AU2002328450A1 - High polymer microcellular foam conductive gaskets and method for preparing thereof - Google Patents

High polymer microcellular foam conductive gaskets and method for preparing thereof

Info

Publication number
AU2002328450A1
AU2002328450A1 AU2002328450A AU2002328450A AU2002328450A1 AU 2002328450 A1 AU2002328450 A1 AU 2002328450A1 AU 2002328450 A AU2002328450 A AU 2002328450A AU 2002328450 A AU2002328450 A AU 2002328450A AU 2002328450 A1 AU2002328450 A1 AU 2002328450A1
Authority
AU
Australia
Prior art keywords
preparing
high polymer
microcellular foam
conductive gaskets
foam conductive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002328450A
Inventor
Won-Hyung Kang
Jae-Moon Song
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
S AND K POLY TEC CO Ltd
Original Assignee
S AND K POLY TEC CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from KR10-2002-0008695A external-priority patent/KR100478830B1/en
Priority claimed from KR10-2002-0051836A external-priority patent/KR100477019B1/en
Application filed by S AND K POLY TEC CO Ltd filed Critical S AND K POLY TEC CO Ltd
Publication of AU2002328450A1 publication Critical patent/AU2002328450A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0015—Gaskets or seals

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Laminated Bodies (AREA)
AU2002328450A 2002-02-19 2002-09-06 High polymer microcellular foam conductive gaskets and method for preparing thereof Abandoned AU2002328450A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
KR2002-8695 2002-02-19
KR10-2002-0008695A KR100478830B1 (en) 2002-02-19 2002-02-19 Conductive high polymer microcellular foam gaskets and method for preparing thereof
KR2002-51836 2002-08-30
KR10-2002-0051836A KR100477019B1 (en) 2002-08-30 2002-08-30 High polymer microcellular foam conductive gaskets and method for preparing thereof
PCT/KR2002/001689 WO2003071846A1 (en) 2002-02-19 2002-09-17 High polymer microcellular foam conductive gaskets and method for preparing thereof

Publications (1)

Publication Number Publication Date
AU2002328450A1 true AU2002328450A1 (en) 2003-09-09

Family

ID=27759799

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002328450A Abandoned AU2002328450A1 (en) 2002-02-19 2002-09-06 High polymer microcellular foam conductive gaskets and method for preparing thereof

Country Status (3)

Country Link
CN (1) CN1276698C (en)
AU (1) AU2002328450A1 (en)
WO (1) WO2003071846A1 (en)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8389113B2 (en) 2002-09-17 2013-03-05 Ppg Industries Ohio, Inc. Substrates and articles of manufacture coated with a waterborne 2K coating composition
US7778676B2 (en) * 2004-09-10 2010-08-17 Nokia Corporation ESD protection for LCD panels and the like
US20060141234A1 (en) * 2004-12-23 2006-06-29 Rearick Brian K Coated compressible substrates
CN100577715C (en) * 2006-04-05 2010-01-06 中国科学院金属研究所 Electromagnetic shielding macromolecule composite material
US9548144B2 (en) * 2012-11-16 2017-01-17 Tyco Electronics Corporation Isolation system for an electronic device
CN103108534A (en) * 2012-12-10 2013-05-15 大连圣锋胶粘制品有限公司 Shielding case and preparation method thereof
CN103666301B (en) * 2013-04-23 2015-08-19 隆扬电子（昆山）有限公司 A kind of Highly-conductive elastomer and production method thereof
CN103666302B (en) * 2013-04-23 2015-06-24 隆扬电子（昆山）有限公司 Production method of high conductivity rubber elastomer
JP6190216B2 (en) * 2013-08-30 2017-08-30 三菱航空機株式会社 Aircraft windows and opening closure members
US9357683B2 (en) * 2014-09-26 2016-05-31 Laird Technologies, Inc. Electromagnetic interference (EMI) shielding apparatus including electrically-conductive foam
CN106317847B (en) * 2015-06-30 2020-03-31 3M创新有限公司 Conductive foam, conductive foam body and preparation method and application thereof
CN105400129B (en) * 2015-10-30 2017-09-22 三峡大学 A kind of filled conductive composites and preparation method thereof
CN105566676A (en) * 2015-12-30 2016-05-11 南通万德科技有限公司 Highly conductive elastomer based on chemical plating and preparation method thereof
US9953683B1 (en) 2017-04-11 2018-04-24 Microsoft Technology Licensing, Llc Die-cut gasket manufacturing
CN111417295A (en) * 2020-03-06 2020-07-14 南昌欧菲生物识别技术有限公司 Conductive foam, ultrasonic fingerprint module, display screen assembly and electronic equipment
CN115500067B (en) * 2022-09-02 2023-08-29 苏州申赛新材料有限公司 Electromagnetic shielding composite material with low-reflection magneto-electric dual-functional gradient structure

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5401911A (en) * 1992-04-03 1995-03-28 International Business Machines Corporation Via and pad structure for thermoplastic substrates and method and apparatus for forming the same
US5882459A (en) * 1996-11-08 1999-03-16 W. L. Gore & Associates, Inc. Method for aligning and laminating substrates to stiffeners in electrical circuits
US5766979A (en) * 1996-11-08 1998-06-16 W. L. Gore & Associates, Inc. Wafer level contact sheet and method of assembly
WO1999041963A1 (en) * 1998-02-17 1999-08-19 Parker-Hannifin Corporation Emi shielded vent panel and method

Also Published As

Publication number Publication date
CN1620845A (en) 2005-05-25
WO2003071846A1 (en) 2003-08-28
CN1276698C (en) 2006-09-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase