AU2002350038A1 - Method and system to provide electrical contacts for electrotreating processes - Google Patents

Method and system to provide electrical contacts for electrotreating processes

Info

Publication number: AU2002350038A1
Authority: AU; Australia
Prior art keywords: electrical contacts; provide electrical; electrotreating; processes; electrotreating processes
Prior art date: 2001-10-26
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Abandoned

Application number

AU2002350038A

Inventor

Bulent M. Basol

Jeffrey A. Bogart

Boguslaw A. Nagorski

Homayoun Talieh

Cyprian E. Uzoh

Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)

ASM Nutool Inc

Original Assignee

ASM Nutool Inc

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2001-10-26

Filing date

2002-10-28

Publication date

2003-05-06

2002-10-28 Application filed by ASM Nutool Inc filed Critical ASM Nutool Inc

2003-05-06 Publication of AU2002350038A1 publication Critical patent/AU2002350038A1/en

Status Abandoned legal-status Critical Current

Links

Classifications

- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67075—Apparatus for fluid treatment for etching for wet etching
- H01L21/67086—Apparatus for fluid treatment for etching for wet etching with the semiconductor substrates being dipped in baths or vessels
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D17/001—Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells

Landscapes

Engineering & Computer Science (AREA)
Chemical & Material Sciences (AREA)
General Physics & Mathematics (AREA)
Physics & Mathematics (AREA)
Manufacturing & Machinery (AREA)
Computer Hardware Design (AREA)
Microelectronics & Electronic Packaging (AREA)
Power Engineering (AREA)
Condensed Matter Physics & Semiconductors (AREA)
Metallurgy (AREA)
Electrochemistry (AREA)
Chemical Kinetics & Catalysis (AREA)
Materials Engineering (AREA)
Life Sciences & Earth Sciences (AREA)
Organic Chemistry (AREA)
Sustainable Development (AREA)
Electroplating Methods And Accessories (AREA)
Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Testing Or Measuring Of Semiconductors Or The Like (AREA)
Electrodes Of Semiconductors (AREA)

AU2002350038A 2001-10-26 2002-10-28 Method and system to provide electrical contacts for electrotreating processes Abandoned AU2002350038A1 (en)

Applications Claiming Priority (3)

Application Number	Priority Date	Filing Date	Title
US34875801P	2001-10-26	2001-10-26
US60/348,758		2001-10-26
PCT/US2002/034633 WO2003036693A2 (en)	2001-10-26	2002-10-28	Method and system to provide electrical contacts for electrotreating processes

Publications (1)

Publication Number	Publication Date
AU2002350038A1 true AU2002350038A1 (en)	2003-05-06

Family

ID=23369412

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
AU2002350038A Abandoned AU2002350038A1 (en)	2001-10-26	2002-10-28	Method and system to provide electrical contacts for electrotreating processes

Country Status (7)

Country	Link
EP (1)	EP1444722A2 (en)
JP (1)	JP2005507170A (en)
KR (1)	KR20040070342A (en)
CN (1)	CN1316557C (en)
AU (1)	AU2002350038A1 (en)
TW (1)	TWI223848B (en)
WO (1)	WO2003036693A2 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102353480B (en) *	2011-07-12	2013-05-08	北京邮电大学	Normal pressure applying device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
US6001235A (en) *	1997-06-23	1999-12-14	International Business Machines Corporation	Rotary plater with radially distributed plating solution
US6156167A (en) *	1997-11-13	2000-12-05	Novellus Systems, Inc.	Clamshell apparatus for electrochemically treating semiconductor wafers
US6132587A (en) *	1998-10-19	2000-10-17	Jorne; Jacob	Uniform electroplating of wafers
US6613214B2 (en) *	1998-11-30	2003-09-02	Applied Materials, Inc.	Electric contact element for electrochemical deposition system and method
US6251236B1 (en) *	1998-11-30	2001-06-26	Applied Materials, Inc.	Cathode contact ring for electrochemical deposition
US6610190B2 (en) *	2000-11-03	2003-08-26	Nutool, Inc.	Method and apparatus for electrodeposition of uniform film with minimal edge exclusion on substrate
US6497800B1 (en) *	2000-03-17	2002-12-24	Nutool Inc.	Device providing electrical contact to the surface of a semiconductor workpiece during metal plating
US6482307B2 (en) *	2000-05-12	2002-11-19	Nutool, Inc.	Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing

2002
- 2002-10-28 AU AU2002350038A patent/AU2002350038A1/en not_active Abandoned
- 2002-10-28 TW TW091132034A patent/TWI223848B/en not_active IP Right Cessation
- 2002-10-28 EP EP02786571A patent/EP1444722A2/en not_active Withdrawn
- 2002-10-28 JP JP2003539084A patent/JP2005507170A/en not_active Withdrawn
- 2002-10-28 WO PCT/US2002/034633 patent/WO2003036693A2/en not_active Application Discontinuation
- 2002-10-28 KR KR10-2004-7006065A patent/KR20040070342A/en not_active Application Discontinuation
- 2002-10-28 CN CNB028233859A patent/CN1316557C/en not_active Expired - Fee Related

Also Published As

Publication number	Publication date
CN1316557C (en)	2007-05-16
JP2005507170A (en)	2005-03-10
WO2003036693A3 (en)	2003-11-13
EP1444722A2 (en)	2004-08-11
KR20040070342A (en)	2004-08-07
WO2003036693A2 (en)	2003-05-01
TW200300577A (en)	2003-06-01
TWI223848B (en)	2004-11-11
CN1636266A (en)	2005-07-06

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Legal Events

Date	Code	Title	Description
2004-07-15	MK6	Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase