and y
directions, Vpx and Vpy are the moving speeds of the servo platform in the x and y directions
respectively, and i takes the values of 1, 2...n, and n is the number of remaining unprocessed line
segments.
2. In terms of the the laser processing method with infinite field according to claim 1, it is
characterized in the movement track of the servo platform is determined to be: the track formed by
means of the servo platform moving in turn along the processing sequence of all the line segments to be processed at the set speed, of which the track on each line segment to be processed is a track formed by a straight line segment between the starting and end points.
3. In terms of the laser processing method with infinite field according to claim 2, it is characterized in: the actual coordinates P'i(U'i, V'i) of the starting point of each line segment to be processed is determined by the following formula
If Lx > 0 and Lx <a-x o, then AU x =Vpx t i
If Lx > 0 and L x > a-xo, then
If L<x<O and |L < xl<=xo, then AUx=-Vpx t1,
If L x <0 and Lxl> xo, then
If L y>0 and Ly b-yo, then AUy =Vpy t 2,
If L y>0 and Ly> b-yo, then
If Ly <0 and Lyls yo, then AUy =-Vpy t 2,
If L y<O and Lyl> yo, then
Wherein the coordinates Po(Uo, Vo) are the initial coordinates of the end point of the last processed line segment in the kinetic coordinate, the coordinates Pi> (Vi, VI) is the initial coordinates of the starting point of the line segment to be processed in the kinetic coordinate, the coordinates Po(Uo, Vo) is the actual coordinates of the end point of the last processed line segment in the kinetic coordinate, the coordinates Zo (xo , Vo) are the actual coordinates of the end point of the last processing line in the static coordinate system, Vzx and Vzy are the moving speed of scanning galvanometer in X and Y directions respectively, Vpx and Vpy are the moving speed of servo platform in X and Y direction, and a and B are the length and width of scanning galvanometer processing range.
4. In terms of the laser processing method with infinite field according to claim 2, it is
characterized in: the actual coordinates of the end point of each line segment to be processed are
determined by the actual coordinates of the starting point of the line segment to be processed, the
length and direction of the line segment to be processed, and the moving length of the scanning
galvanometer.
5. In terms of the laser processing method with infinite field according to claim 1, it is
characterized in that the movement track of the scanning galvanometer is determined as follows: the
track formed by the scanning galvanometer moving in turn along the processing sequence of all the
line segments to be processed at a set speed, and the track formed by straight line between the
starting point and end point on each line segment to be processed.
6. In terms of the laser processing method with infinite field according to claim 5, it is
characterized in that the actual coordinate Zi (xi, yi) of the starting point of each line segment to be
processed is determined by the following formula
If Lx >0 and Lx <a-xo, then xi=xo+Vzxti,
If Lx > 0 and Lx> a-xo, then xi=a;
If Lx is less than 0 and Lxj< xo, then xi=xo-V zxti,
If Lx <0 and Lxl> xo, then xi=O;
If Ly > 0 and Ly <b-y 0, then yi =yo +Vzyt2,
If Ly > 0 and Ly > b-y 0, then yi=b;
If Ly <0 and Lyls y 0, then yi=yo- Vzyt2,
If Ly <0 and Lyl> y 0, then yi=0;
Wherein the coordinates Po (Uo, Vo) are the initial coordinates of the end point of the last
processed line segment in the kinetic coordinate, the coordinates Pi> (Vi, VI) is the initial
coordinates of the starting point of the line segment to be processed in the kinetic coordinate, the
coordinates Zo (xo , Vo) are the actual coordinates of the end point of the last processing line in the static coordinate system, Vzx and Vzy are the moving speed of scanning galvanometer in X and Y directions respectively, Vpx and Vpy are the moving speed of servo platform in X and Y direction, and a and b are the length and width of scanning galvanometer processing range.
7. In terms of the laser processing method with infinite field according to claim 5, it is
characterized in that the actual coordinate Z2(x2, y2) of the starting point of each line segment to be
processed is determined by the following formula
If Lx > 0 and Lx <a-xi, thenX2 --xi +Vzxt , 1
If Lx > 0 and Lx> a-xi, thenx2=a;
If L < x <0 and |L < xjsx <1, thenX2 -x1 -Vzxti,
If Lx <0 and Lx>xl, thenx2=0;
If L y >0 and Ly <b-yi, then y2- yi +V zyt2,
If L y > 0 and Ly> b-yi, theny2=b;
If L y <0 and Lyls yi, then y2-yi- Vzyt2,
If L y <0 and Lyl> yi, then y2=0;
Wherein the coordinates Pi (Ui, Vi) are the initial coordinates of the end point of the last
processed line segment in the kinetic coordinate, the coordinates P 2 > (V2 , V 2 ) is the initial
coordinates of the starting point of the line segment to be processed in the kinetic coordinate, the
coordinates Zi (xi, VI) are the actual coordinates of the end point of the last processing line in the
static coordinate system, Vzx and Vzy are the moving speed of scanning galvanometer in X and Y
directions respectively, Vpx and Vpy are the moving speed of servo platform in X and Y direction,
and a and b are the length and width of scanning galvanometer processing range.
8. In terms of the laser processing method with infinite field according to claim 5, it is
characterized in the method for determining the initial processing point comprises the following
steps: comparing the horizontal and vertical coordinates in each initial coordinate value, selecting a
coordinate point with the smallest horizontal coordinate in the initial coordinate value, taking the coordinate point with the largest vertical coordinate corresponding to the selected coordinate point as the initial processing point, and taking a line segment where the initial processing point is located as the first processing line segment.
9. A device for realizing any of laser processing method with infinite field of claims 1 to 8, it is characterized in that the device of the infinite field laser processing method comprises a moving light type laser cutting device, wherein the moving light type laser cutting device comprises a laser and a scanning galvanometer, and comprises the image acquisition and recognition system, which is used for acquiring and recognizing the positioning points on the whole workpiece according to the acquisition control instruction and sending the positioning points to the control system;
The control system is used for sending the acquisition control instruction to the image acquisition and recognition system, determining initial coordinates of a starting point and an end point of each line segment to be processed on the workpiece in a kinetic coordinate system according to the received positioning points, determining the processing sequence of all the line segments to be processed and the motion tracks of the servo platform and the scanning galvanometer according to the initial coordinates, and sending the movement instruction to the servo platform and the scanning galvanometer respectively;
The servo platform is adopted for moving along the determined movement track according to the movement control instruction;
Wherein the scanning galvanometer moves along the determined motion track according to the movement control instruction;
Where,
When Lx > 0, if L x < a-xo, then
If L x > a-xo, then
When L x <0, if |L x 1< xo, then
If |L x 1> xo, then
When Ly>, if L y < b-yo, then
If L y > b-yo, then
When Ly <0, if |L y 1< yo, then
If |L yl> yo, then
Figures 1/1
FIGURE 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2020102558A AU2020102558A4 (en) | 2020-10-01 | 2020-10-01 | A laser processing method and device with infinite field |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2020102558A AU2020102558A4 (en) | 2020-10-01 | 2020-10-01 | A laser processing method and device with infinite field |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2020102558A4 true AU2020102558A4 (en) | 2020-11-19 |
Family
ID=73249724
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2020102558A Ceased AU2020102558A4 (en) | 2020-10-01 | 2020-10-01 | A laser processing method and device with infinite field |
Country Status (1)
Country | Link |
---|---|
AU (1) | AU2020102558A4 (en) |
-
2020
- 2020-10-01 AU AU2020102558A patent/AU2020102558A4/en not_active Ceased
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN109332886B (en) | A kind of laser processing and device of unlimited breadth | |
CN101733558B (en) | Intelligent laser cutting system provided with master-slave camera and cutting method thereof | |
CN201783759U (en) | Optical fiber laser or disc laser dynamic focusing scanning spot trajectory processing system | |
JP6485661B2 (en) | Method and control system for controlling operation of a processing machine, and processing machine | |
CN110480128A (en) | A kind of real-time welding seam tracking method of six degree of freedom welding robot line laser | |
CN113427168A (en) | Real-time welding seam tracking device and method for welding robot | |
WO2020183026A3 (en) | Method for the control of a processing machine or of an industrial robot | |
CN101913024A (en) | System and method for processing dynamic focusing scanning spot track of optical fiber laser or disk laser | |
CN110125551B (en) | 3D laser marking device and method for large-radian deep inner wall annular marking | |
CN104097402A (en) | Laser marking machine and marking method thereof | |
CN114769988B (en) | Welding control method, system, welding equipment and storage medium | |
CN104002039A (en) | Method for acquiring laser focal point through laser gear | |
CN114474041A (en) | Welding automation intelligent guiding method and system based on cooperative robot | |
CN201596852U (en) | Master-slave mode camera allocated intelligent laser cutting system | |
CN103801826A (en) | Laser processing focusing device, focusing method and laser processing equipment | |
KR102600375B1 (en) | Industrial robotic device with improved tooling path generation, and method for operating the industrial robotic device according to the improved tooling path | |
CN106019550A (en) | High speed micro scanning dynamic focusing device and focusing tracking method | |
TW201801838A (en) | Laser processing method and laser processing apparatus | |
CN113305424A (en) | Focusing control method, device and equipment for laser three-dimensional galvanometer and storage medium | |
CN211102140U (en) | Laser automatic focusing positioning device | |
AU2020102558A4 (en) | A laser processing method and device with infinite field | |
CN111992895A (en) | Intelligent marking system and method | |
KR20130134863A (en) | Auto-paging method having scanner-stage synchronization | |
CN108025395A (en) | For the method along locus guiding processing head to be processed | |
CN108436278A (en) | Super large breadth three-dimensional laser engraving process and system |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
FGI | Letters patent sealed or granted (innovation patent) | ||
MK22 | Patent ceased section 143a(d), or expired - non payment of renewal fee or expiry |