AU2002953570A0 - Polymer compositions - Google Patents
Polymer compositionsInfo
- Publication number
- AU2002953570A0 AU2002953570A0 AU2002953570A AU2002953570A AU2002953570A0 AU 2002953570 A0 AU2002953570 A0 AU 2002953570A0 AU 2002953570 A AU2002953570 A AU 2002953570A AU 2002953570 A AU2002953570 A AU 2002953570A AU 2002953570 A0 AU2002953570 A0 AU 2002953570A0
- Authority
- AU
- Australia
- Prior art keywords
- polymer compositions
- compositions
- polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4334—Auxiliary members in encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3011—Impedance
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002953570A AU2002953570A0 (en) | 2002-12-24 | 2002-12-24 | Polymer compositions |
AU2003208142A AU2003208142B2 (en) | 2002-12-24 | 2003-07-04 | Polymer compositions |
DE10360895A DE10360895A1 (en) | 2002-12-24 | 2003-12-19 | Polymer compositions useful as electronics encapsulants contain a toughener in a composition otherwise comprising a polycyanurate matrix and filler |
GB0329819A GB2398790B (en) | 2002-12-24 | 2003-12-23 | Polymer compositions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
AU2002953570A AU2002953570A0 (en) | 2002-12-24 | 2002-12-24 | Polymer compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002953570A0 true AU2002953570A0 (en) | 2003-01-16 |
Family
ID=30004653
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002953570A Abandoned AU2002953570A0 (en) | 2002-12-24 | 2002-12-24 | Polymer compositions |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2002953570A0 (en) |
DE (1) | DE10360895A1 (en) |
GB (1) | GB2398790B (en) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2098571A1 (en) * | 2008-03-07 | 2009-09-09 | Robert Bosch GmbH | Modified thermosetting resin |
DE102008013231A1 (en) | 2008-03-07 | 2009-09-10 | Robert Bosch Gmbh | Hardenable reaction resin system |
CN105131827B (en) * | 2015-09-18 | 2017-06-16 | 黑龙江省科学院石油化学研究院 | A kind of modified cyanic acid ester resin skin covering of the surface and preparation method thereof |
US10848027B2 (en) | 2016-11-17 | 2020-11-24 | General Electric Company | Electrical insulation systems and insulated components for electrical machine |
EP3580294A4 (en) * | 2017-04-14 | 2020-11-11 | Hewlett-Packard Development Company, L.P. | Substrate(s) enclosed by energy absorbing material(s) |
US11707411B2 (en) | 2019-08-09 | 2023-07-25 | Corning Incorporated | Pharmaceutical packages with coatings comprising polycyanurates |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5548034A (en) * | 1992-07-31 | 1996-08-20 | International Business Machines Corporation | Modified dicyanate ester resins having enhanced fracture toughness |
JPH11171975A (en) * | 1997-12-12 | 1999-06-29 | Taiyo Ink Mfg Ltd | Thermosetting resin composition |
US6245841B1 (en) * | 1998-03-23 | 2001-06-12 | General Electric Company | Cyanate ester based thermoset compositions |
US6469074B1 (en) * | 1999-05-26 | 2002-10-22 | Matsushita Electric Works, Ltd. | Composition of cyanate ester, epoxy resin and acid anhydride |
JP2001089654A (en) * | 1999-09-24 | 2001-04-03 | Hitachi Chem Co Ltd | Molding material for sealing and electronic member device |
KR20050055042A (en) * | 2000-03-21 | 2005-06-10 | 히다치 가세고교 가부시끼가이샤 | Resin composition with excellent dielectric characteristics, process for producing resin composition, varnish prepared from the same, process for producing the same, prepreg made with these, and metal-clad laminate |
-
2002
- 2002-12-24 AU AU2002953570A patent/AU2002953570A0/en not_active Abandoned
-
2003
- 2003-12-19 DE DE10360895A patent/DE10360895A1/en not_active Ceased
- 2003-12-23 GB GB0329819A patent/GB2398790B/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
GB2398790B (en) | 2005-04-06 |
DE10360895A1 (en) | 2004-07-08 |
GB0329819D0 (en) | 2004-01-28 |
GB2398790A (en) | 2004-09-01 |
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