AU2002334330A1 - Electronic circuit comprising conductive bridges and method for making such bridges - Google Patents

Electronic circuit comprising conductive bridges and method for making such bridges

Info

Publication number
AU2002334330A1
AU2002334330A1 AU2002334330A AU2002334330A AU2002334330A1 AU 2002334330 A1 AU2002334330 A1 AU 2002334330A1 AU 2002334330 A AU2002334330 A AU 2002334330A AU 2002334330 A AU2002334330 A AU 2002334330A AU 2002334330 A1 AU2002334330 A1 AU 2002334330A1
Authority
AU
Australia
Prior art keywords
bridges
making
electronic circuit
conductive
conductive bridges
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
AU2002334330A
Other versions
AU2002334330B2 (en
Inventor
Francois Droz
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nagravision SARL
Original Assignee
Nagravision SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nagravision SA filed Critical Nagravision SA
Priority claimed from PCT/IB2002/004039 external-priority patent/WO2003030601A1/en
Publication of AU2002334330A1 publication Critical patent/AU2002334330A1/en
Application granted granted Critical
Publication of AU2002334330B2 publication Critical patent/AU2002334330B2/en
Assigned to NAGRAVISION S.A. reassignment NAGRAVISION S.A. Request for Assignment Assignors: NAGRAID SA
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

AU2002334330A 2001-10-01 2002-10-01 Electronic circuit comprising conductive bridges and method for making such bridges Ceased AU2002334330B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CH17982001 2001-10-01
CH1798/01 2001-10-01
PCT/IB2002/004039 WO2003030601A1 (en) 2001-10-01 2002-10-01 Electronic circuit comprising conductive bridges and method for making such bridges

Publications (2)

Publication Number Publication Date
AU2002334330A1 true AU2002334330A1 (en) 2003-06-26
AU2002334330B2 AU2002334330B2 (en) 2007-06-07

Family

ID=4566320

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002334330A Ceased AU2002334330B2 (en) 2001-10-01 2002-10-01 Electronic circuit comprising conductive bridges and method for making such bridges

Country Status (15)

Country Link
US (1) US7071422B2 (en)
EP (1) EP1433368B1 (en)
JP (1) JP3978730B2 (en)
CN (1) CN100357967C (en)
AT (1) ATE285664T1 (en)
AU (1) AU2002334330B2 (en)
BR (1) BRPI0213069B1 (en)
CA (1) CA2462252C (en)
DE (1) DE60202380T2 (en)
ES (1) ES2235112T3 (en)
MX (1) MXPA04002693A (en)
PT (1) PT1433368E (en)
RU (1) RU2296440C2 (en)
WO (1) WO2003030601A1 (en)
ZA (1) ZA200402146B (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050155957A1 (en) * 2001-02-26 2005-07-21 John Gregory Method of forming an opening or cavity in a substrate for receiving an electronic component
US7719103B2 (en) * 2005-06-30 2010-05-18 Semiconductor Energy Laboratory Co., Ltd Semiconductor device
US20090025962A1 (en) * 2005-09-30 2009-01-29 Gelardi John A Electronic Module Expansion Bridge
WO2008082616A1 (en) 2006-12-29 2008-07-10 Solicore, Inc. Card configured to receive separate battery
US8181879B2 (en) 2006-12-29 2012-05-22 Solicore, Inc. Mailing apparatus for powered cards
FI121592B (en) * 2008-03-26 2011-01-31 Tecnomar Oy Process for making PCB laminates, especially RFID antenna laminates and PCB laminates
US8120927B2 (en) * 2008-04-07 2012-02-21 Mediatek Inc. Printed circuit board
US9681554B2 (en) * 2008-04-07 2017-06-13 Mediatek Inc. Printed circuit board
BRPI0921628B1 (en) 2008-11-03 2020-05-12 Smartrac Technology Gmbh PROCESS FOR PRODUCTION OF A TRANSPONDER RFID PRODUCT AND TRANSPONDER RFID PRODUCT PRODUCED BY THE PROCESS
DE102009050386B4 (en) * 2009-10-22 2013-10-31 Mühlbauer Ag Method for producing plated-through holes
FI125720B (en) 2011-05-19 2016-01-29 Tecnomar Oy Roll-to-roll mass production method for electrical bridges
EP3439438A1 (en) * 2017-08-02 2019-02-06 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft Non-uniform magnetic foil embedded in component carrier

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2900580A (en) * 1954-06-04 1959-08-18 Beck S Inc Printed electrical circuit components having integral lead-outs and methods of making same
US3977074A (en) * 1975-02-06 1976-08-31 General Motors Corporation Double sided printed circuit board and method for making same
US5229548A (en) * 1986-10-27 1993-07-20 Black & Decker Inc. Circuit board having a stamped substrate
US5923539A (en) * 1992-01-16 1999-07-13 Hitachi, Ltd. Multilayer circuit substrate with circuit repairing function, and electronic circuit device
TW276356B (en) * 1994-06-24 1996-05-21 Ibm
JP3510743B2 (en) 1996-09-13 2004-03-29 ローム株式会社 Wiring connection structure and electronic component using the same
FR2769109B1 (en) * 1997-09-26 1999-11-19 Gemplus Sca DISPOSABLE CHIP ELECTRONIC DEVICE AND MANUFACTURING METHOD
JP2000057289A (en) * 1998-08-11 2000-02-25 Sony Corp Noncontact ic card
DE19916180C2 (en) 1999-04-10 2001-03-08 Cubit Electronics Gmbh Process for the production of electrically insulated conductor crossings
JP2001188891A (en) * 2000-01-05 2001-07-10 Shinko Electric Ind Co Ltd Non-contact type ic card
US6535396B1 (en) * 2000-04-28 2003-03-18 Delphi Technologies, Inc. Combination circuit board and segmented conductive bus substrate
US6727436B2 (en) * 2002-03-15 2004-04-27 Memx, Inc. Interconnect bus crossover for MEMS
US6707677B1 (en) * 2003-03-12 2004-03-16 Silicon Integrated Systems Corp. Chip-packaging substrate and test method therefor

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