AU2003230243A1 - A liquid cooling device for a notebook computer - Google Patents

A liquid cooling device for a notebook computer

Info

Publication number
AU2003230243A1
AU2003230243A1 AU2003230243A AU2003230243A AU2003230243A1 AU 2003230243 A1 AU2003230243 A1 AU 2003230243A1 AU 2003230243 A AU2003230243 A AU 2003230243A AU 2003230243 A AU2003230243 A AU 2003230243A AU 2003230243 A1 AU2003230243 A1 AU 2003230243A1
Authority
AU
Australia
Prior art keywords
cooling device
notebook computer
liquid cooling
liquid
notebook
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003230243A
Inventor
Yoshimitsu Aizono
Masashi Hirose
Kazuyuki Kasahara
Shinya Koga
Toshiyuki Kubota
Shigeru Narakino
Kyo Niwatsukino
Toshisuke Sakai
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2003007168A external-priority patent/JP3431024B1/en
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Publication of AU2003230243A1 publication Critical patent/AU2003230243A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G06F1/203—Cooling means for portable computers, e.g. for laptops
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/203—Heat conductive hinge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Human Computer Interaction (AREA)
  • General Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
AU2003230243A 2002-05-15 2003-05-12 A liquid cooling device for a notebook computer Abandoned AU2003230243A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2002139598 2002-05-15
JP2002-139598 2002-05-15
JP2003-007168 2003-01-15
JP2003007168A JP3431024B1 (en) 2003-01-15 2003-01-15 Cooling system
PCT/JP2003/005873 WO2003098415A1 (en) 2002-05-15 2003-05-12 A liquid cooling device for a notebook computer

Publications (1)

Publication Number Publication Date
AU2003230243A1 true AU2003230243A1 (en) 2003-12-02

Family

ID=29552275

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003230243A Abandoned AU2003230243A1 (en) 2002-05-15 2003-05-12 A liquid cooling device for a notebook computer

Country Status (4)

Country Link
CN (1) CN100347636C (en)
AU (1) AU2003230243A1 (en)
TW (1) TWI223584B (en)
WO (1) WO2003098415A1 (en)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10243026B3 (en) * 2002-09-13 2004-06-03 Oliver Laing Device for local cooling or heating of an object
JP4244703B2 (en) * 2003-05-26 2009-03-25 パナソニック株式会社 Cooling system
JP2005228237A (en) * 2004-02-16 2005-08-25 Hitachi Ltd Liquid cooled system and electronic equipment provided therewith
DE102004042034A1 (en) 2004-08-26 2006-03-16 Laing, Oliver An electrical device power supply device and method for providing electrical power to components of an electrical device
US7143820B2 (en) * 2004-12-31 2006-12-05 Intel Corporation Systems for improved heat exchanger
CN100450336C (en) * 2007-03-26 2009-01-07 山东省科学院能源研究所 Single-phase ultrahigh heat flow micro-column heat exchanger
US9453691B2 (en) 2007-08-09 2016-09-27 Coolit Systems, Inc. Fluid heat exchange systems
CN101588709B (en) * 2008-05-19 2012-12-19 深圳富泰宏精密工业有限公司 Shielding structure
CN102376660B (en) * 2010-08-19 2013-08-28 富泰华工业（深圳）有限公司 Radiating device
US20140041827A1 (en) * 2012-08-08 2014-02-13 Edward C. Giaimo, III Heat Transfer Device Management
CN103926988B (en) * 2013-01-14 2017-06-30 宏碁股份有限公司 Electronic installation
CN105530802B (en) * 2015-12-28 2018-08-10 联想(北京)有限公司 Cooling system and electronic equipment
US10031564B2 (en) 2015-12-28 2018-07-24 Lenovo (Beijing) Limited Heat dissipation apparatus and system for an electronic device
CA3021959C (en) 2016-05-11 2019-05-21 Hypertechnologie Ciara Inc Cpu cooling system with direct spray cooling
CN107438348B (en) * 2016-05-27 2023-12-15 奇鋐科技股份有限公司 Water cooling device
CN106791300B (en) * 2016-12-09 2019-06-25 上饶市众联光电有限公司 A kind of high resolution optical imaging equipment
JP6993546B2 (en) * 2018-02-14 2022-01-13 日本電産サンキョー株式会社 Cooling system
CN108650866B (en) * 2018-07-27 2024-04-23 北京小米移动软件有限公司 Heat dissipation system and electronic equipment
CN110850924B (en) * 2018-10-26 2021-07-09 华为技术有限公司 Folding equipment and heat dissipation device
TWI684743B (en) * 2019-01-04 2020-02-11 雙鴻科技股份有限公司 Rotatable water cooling tube and electronic device having the same
CN110418549B (en) 2019-06-18 2021-01-29 华为技术有限公司 Heat dissipation assembly and electronic equipment
TWI722838B (en) * 2020-03-18 2021-03-21 英業達股份有限公司 Electronic device and fluid driving device
IT202100002726A1 (en) 2021-02-08 2022-08-08 Presti Gaetano Lo LAPTOP COMPUTER WITH LAP-TOP TYPE SCREEN AND KEYBOARD AND BAG-IN TYPE PROCESSING UNIT
CN115118798A (en) * 2021-03-19 2022-09-27 Oppo广东移动通信有限公司 Heat dissipation assembly and foldable electronic equipment

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6019165A (en) * 1998-05-18 2000-02-01 Batchelder; John Samuel Heat exchange apparatus
AU2641799A (en) * 1999-02-26 2000-09-21 Nippon Thermostat Co., Ltd. Cooling device of electronic device
US6244331B1 (en) * 1999-10-22 2001-06-12 Intel Corporation Heatsink with integrated blower for improved heat transfer
US7086452B1 (en) * 2000-06-30 2006-08-08 Intel Corporation Method and an apparatus for cooling a computer
US6327145B1 (en) * 2000-09-01 2001-12-04 Intel Corporation Heat sink with integrated fluid circulation pump

Also Published As

Publication number Publication date
TWI223584B (en) 2004-11-01
CN1653405A (en) 2005-08-10
WO2003098415A1 (en) 2003-11-27
CN100347636C (en) 2007-11-07
TW200400788A (en) 2004-01-01

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase