AU2003248599A1 - Method for forming a released microstructure suitable for a microelectromechanical device - Google Patents
Method for forming a released microstructure suitable for a microelectromechanical deviceInfo
- Publication number
- AU2003248599A1 AU2003248599A1 AU2003248599A AU2003248599A AU2003248599A1 AU 2003248599 A1 AU2003248599 A1 AU 2003248599A1 AU 2003248599 A AU2003248599 A AU 2003248599A AU 2003248599 A AU2003248599 A AU 2003248599A AU 2003248599 A1 AU2003248599 A1 AU 2003248599A1
- Authority
- AU
- Australia
- Prior art keywords
- forming
- microelectromechanical device
- microstructure suitable
- released microstructure
- released
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00912—Treatments or methods for avoiding stiction of flexible or moving parts of MEMS
- B81C1/0092—For avoiding stiction during the manufacturing process of the device, e.g. during wet etching
- B81C1/00936—Releasing the movable structure without liquid etchant
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
- B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
- B81C2201/0128—Processes for removing material
- B81C2201/013—Etching
- B81C2201/0135—Controlling etch progression
- B81C2201/014—Controlling etch progression by depositing an etch stop layer, e.g. silicon nitride, silicon oxide, metal
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Micromachines (AREA)
- Pressure Sensors (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
SG200203408-0 | 2002-06-10 | ||
SG200203408A SG108298A1 (en) | 2002-06-10 | 2002-06-10 | Method for forming a released microstructure suitable for a microelectromechanical device |
PCT/SG2003/000141 WO2003104141A1 (en) | 2002-06-10 | 2003-06-10 | Method for forming a released microstructure suitable for a microelectromechanical device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003248599A1 true AU2003248599A1 (en) | 2003-12-22 |
Family
ID=29729282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003248599A Abandoned AU2003248599A1 (en) | 2002-06-10 | 2003-06-10 | Method for forming a released microstructure suitable for a microelectromechanical device |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2003248599A1 (en) |
SG (1) | SG108298A1 (en) |
WO (1) | WO2003104141A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050280879A1 (en) * | 2004-02-09 | 2005-12-22 | Gibson Gregory T | Method and apparatus for scanning a beam of light |
JP4556454B2 (en) * | 2004-03-15 | 2010-10-06 | パナソニック電工株式会社 | Manufacturing method of semiconductor device |
CN113666331A (en) * | 2021-08-23 | 2021-11-19 | 苏州司南传感科技有限公司 | Thin silicon release process compatible with MEMS deep silicon etching process |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2002033649A1 (en) * | 2000-10-06 | 2002-04-25 | Ultratouch Corporation | A dynamic color imaging method and system |
US6074890A (en) * | 1998-01-08 | 2000-06-13 | Rockwell Science Center, Llc | Method of fabricating suspended single crystal silicon micro electro mechanical system (MEMS) devices |
US6544898B2 (en) * | 2001-06-25 | 2003-04-08 | Adc Telecommunications, Inc. | Method for improved die release of a semiconductor device from a wafer |
-
2002
- 2002-06-10 SG SG200203408A patent/SG108298A1/en unknown
-
2003
- 2003-06-10 AU AU2003248599A patent/AU2003248599A1/en not_active Abandoned
- 2003-06-10 WO PCT/SG2003/000141 patent/WO2003104141A1/en not_active Application Discontinuation
Also Published As
Publication number | Publication date |
---|---|
WO2003104141A1 (en) | 2003-12-18 |
SG108298A1 (en) | 2005-01-28 |
WO2003104141A8 (en) | 2004-04-29 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |