AU2002227444A1 - System and method for conditioning leads - Google Patents

System and method for conditioning leads

Info

Publication number
AU2002227444A1
AU2002227444A1 AU2002227444A AU2744402A AU2002227444A1 AU 2002227444 A1 AU2002227444 A1 AU 2002227444A1 AU 2002227444 A AU2002227444 A AU 2002227444A AU 2744402 A AU2744402 A AU 2744402A AU 2002227444 A1 AU2002227444 A1 AU 2002227444A1
Authority
AU
Australia
Prior art keywords
conditioning leads
conditioning
leads
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002227444A
Inventor
Paul Hasten
Wai Hong Lew
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Tech and Instruments Pte Ltd
Original Assignee
Semiconductor Tech and Instruments Pte Ltd
Semiconductor Technologies and Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Tech and Instruments Pte Ltd, Semiconductor Technologies and Instruments Inc filed Critical Semiconductor Tech and Instruments Pte Ltd
Publication of AU2002227444A1 publication Critical patent/AU2002227444A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/0092—Treatment of the terminal leads as a separate operation

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lead Frames For Integrated Circuits (AREA)
AU2002227444A 2000-12-19 2001-12-18 System and method for conditioning leads Abandoned AU2002227444A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/741,130 2000-12-19
US09/741,130 US6654658B2 (en) 2000-12-19 2000-12-19 System and method for conditioning leads
PCT/US2001/049340 WO2002051229A2 (en) 2000-12-19 2001-12-18 System and method for conditioning leads

Publications (1)

Publication Number Publication Date
AU2002227444A1 true AU2002227444A1 (en) 2002-07-01

Family

ID=24979522

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002227444A Abandoned AU2002227444A1 (en) 2000-12-19 2001-12-18 System and method for conditioning leads

Country Status (3)

Country Link
US (1) US6654658B2 (en)
AU (1) AU2002227444A1 (en)
WO (1) WO2002051229A2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090094261A1 (en) * 2007-10-04 2009-04-09 Jung Edward K Y Systems and methods for correlating epigenetic information with disability data
US10343946B2 (en) * 2010-10-26 2019-07-09 Schott Ag Highly refractive thin glasses

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4765376A (en) * 1987-04-28 1988-08-23 Northern Telecom Limited Lead straightening for leaded packaged electronic components
US5219404A (en) * 1991-05-20 1993-06-15 Texas Instruments Incorporated Lead conditioner for Quad semiconductor packages
JPH06295968A (en) 1991-12-02 1994-10-21 Meiritsu Kikai Kogyo:Kk Method and equipment for correcting arrangement of lead of digital element
DE4403804C1 (en) 1994-02-08 1995-02-16 Rood Technology Deutschland Gm Device for aligning the contact feet arranged on the edge of an IC component
US5826630A (en) 1996-09-30 1998-10-27 Semiconductor Technologies & Instruments, Inc. J-lead conditioning method and apparatus
US6014993A (en) * 1998-03-27 2000-01-18 Mcms, Inc. Method and apparatus for configuring component leads

Also Published As

Publication number Publication date
US20030009255A1 (en) 2003-01-09
US6654658B2 (en) 2003-11-25
WO2002051229A2 (en) 2002-06-27
WO2002051229A3 (en) 2002-10-10

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