AU2003273368A1 - Method of forming a sensor for detecting motion - Google Patents
Method of forming a sensor for detecting motionInfo
- Publication number
- AU2003273368A1 AU2003273368A1 AU2003273368A AU2003273368A AU2003273368A1 AU 2003273368 A1 AU2003273368 A1 AU 2003273368A1 AU 2003273368 A AU2003273368 A AU 2003273368A AU 2003273368 A AU2003273368 A AU 2003273368A AU 2003273368 A1 AU2003273368 A1 AU 2003273368A1
- Authority
- AU
- Australia
- Prior art keywords
- sensor
- forming
- detecting motion
- motion
- detecting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
- B81C1/00142—Bridges
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C19/00—Gyroscopes; Turn-sensitive devices using vibrating masses; Turn-sensitive devices without moving masses; Measuring angular rate using gyroscopic effects
- G01C19/56—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
- G01C19/5719—Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces using planar vibrating masses driven in a translation vibration along an axis
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
- G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
- G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
- G01P15/0802—Details
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0174—Manufacture or treatment of microstructural devices or systems in or on a substrate for making multi-layered devices, film deposition or growing
- B81C2201/0191—Transfer of a layer from a carrier wafer to a device wafer
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
- Gyroscopes (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US10/267,082 | 2002-10-07 | ||
| US10/267,082 US20040065638A1 (en) | 2002-10-07 | 2002-10-07 | Method of forming a sensor for detecting motion |
| PCT/US2003/030592 WO2004033365A2 (en) | 2002-10-07 | 2003-09-23 | Method of forming a sensor for detecting motion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2003273368A1 true AU2003273368A1 (en) | 2004-05-04 |
Family
ID=32042788
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2003273368A Abandoned AU2003273368A1 (en) | 2002-10-07 | 2003-09-23 | Method of forming a sensor for detecting motion |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US20040065638A1 (en) |
| AU (1) | AU2003273368A1 (en) |
| WO (1) | WO2004033365A2 (en) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7381630B2 (en) | 2001-01-02 | 2008-06-03 | The Charles Stark Draper Laboratory, Inc. | Method for integrating MEMS device and interposer |
| US7406761B2 (en) * | 2005-03-21 | 2008-08-05 | Honeywell International Inc. | Method of manufacturing vibrating micromechanical structures |
| US7407826B2 (en) * | 2005-03-21 | 2008-08-05 | Honeywell International Inc. | Vacuum packaged single crystal silicon device |
| US7562573B2 (en) * | 2005-07-21 | 2009-07-21 | Evigia Systems, Inc. | Integrated sensor and circuitry and process therefor |
| TW200733264A (en) * | 2005-11-25 | 2007-09-01 | Matsushita Electric Works Ltd | Method of producing wafer-level package structure |
| KR101076665B1 (en) * | 2005-11-25 | 2011-10-26 | 파나소닉 전공 주식회사 | Sensor device and production method therefor |
| EP3257809A1 (en) * | 2005-11-25 | 2017-12-20 | Panasonic Intellectual Property Management Co., Ltd. | Wafer level package structure and production method therefor |
| WO2007127107A2 (en) * | 2006-04-21 | 2007-11-08 | Bioscale, Inc. | Microfabricated devices and method for fabricating microfabricated devices |
| US20080032501A1 (en) * | 2006-07-21 | 2008-02-07 | Honeywell International Inc. | Silicon on metal for mems devices |
| US7999440B2 (en) * | 2006-11-27 | 2011-08-16 | Bioscale, Inc. | Micro-fabricated devices having a suspended membrane or plate structure |
| US20080121042A1 (en) * | 2006-11-27 | 2008-05-29 | Bioscale, Inc. | Fluid paths in etchable materials |
| US20080125700A1 (en) * | 2006-11-29 | 2008-05-29 | Moberg Sheldon B | Methods and apparatuses for detecting medical device acceleration, temperature, and humidity conditions |
| KR101001666B1 (en) * | 2008-07-08 | 2010-12-15 | 광주과학기술원 | The method for fabricating micro vertical structure |
| DE102009029201B4 (en) * | 2009-09-04 | 2019-05-09 | Robert Bosch Gmbh | Method for producing a component comprising a microstructured or nanostructured component |
| US8569092B2 (en) * | 2009-12-28 | 2013-10-29 | General Electric Company | Method for fabricating a microelectromechanical sensor with a piezoresistive type readout |
| CN102134053B (en) * | 2010-01-21 | 2013-04-03 | 深迪半导体(上海)有限公司 | Manufacturing method of biaxial MEMS (micro-electro-mechanical system) gyroscope |
| FR2972263B1 (en) * | 2011-03-03 | 2013-09-27 | Tronics Microsystems | INERTIAL SENSOR AND METHOD FOR MANUFACTURING THE SAME |
| CN102344113B (en) * | 2011-09-08 | 2014-03-12 | 上海先进半导体制造股份有限公司 | Method for etching device deep slot with metal sensitive interlayer |
| US9010200B2 (en) | 2012-08-06 | 2015-04-21 | Amphenol Thermometrics, Inc. | Device for measuring forces and method of making the same |
| DE102017215236A1 (en) * | 2017-08-31 | 2019-02-28 | Siemens Aktiengesellschaft | MEMS switch and method of manufacturing a MEMS switch |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4699006A (en) * | 1984-03-19 | 1987-10-13 | The Charles Stark Draper Laboratory, Inc. | Vibratory digital integrating accelerometer |
| US5343064A (en) * | 1988-03-18 | 1994-08-30 | Spangler Leland J | Fully integrated single-crystal silicon-on-insulator process, sensors and circuits |
| US5473945A (en) * | 1990-02-14 | 1995-12-12 | The Charles Stark Draper Laboratory, Inc. | Micromechanical angular accelerometer with auxiliary linear accelerometer |
| US5635639A (en) * | 1991-09-11 | 1997-06-03 | The Charles Stark Draper Laboratory, Inc. | Micromechanical tuning fork angular rate sensor |
| US5331852A (en) * | 1991-09-11 | 1994-07-26 | The Charles Stark Draper Laboratory, Inc. | Electromagnetic rebalanced micromechanical transducer |
| US5408877A (en) * | 1992-03-16 | 1995-04-25 | The Charles Stark Draper Laboratory, Inc. | Micromechanical gyroscopic transducer with improved drive and sense capabilities |
| US5349855A (en) * | 1992-04-07 | 1994-09-27 | The Charles Stark Draper Laboratory, Inc. | Comb drive micromechanical tuning fork gyro |
| US5377524A (en) * | 1992-06-22 | 1995-01-03 | The Regents Of The University Of Michigan | Self-testing capacitive pressure transducer and method |
| US5492596A (en) * | 1994-02-04 | 1996-02-20 | The Charles Stark Draper Laboratory, Inc. | Method of making a micromechanical silicon-on-glass tuning fork gyroscope |
| FR2744285B1 (en) * | 1996-01-25 | 1998-03-06 | Commissariat Energie Atomique | METHOD FOR TRANSFERRING A THIN FILM FROM AN INITIAL SUBSTRATE TO A FINAL SUBSTRATE |
| US5747353A (en) * | 1996-04-16 | 1998-05-05 | National Semiconductor Corporation | Method of making surface micro-machined accelerometer using silicon-on-insulator technology |
| US5992233A (en) * | 1996-05-31 | 1999-11-30 | The Regents Of The University Of California | Micromachined Z-axis vibratory rate gyroscope |
| JP3065611B1 (en) * | 1999-05-28 | 2000-07-17 | 三菱電機株式会社 | Micromirror device and manufacturing method thereof |
| US6277666B1 (en) * | 1999-06-24 | 2001-08-21 | Honeywell Inc. | Precisely defined microelectromechanical structures and associated fabrication methods |
| US6582985B2 (en) * | 2000-12-27 | 2003-06-24 | Honeywell International Inc. | SOI/glass process for forming thin silicon micromachined structures |
| WO2002054475A1 (en) * | 2001-01-02 | 2002-07-11 | The Charles Stark Draper Laboratory, Inc. | Method for microfabricating structures using silicon-on-insulator material |
| US20030186521A1 (en) * | 2002-03-29 | 2003-10-02 | Kub Francis J. | Method of transferring thin film functional material to a semiconductor substrate or optimized substrate using a hydrogen ion splitting technique |
| US6933163B2 (en) * | 2002-09-27 | 2005-08-23 | Analog Devices, Inc. | Fabricating integrated micro-electromechanical systems using an intermediate electrode layer |
| US20040063237A1 (en) * | 2002-09-27 | 2004-04-01 | Chang-Han Yun | Fabricating complex micro-electromechanical systems using a dummy handling substrate |
| US6872319B2 (en) * | 2002-09-30 | 2005-03-29 | Rockwell Scientific Licensing, Llc | Process for high yield fabrication of MEMS devices |
-
2002
- 2002-10-07 US US10/267,082 patent/US20040065638A1/en not_active Abandoned
-
2003
- 2003-09-23 WO PCT/US2003/030592 patent/WO2004033365A2/en not_active Application Discontinuation
- 2003-09-23 AU AU2003273368A patent/AU2003273368A1/en not_active Abandoned
Also Published As
| Publication number | Publication date |
|---|---|
| US20040065638A1 (en) | 2004-04-08 |
| WO2004033365A3 (en) | 2004-08-26 |
| WO2004033365A2 (en) | 2004-04-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |