AU2003233974A1 - Hermetic encapsulation of organic electro-optical elements - Google Patents
Hermetic encapsulation of organic electro-optical elementsInfo
- Publication number
- AU2003233974A1 AU2003233974A1 AU2003233974A AU2003233974A AU2003233974A1 AU 2003233974 A1 AU2003233974 A1 AU 2003233974A1 AU 2003233974 A AU2003233974 A AU 2003233974A AU 2003233974 A AU2003233974 A AU 2003233974A AU 2003233974 A1 AU2003233974 A1 AU 2003233974A1
- Authority
- AU
- Australia
- Prior art keywords
- optical elements
- organic electro
- hermetic encapsulation
- hermetic
- encapsulation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000005538 encapsulation Methods 0.000 title 1
Classifications
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B19/00—Other methods of shaping glass
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00269—Bonding of solid lids or wafers to the substrate
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C14/00—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix
- C03C14/006—Glass compositions containing a non-glass component, e.g. compositions containing fibres, filaments, whiskers, platelets, or the like, dispersed in a glass matrix the non-glass component being in the form of microcrystallites, e.g. of optically or electrically active material
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- C03—GLASS; MINERAL OR SLAG WOOL
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- C03C15/00—Surface treatment of glass, not in the form of fibres or filaments, by etching
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- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/02—Surface treatment of glass, not in the form of fibres or filaments, by coating with glass
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C17/00—Surface treatment of glass, not in the form of fibres or filaments, by coating
- C03C17/34—Surface treatment of glass, not in the form of fibres or filaments, by coating with at least two coatings having different compositions
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- C03C4/00—Compositions for glass with special properties
- C03C4/12—Compositions for glass with special properties for luminescent glass; for fluorescent glass
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/10—Glass or silica
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
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- H10K50/00—Organic light-emitting devices
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2203/00—Forming microstructural systems
- B81C2203/03—Bonding two components
- B81C2203/031—Anodic bondings
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- C03C2214/00—Nature of the non-vitreous component
- C03C2214/16—Microcrystallites, e.g. of optically or electrically active material
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- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C2217/00—Coatings on glass
- C03C2217/20—Materials for coating a single layer on glass
- C03C2217/21—Oxides
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- C03C2218/00—Methods for coating glass
- C03C2218/10—Deposition methods
- C03C2218/15—Deposition methods from the vapour phase
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- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/32—After-treatment
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- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
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- C03C2218/328—Partly or completely removing a coating
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- C03C2218/00—Methods for coating glass
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- C03C2218/328—Partly or completely removing a coating
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- C03C2218/00—Methods for coating glass
- C03C2218/30—Aspects of methods for coating glass not covered above
- C03C2218/355—Temporary coating
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/85—Arrangements for extracting light from the devices
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P40/00—Technologies relating to the processing of minerals
- Y02P40/50—Glass production, e.g. reusing waste heat during processing or shaping
- Y02P40/57—Improving the yield, e-g- reduction of reject rates
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Geochemistry & Mineralogy (AREA)
- General Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Dispersion Chemistry (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Inorganic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (13)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE20205830.1 | 2002-04-15 | ||
DE20205830 | 2002-04-15 | ||
DE10222964.3 | 2002-05-23 | ||
DE10222964A DE10222964B4 (en) | 2002-04-15 | 2002-05-23 | Process for forming housings in electronic components and hermetically encapsulated electronic components |
DE10222958A DE10222958B4 (en) | 2002-04-15 | 2002-05-23 | Process for producing an organic electro-optical element and organic electro-optical element |
DE10222609.1 | 2002-05-23 | ||
DE10222958.9 | 2002-05-23 | ||
DE10222609A DE10222609B4 (en) | 2002-04-15 | 2002-05-23 | Process for producing structured layers on substrates and methodically coated substrate |
DE10252787.3 | 2002-11-13 | ||
DE10252787A DE10252787A1 (en) | 2002-04-15 | 2002-11-13 | Organic electro-optical element production method for e.g. LED, has layer with vitreous structure deposited over layer structure comprising organic electro-optical material layer formed between pair of conductive layers |
DE10301559.0 | 2003-01-16 | ||
DE10301559A DE10301559A1 (en) | 2002-04-15 | 2003-01-16 | Organic electro-optical element production method for e.g. LED, has layer with vitreous structure deposited over layer structure comprising organic electro-optical material layer formed between pair of conductive layers |
PCT/EP2003/003883 WO2003088370A2 (en) | 2002-04-15 | 2003-04-15 | Hermetic encapsulation of organic electro-optical elements |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003233974A1 true AU2003233974A1 (en) | 2003-10-27 |
Family
ID=44243116
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003233974A Abandoned AU2003233974A1 (en) | 2002-04-15 | 2003-04-15 | Hermetic encapsulation of organic electro-optical elements |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP1495501A2 (en) |
JP (1) | JP2005527076A (en) |
CN (1) | CN1659720A (en) |
AU (1) | AU2003233974A1 (en) |
CA (1) | CA2505014A1 (en) |
DE (1) | DE10222958B4 (en) |
WO (1) | WO2003088370A2 (en) |
Families Citing this family (20)
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CN1647276A (en) | 2002-04-15 | 2005-07-27 | 肖特股份公司 | Method for coating metal surfaces and substrate having a coated metal surface as protection for copying process and elements concerned |
DE10222609B4 (en) | 2002-04-15 | 2008-07-10 | Schott Ag | Process for producing structured layers on substrates and methodically coated substrate |
WO2003088347A2 (en) | 2002-04-15 | 2003-10-23 | Schott Ag | Method for connecting substrates and composite element |
JP4138672B2 (en) * | 2003-03-27 | 2008-08-27 | セイコーエプソン株式会社 | Manufacturing method of electro-optical device |
JP2006269099A (en) * | 2005-03-22 | 2006-10-05 | Pioneer Electronic Corp | Device and method for manufacturing organic el panel |
DE202005011574U1 (en) | 2005-07-22 | 2006-11-23 | Aeg Gesellschaft für Moderne Informationssysteme mbH | liquid-crystal display |
KR100645705B1 (en) | 2006-01-27 | 2006-11-15 | 삼성에스디아이 주식회사 | Organic light-emitting display device and method for fabricating the same |
DE102006016373A1 (en) | 2006-04-05 | 2007-10-11 | Merck Patent Gmbh | Large area OLEDs with homogeneous light emission |
DE102006027393A1 (en) | 2006-06-13 | 2007-12-20 | Applied Materials Gmbh & Co. Kg | Encapsulation for organic component |
JP2008004290A (en) * | 2006-06-20 | 2008-01-10 | Nippon Hoso Kyokai <Nhk> | Organic el display device and manufacturing method of organic el display device |
US20080290798A1 (en) * | 2007-05-22 | 2008-11-27 | Mark Alejandro Quesada | LLT barrier layer for top emission display device, method and apparatus |
JP5162179B2 (en) * | 2007-07-31 | 2013-03-13 | 住友化学株式会社 | LIGHT EMITTING ELEMENT, MANUFACTURING METHOD THEREOF, AND LIGHTING DEVICE |
DE102007050680A1 (en) * | 2007-10-22 | 2009-05-28 | Leonhard Kurz Gmbh & Co. Kg | Sheet structure, especially polymer-based photovoltaic element, e.g. for solar cell, comprises supporting grating with lattice openings covered by skin of viscous coating material |
DE102009056756B4 (en) | 2009-12-04 | 2020-10-15 | Schott Ag | Material for battery electrodes, battery electrodes containing them and batteries with these electrodes and processes for their production |
KR101931177B1 (en) | 2012-03-02 | 2018-12-21 | 삼성디스플레이 주식회사 | Organic light emitting display device |
CN107926111A (en) * | 2015-08-21 | 2018-04-17 | 康宁股份有限公司 | The method of continuous manufacturing feature and product related to this in flexible base-material |
EP3258516A1 (en) * | 2016-06-15 | 2017-12-20 | odelo GmbH | Illumination unit with an organic light-emitting diode (oled) and method for the production of same |
EP3258515A1 (en) * | 2016-06-15 | 2017-12-20 | odelo GmbH | Illumination unit with an organic light-emitting diode (oled) for vehicle applications and method for the production of same |
US11251406B2 (en) | 2019-03-07 | 2022-02-15 | Vitro Flat Glass Llc | Borosilicate light extraction region |
CN111378934B (en) * | 2020-03-30 | 2021-03-30 | 中国科学院上海光学精密机械研究所 | Coating method for improving spectrum and stress aging stability of electron beam evaporation film element |
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JPH0696858A (en) * | 1992-09-10 | 1994-04-08 | Toppan Printing Co Ltd | Organic thin film el element |
JPH06267654A (en) * | 1993-03-15 | 1994-09-22 | Fuji Electric Co Ltd | Manufacture of electroluminescence panel |
JP2797905B2 (en) * | 1993-06-25 | 1998-09-17 | 凸版印刷株式会社 | Organic thin film EL device |
JP3277965B2 (en) * | 1993-09-20 | 2002-04-22 | 東洋紡績株式会社 | Electroluminescence panel |
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JPH11144864A (en) * | 1997-11-13 | 1999-05-28 | Mitsubishi Chemical Corp | Organic electroluminescent element and manufacture thereof |
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US6268695B1 (en) * | 1998-12-16 | 2001-07-31 | Battelle Memorial Institute | Environmental barrier material for organic light emitting device and method of making |
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JP2000231992A (en) * | 1999-02-09 | 2000-08-22 | Stanley Electric Co Ltd | Surface light source device |
JP2000277253A (en) * | 1999-03-26 | 2000-10-06 | Canon Inc | Luminous element, light emitting device, display device, aligner, and image forming device |
ATE442765T1 (en) * | 1999-07-09 | 2009-09-15 | Inst Materials Research & Eng | LAMINATES FOR ENCAPSULATING OLED DEVICES |
JP2001052863A (en) * | 1999-08-05 | 2001-02-23 | Auto Network Gijutsu Kenkyusho:Kk | Organic el element and manufacture thereof |
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JP4556282B2 (en) * | 2000-03-31 | 2010-10-06 | 株式会社デンソー | Organic EL device and method for manufacturing the same |
US6602395B1 (en) * | 2000-04-11 | 2003-08-05 | Innovative Technology Licensing, Llc | Patterning of polymer light emitting devices using electrochemical polymerization |
JP2001307873A (en) * | 2000-04-21 | 2001-11-02 | Toppan Printing Co Ltd | Organic electroluminescence display element and its manufacturing method |
US20010052752A1 (en) * | 2000-04-25 | 2001-12-20 | Ghosh Amalkumar P. | Thin film encapsulation of organic light emitting diode devices |
JP4324718B2 (en) * | 2000-05-30 | 2009-09-02 | カシオ計算機株式会社 | Electroluminescent device |
JP2002033186A (en) * | 2000-07-17 | 2002-01-31 | Stanley Electric Co Ltd | Organic light emitting element |
JP2002063985A (en) * | 2000-08-22 | 2002-02-28 | Nec Corp | Organic electroluminescence element |
JP2002100469A (en) * | 2000-09-25 | 2002-04-05 | Pioneer Electronic Corp | Organic electroluminescence display panel |
-
2002
- 2002-05-23 DE DE10222958A patent/DE10222958B4/en not_active Expired - Lifetime
-
2003
- 2003-04-15 CA CA002505014A patent/CA2505014A1/en not_active Abandoned
- 2003-04-15 EP EP03727306A patent/EP1495501A2/en not_active Withdrawn
- 2003-04-15 CN CN038133024A patent/CN1659720A/en active Pending
- 2003-04-15 AU AU2003233974A patent/AU2003233974A1/en not_active Abandoned
- 2003-04-15 WO PCT/EP2003/003883 patent/WO2003088370A2/en active Application Filing
- 2003-04-15 JP JP2003585192A patent/JP2005527076A/en not_active Ceased
Also Published As
Publication number | Publication date |
---|---|
CA2505014A1 (en) | 2003-10-23 |
WO2003088370A2 (en) | 2003-10-23 |
CN1659720A (en) | 2005-08-24 |
DE10222958A1 (en) | 2003-10-30 |
EP1495501A2 (en) | 2005-01-12 |
JP2005527076A (en) | 2005-09-08 |
DE10222958B4 (en) | 2007-08-16 |
WO2003088370A3 (en) | 2004-06-17 |
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MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |