AU2003286371A1 - Electronic transponder which is produced by means of conductive ink deposition - Google Patents

Electronic transponder which is produced by means of conductive ink deposition

Info

Publication number
AU2003286371A1
AU2003286371A1 AU2003286371A AU2003286371A AU2003286371A1 AU 2003286371 A1 AU2003286371 A1 AU 2003286371A1 AU 2003286371 A AU2003286371 A AU 2003286371A AU 2003286371 A AU2003286371 A AU 2003286371A AU 2003286371 A1 AU2003286371 A1 AU 2003286371A1
Authority
AU
Australia
Prior art keywords
produced
conductive ink
ink deposition
electronic transponder
transponder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003286371A
Inventor
Francois Droz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NID SA
Original Assignee
NID SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NID SA filed Critical NID SA
Publication of AU2003286371A1 publication Critical patent/AU2003286371A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0556—Disposition
    • H01L2224/05568—Disposition the whole external layer protruding from the surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/05573—Single external layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/16227—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/8119—Arrangement of the bump connectors prior to mounting
    • H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)
AU2003286371A 2002-12-20 2003-12-17 Electronic transponder which is produced by means of conductive ink deposition Abandoned AU2003286371A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH2180/02 2002-12-20
CH21802002 2002-12-20
PCT/IB2003/006084 WO2004057528A1 (en) 2002-12-20 2003-12-17 Electronic transponder which is produced by means of conductive ink deposition

Publications (1)

Publication Number Publication Date
AU2003286371A1 true AU2003286371A1 (en) 2004-07-14

Family

ID=32661018

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003286371A Abandoned AU2003286371A1 (en) 2002-12-20 2003-12-17 Electronic transponder which is produced by means of conductive ink deposition

Country Status (3)

Country Link
AU (1) AU2003286371A1 (en)
TW (1) TW200427129A (en)
WO (1) WO2004057528A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7733657B2 (en) * 2004-07-29 2010-06-08 Nxp B.V. Module base unit with strain relief means
US7253736B2 (en) * 2004-08-26 2007-08-07 Sdgi Holdings, Inc. RFID tag for instrument handles
DE102005018803A1 (en) * 2005-04-22 2006-10-26 Mühlbauer Ag Transponder for ultra-high frequency radio frequency identification system, has dipole antenna conductor section having two parts with two sets of regions joined by conductive adhesives and made of low-impedance and high-impedance materials
WO2008061554A1 (en) * 2006-11-24 2008-05-29 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Electronic, in particular microelectronic, functional group and method for its production
DE102006059745A1 (en) 2006-12-18 2008-06-19 Grammer Ag Air spring for a vehicle seat and vehicle seat with such an air spring
DE102007019365B4 (en) 2007-04-23 2013-04-11 Grammer Aktiengesellschaft Method and device for evaluating vibrations of a vehicle acting on a person
DE102007019366B4 (en) 2007-04-23 2016-12-15 Grammer Ag Device and method for detecting vibrations transmitted to a person of a vehicle
DE102007032897B4 (en) 2007-07-14 2014-05-28 Grammer Aktiengesellschaft Vehicle seat with a base frame and with respect to this base frame realtivbeweglichen seat frame
DE102007056700B4 (en) 2007-11-24 2012-03-29 Grammer Aktiengesellschaft Device with a suspension system and method for adjusting a suspension system
DE102008022045B3 (en) 2008-05-03 2009-07-30 Grammer Ag Vehicle seat has device for controlling pneumatically controlled suspension system, by which vehicle seat is supported against vehicle body part
DE102008052960B4 (en) 2008-10-23 2014-02-13 Grammer Aktiengesellschaft Suspension vibration system for vibration reduction
DE102008056200B4 (en) 2008-11-06 2014-04-03 Grammer Aktiengesellschaft Shearing rack for a vehicle seat, vehicle seat, in particular motor vehicle seat, and method for producing a substructure of a vehicle seat
DE102009005381B4 (en) 2009-01-21 2013-05-08 Grammer Aktiengesellschaft Device for springing a mass and method for adjusting and / or operating a fluid spring
DE102009043587A1 (en) * 2009-09-30 2011-05-19 Smartrac Ip B.V. Functional laminate
FR3027433A1 (en) * 2014-10-16 2016-04-22 Ask Sa METHOD FOR MANUFACTURING A RADIO FREQUENCY DEVICE SUPPORT CONSISTING OF A SINGLE LAYER
FR3035987A1 (en) * 2015-05-04 2016-11-11 Starchip METHOD FOR MANUFACTURING A CHIP CARD BY PRINTING A CONDUCTIVE INK

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2701139B1 (en) * 1993-02-01 1995-04-21 Solaic Sa Method for implanting a micro-circuit on an intelligent card and / or memory card body, and card comprising a micro-circuit thus implanted.
FR2756955B1 (en) * 1996-12-11 1999-01-08 Schlumberger Ind Sa METHOD FOR PRODUCING AN ELECTRONIC CIRCUIT FOR A CONTACTLESS MEMORY CARD
FR2761497B1 (en) * 1997-03-27 1999-06-18 Gemplus Card Int METHOD FOR MANUFACTURING A CHIP CARD OR THE LIKE

Also Published As

Publication number Publication date
TW200427129A (en) 2004-12-01
WO2004057528A1 (en) 2004-07-08

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase