AU2003248599A1 - Method for forming a released microstructure suitable for a microelectromechanical device - Google Patents

Method for forming a released microstructure suitable for a microelectromechanical device

Info

Publication number
AU2003248599A1
AU2003248599A1 AU2003248599A AU2003248599A AU2003248599A1 AU 2003248599 A1 AU2003248599 A1 AU 2003248599A1 AU 2003248599 A AU2003248599 A AU 2003248599A AU 2003248599 A AU2003248599 A AU 2003248599A AU 2003248599 A1 AU2003248599 A1 AU 2003248599A1
Authority
AU
Australia
Prior art keywords
forming
microelectromechanical device
microstructure suitable
released microstructure
released
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003248599A
Inventor
Bee Lee Chua
Zhihong Li
C. Tien Norman
Xiaosong Tang
Eng Hock Francis Tay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Agency for Science Technology and Research Singapore
Original Assignee
Institute of Materials Research and Engineering
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Institute of Materials Research and Engineering filed Critical Institute of Materials Research and Engineering
Publication of AU2003248599A1 publication Critical patent/AU2003248599A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00912Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
    • B81C1/0092For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
    • B81C1/00936Releasing the movable structure without liquid etchant
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B81MICROSTRUCTURAL TECHNOLOGY
    • B81CPROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00Manufacture or treatment of microstructural devices or systems
    • B81C2201/01Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128Processes for removing material
    • B81C2201/013Etching
    • B81C2201/0135Controlling etch progression
    • B81C2201/014Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Micromachines (AREA)
  • Pressure Sensors (AREA)
AU2003248599A 2002-06-10 2003-06-10 Method for forming a released microstructure suitable for a microelectromechanical device Abandoned AU2003248599A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG200203408-0 2002-06-10
SG200203408A SG108298A1 (en) 2002-06-10 2002-06-10 Method for forming a released microstructure suitable for a microelectromechanical device
PCT/SG2003/000141 WO2003104141A1 (en) 2002-06-10 2003-06-10 Method for forming a released microstructure suitable for a microelectromechanical device

Publications (1)

Publication Number Publication Date
AU2003248599A1 true AU2003248599A1 (en) 2003-12-22

Family

ID=29729282

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003248599A Abandoned AU2003248599A1 (en) 2002-06-10 2003-06-10 Method for forming a released microstructure suitable for a microelectromechanical device

Country Status (3)

Country Link
AU (1) AU2003248599A1 (en)
SG (1) SG108298A1 (en)
WO (1) WO2003104141A1 (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050280879A1 (en) * 2004-02-09 2005-12-22 Gibson Gregory T Method and apparatus for scanning a beam of light
JP4556454B2 (en) * 2004-03-15 2010-10-06 パナソニック電工株式会社 Manufacturing method of semiconductor device
CN113666331A (en) * 2021-08-23 2021-11-19 苏州司南传感科技有限公司 Thin silicon release process compatible with MEMS deep silicon etching process

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2002033649A1 (en) * 2000-10-06 2002-04-25 Ultratouch Corporation A dynamic color imaging method and system
US6074890A (en) * 1998-01-08 2000-06-13 Rockwell Science Center, Llc Method of fabricating suspended single crystal silicon micro electro mechanical system (MEMS) devices
US6544898B2 (en) * 2001-06-25 2003-04-08 Adc Telecommunications, Inc. Method for improved die release of a semiconductor device from a wafer

Also Published As

Publication number Publication date
WO2003104141A1 (en) 2003-12-18
SG108298A1 (en) 2005-01-28
WO2003104141A8 (en) 2004-04-29

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase