AU2003227209A1 - Processor - Google Patents

Processor

Info

Publication number
AU2003227209A1
AU2003227209A1 AU2003227209A AU2003227209A AU2003227209A1 AU 2003227209 A1 AU2003227209 A1 AU 2003227209A1 AU 2003227209 A AU2003227209 A AU 2003227209A AU 2003227209 A AU2003227209 A AU 2003227209A AU 2003227209 A1 AU2003227209 A1 AU 2003227209A1
Authority
AU
Australia
Prior art keywords
processor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003227209A
Inventor
Toshio Goto
Masaru Hori
Nobuo Ishii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of AU2003227209A1 publication Critical patent/AU2003227209A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005Apparatus not specifically provided for elsewhere
    • H01L21/67242Apparatus for monitoring, sorting or marking
    • H01L21/67253Process monitoring, e.g. flow or thickness monitoring
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/48Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation
    • C23C16/482Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating by irradiation, e.g. photolysis, radiolysis, particle radiation using incoherent light, UV to IR, e.g. lamps
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32917Plasma diagnostics
    • H01J37/32935Monitoring and controlling tubes by information coming from the object and/or discharge

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Analytical Chemistry (AREA)
  • Toxicology (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Plasma & Fusion (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Drying Of Semiconductors (AREA)
  • Plasma Technology (AREA)
AU2003227209A 2003-03-26 2003-03-26 Processor Abandoned AU2003227209A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2003/003714 WO2004085704A1 (en) 2003-03-26 2003-03-26 Processor

Publications (1)

Publication Number Publication Date
AU2003227209A1 true AU2003227209A1 (en) 2004-10-18

Family

ID=33045140

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003227209A Abandoned AU2003227209A1 (en) 2003-03-26 2003-03-26 Processor

Country Status (4)

Country Link
US (1) US20050087296A1 (en)
JP (1) JP4087851B2 (en)
AU (1) AU2003227209A1 (en)
WO (1) WO2004085704A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7989364B2 (en) 2006-08-28 2011-08-02 National University Corporation Nagoya University Plasma oxidation processing method
US20080113108A1 (en) * 2006-11-09 2008-05-15 Stowell Michael W System and method for control of electromagnetic radiation in pecvd discharge processes
JP5161469B2 (en) * 2007-03-16 2013-03-13 株式会社日立ハイテクノロジーズ Plasma processing equipment
JP2008251866A (en) * 2007-03-30 2008-10-16 Hitachi High-Technologies Corp Plasma processing apparatus
JP2009283838A (en) * 2008-05-26 2009-12-03 Oki Semiconductor Co Ltd System for monitoring ultraviolet light
US9299541B2 (en) * 2012-03-30 2016-03-29 Lam Research Corporation Methods and apparatuses for effectively reducing gas residence time in a plasma processing chamber
JP7088732B2 (en) * 2018-04-27 2022-06-21 株式会社堀場エステック Program for board processing device and board processing device
JP6913060B2 (en) * 2018-07-24 2021-08-04 株式会社日立ハイテク Plasma processing equipment and plasma processing method

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3734620A (en) * 1971-04-01 1973-05-22 Ibm Multiple band atomic absorption apparatus for simultaneously measuring different physical parameters of a material
JPS61257476A (en) * 1985-05-10 1986-11-14 Agency Of Ind Science & Technol Formation of thin film
JPH06293960A (en) * 1993-04-07 1994-10-21 Matsushita Electric Ind Co Ltd Laser ablation device
US5749830A (en) * 1993-12-03 1998-05-12 Olympus Optical Co., Ltd. Fluorescent endoscope apparatus
US5683538A (en) * 1994-12-23 1997-11-04 International Business Machines Corporation Control of etch selectivity
JP3162623B2 (en) * 1996-01-26 2001-05-08 東京エレクトロン株式会社 Particle detection device
US5936716A (en) * 1996-05-31 1999-08-10 Pinsukanjana; Paul Ruengrit Method of controlling multi-species epitaxial deposition
JPH1083893A (en) * 1996-09-05 1998-03-31 Sony Corp Method and apparatus for plasma control and method and apparatus for plasma measurement
US6527730B2 (en) * 2000-12-21 2003-03-04 Eastman Kodak Company Reducing noise in a technique for diagnosing attention deficit hyperactivity disorder
US6859596B2 (en) * 2002-07-23 2005-02-22 Fitel Usa Corp. Systems and methods for forming ultra-low PMD optical fiber using amplitude and frequency keyed fiber spin functions
JP4081132B2 (en) * 2007-05-31 2008-04-23 辰巳電子工業株式会社 Video printing apparatus and video printing method

Also Published As

Publication number Publication date
JPWO2004085704A1 (en) 2006-06-29
WO2004085704A1 (en) 2004-10-07
US20050087296A1 (en) 2005-04-28
JP4087851B2 (en) 2008-05-21

Similar Documents

Publication Publication Date Title
AU2003272930A1 (en) Footwere
AU2003902455A0 (en) Cadmas
AU2003274573A1 (en) Deburrer
AU2003227209A1 (en) Processor
AU2003209183A1 (en) Meaning processor
AU2003903652A0 (en) Muvium
AU2003241210A1 (en) Videocomputer
AU2003100006A4 (en) Adcaster
AU2003100198A4 (en) Colourband Browbands
AU2003100325A4 (en) Freez-A-Cube
AU2003100378A4 (en) Scootermansydney
AU2003100942A4 (en) Energenz
AU2003901499A0 (en) Raydial
AU2003901992A0 (en) Zipster
AU2003900445A0 (en) Liquitainer
AU2003900446A0 (en) Matmate
AU2003900642A0 (en) Benchbath
AU2003900646A0 (en) Sunstill
AU2003900904A0 (en) Soupermatic
AU2003900936A0 (en) Mg-zn-al-alloy
AU2003900947A0 (en) Frontpack
AU2003901133A0 (en) Escript
AU2003901331A0 (en) Ecoloo
AU2003901433A0 (en) Speed-e-weeda
AU2003900056A0 (en) Glo-brakes

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase