AU2002227246A1 - Liquid crystalline polymer bond plies and circuits formed therefrom - Google Patents

Liquid crystalline polymer bond plies and circuits formed therefrom

Info

Publication number
AU2002227246A1
AU2002227246A1 AU2002227246A AU2724602A AU2002227246A1 AU 2002227246 A1 AU2002227246 A1 AU 2002227246A1 AU 2002227246 A AU2002227246 A AU 2002227246A AU 2724602 A AU2724602 A AU 2724602A AU 2002227246 A1 AU2002227246 A1 AU 2002227246A1
Authority
AU
Australia
Prior art keywords
liquid crystalline
crystalline polymer
formed therefrom
circuits formed
polymer bond
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002227246A
Inventor
Scott Kennedy
Michael E. St. Lawrence
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
World Properties Inc
Original Assignee
World Properties Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by World Properties Inc filed Critical World Properties Inc
Publication of AU2002227246A1 publication Critical patent/AU2002227246A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/085—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising polyolefins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B32B15/092—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/32—Layered products comprising a layer of synthetic resin comprising polyolefins
    • B32B27/322—Layered products comprising a layer of synthetic resin comprising polyolefins comprising halogenated polyolefins, e.g. PTFE
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
    • B29K2105/0079—Liquid crystals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/202—Conductive
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/02—Temperature
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/12—Pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2327/00—Polyvinylhalogenides
    • B32B2327/12—Polyvinylhalogenides containing fluorine
    • B32B2327/18—PTFE, i.e. polytetrafluoroethylene
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2363/00—Epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K2323/00—Functional layers of liquid crystal optical display excluding electroactive liquid crystal layer characterised by chemical composition
    • C09K2323/02—Alignment layer characterised by chemical composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0141—Liquid crystal polymer [LCP]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y10T428/24917—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.] including metal layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31678—Of metal
    • Y10T428/31681—Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]
AU2002227246A 2000-12-14 2001-12-04 Liquid crystalline polymer bond plies and circuits formed therefrom Abandoned AU2002227246A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US25559700P 2000-12-14 2000-12-14
US60/255,597 2000-12-14
PCT/US2001/046671 WO2002049404A2 (en) 2000-12-14 2001-12-04 Liquid crystalline polymer bond plies and circuits formed therefrom

Publications (1)

Publication Number Publication Date
AU2002227246A1 true AU2002227246A1 (en) 2002-06-24

Family

ID=22969034

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002227246A Abandoned AU2002227246A1 (en) 2000-12-14 2001-12-04 Liquid crystalline polymer bond plies and circuits formed therefrom

Country Status (5)

Country Link
US (2) US6602583B2 (en)
EP (1) EP1342394A2 (en)
JP (1) JP2004516662A (en)
AU (1) AU2002227246A1 (en)
WO (1) WO2002049404A2 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020158305A1 (en) * 2001-01-05 2002-10-31 Sidharth Dalmia Organic substrate having integrated passive components
US6826830B2 (en) * 2002-02-05 2004-12-07 International Business Machines Corporation Multi-layered interconnect structure using liquid crystalline polymer dielectric
US7260890B2 (en) * 2002-06-26 2007-08-28 Georgia Tech Research Corporation Methods for fabricating three-dimensional all organic interconnect structures
US6987307B2 (en) * 2002-06-26 2006-01-17 Georgia Tech Research Corporation Stand-alone organic-based passive devices
US6900708B2 (en) * 2002-06-26 2005-05-31 Georgia Tech Research Corporation Integrated passive devices fabricated utilizing multi-layer, organic laminates
US20040040651A1 (en) * 2002-08-28 2004-03-04 Kuraray Co., Ltd. Multi-layer circuit board and method of making the same
JP2005539382A (en) 2002-09-16 2005-12-22 ワールド・プロパティーズ・インコーポレイテッド Liquid crystal polymer composite, method for producing the same, and article formed therefrom
US7489914B2 (en) * 2003-03-28 2009-02-10 Georgia Tech Research Corporation Multi-band RF transceiver with passive reuse in organic substrates
WO2004114732A1 (en) 2003-06-19 2004-12-29 World Properties, Inc. Material including a liquid crystalline polymer and a polyhedral oligomeric silsesquioxane (poss) filler
US7549220B2 (en) * 2003-12-17 2009-06-23 World Properties, Inc. Method for making a multilayer circuit
CN1914961A (en) * 2004-01-20 2007-02-14 环球产权公司 Circuit materials, circuits, multi-layer circuits, and methods of manufacture thereof
US20050274455A1 (en) * 2004-06-09 2005-12-15 Extrand Charles W Electro-active adhesive systems
US8345433B2 (en) * 2004-07-08 2013-01-01 Avx Corporation Heterogeneous organic laminate stack ups for high frequency applications
KR100584962B1 (en) * 2004-07-26 2006-05-29 삼성전기주식회사 Rigid-flexible PCB having a coverlay made from Liquid Crystal Polymer and manufacturing method thereof
US7768619B2 (en) 2004-08-03 2010-08-03 Harris Corporation Method and apparatus for sealing flex circuits made with an LCP substrate
US7343675B2 (en) 2004-11-12 2008-03-18 Harris Corporation Method of constructing a structural circuit
US7128801B2 (en) * 2005-02-03 2006-10-31 Harris Corporation Method and apparatus for sealing flex circuits having heat sensitive circuit elements
US7524388B2 (en) * 2005-05-10 2009-04-28 World Properties, Inc. Composites, method of manufacture thereof, and articles formed therefrom
US7439840B2 (en) 2006-06-27 2008-10-21 Jacket Micro Devices, Inc. Methods and apparatuses for high-performing multi-layer inductors
US7808434B2 (en) * 2006-08-09 2010-10-05 Avx Corporation Systems and methods for integrated antennae structures in multilayer organic-based printed circuit devices
US7989895B2 (en) 2006-11-15 2011-08-02 Avx Corporation Integration using package stacking with multi-layer organic substrates
JP2010524265A (en) 2007-04-11 2010-07-15 ワールド プラパティーズ、 インコーポレイテッド Circuit material, multilayer circuit, and method for manufacturing the same
JP5151265B2 (en) * 2007-06-14 2013-02-27 日立電線株式会社 Multilayer wiring board and method for manufacturing multilayer wiring board
TWI405709B (en) * 2008-11-17 2013-08-21 Univ Nat Cheng Kung Fluidic chip and method for making the same
FR2940879B1 (en) * 2009-01-06 2012-12-21 Thales Sa METHOD OF MAKING A PRINTED BOARD AND CORRESPONDING PRINTED BOARD
US8143530B1 (en) * 2010-09-17 2012-03-27 Endicott Interconnect Technologies, Inc. Liquid crystal polymer layer for encapsulation and improved hermiticity of circuitized substrates
US9145469B2 (en) 2012-09-27 2015-09-29 Ticona Llc Aromatic polyester containing a biphenyl chain disruptor
WO2016003588A1 (en) 2014-07-01 2016-01-07 Ticona Llc Laser activatable polymer composition
JP6642194B2 (en) * 2016-03-29 2020-02-05 味の素株式会社 Manufacturing method of printed wiring board
US10923723B1 (en) * 2017-05-11 2021-02-16 Richard Carl Auchterlonie Electro-conductive polymers of halogenated para-aminophenol, and electrochemical cells employing same
KR20220162146A (en) * 2020-03-27 2022-12-07 로저스코포레이션 Flexible Dielectric Material Comprising a Biaxially-Oriented Polytetrafluoroethylene Reinforced Layer
CN112159545B (en) * 2020-09-04 2021-12-21 瑞声新能源发展(常州)有限公司科教城分公司 Heat treatment method of liquid crystal polymer film and modified liquid crystal polymer film
CN113613411B (en) * 2021-09-23 2023-04-07 浙江清华柔性电子技术研究院 Flexible circuit substrate and preparation method and application thereof

Family Cites Families (52)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1876120A (en) * 1929-05-08 1932-09-06 Frank D Wilson Carton
US4863767A (en) 1984-04-13 1989-09-05 Hoechst Celanese Corporation Method of adhesive bonding by use of thermotropic liquid crystal polymers
JPS61130046A (en) 1984-11-28 1986-06-17 ポリプラスチックス株式会社 Manufacture of laminated film
US4973442A (en) 1985-09-26 1990-11-27 Foster Miller Inc. Forming biaxially oriented ordered polymer films
JP2517568B2 (en) * 1986-11-13 1996-07-24 ポリプラスチックス株式会社 Liquid crystalline copolyester with molecular chain ends blocked
US4966806A (en) * 1986-12-16 1990-10-30 Foster Miller, Inc. Film-based structural components with controlled coefficient of thermal expansion
US4871595A (en) * 1986-12-16 1989-10-03 Foster Miller, Inc. Lyotropic liquid crystalline oriented polymer substrate for printed wire board
US4876120A (en) * 1987-04-21 1989-10-24 General Electric Company Tailorable multi-layer printed wiring boards of controlled coefficient of thermal expansion
DE3737922A1 (en) 1987-11-07 1989-05-18 Basf Ag COMPOSITE MATERIAL FROM HIGH-TEMPERATURE-RESISTANT POLYMERS AND DIRECTLY APPLIED METAL LAYERS
US4966807A (en) 1988-06-13 1990-10-30 Foster Miller, Inc. Multiaxially oriented thermotropic polymer films and method of preparation
US4975312A (en) 1988-06-20 1990-12-04 Foster-Miller, Inc. Multiaxially oriented thermotropic polymer substrate for printed wire board
JPH03501748A (en) * 1988-10-11 1991-04-18 アモコ・コーポレーシヨン Blends of a liquid crystalline polymer of hydroquinone poly(iso-terephthalate) p-hydroxybenzoic acid polymer and another LCP containing oxybisbenzene and naphthalene derivatives
US5079289A (en) * 1988-10-11 1992-01-07 Amoco Corporation High modulus, high strength melt-processible polyester of hydroquinone poly (iso-terephthalates) containing residues of a p-hydroxybenzoic acid
US5147967A (en) * 1988-10-11 1992-09-15 Amoco Corporation High strength polymer of hydroquinone poly(iso-terephthalate) containing residues of p-hydroxybenzoic acid
US5164458A (en) 1989-04-28 1992-11-17 Synthetic Products Company High performance engineering polymer compositions
US5288529A (en) 1989-06-16 1994-02-22 Foster-Miller Inc. Liquid crystal polymer film
US5085015A (en) * 1990-06-26 1992-02-04 E. I. Du Pont De Nemours And Company Process for improving the surface of liquid crystal polymers
WO1992005953A1 (en) * 1990-09-28 1992-04-16 Daicel Chemical Industries, Ltd. Composite metal plate
DE69124193T2 (en) * 1990-11-07 1997-06-05 Hoechst Celanese Corp Reworking a liquid crystalline film by rolling
JP3245437B2 (en) * 1991-04-05 2002-01-15 株式会社クラレ Manufacturing method of laminate
JP3090706B2 (en) * 1991-04-08 2000-09-25 株式会社クラレ Method for producing film composed of liquid crystal polymer
JPH04367763A (en) 1991-06-14 1992-12-21 Mitsubishi Plastics Ind Ltd Preparation of synthetic resin coated metal plate
JPH0597614A (en) 1991-10-01 1993-04-20 Nissan Chem Ind Ltd Herbicide composition
US5360572A (en) * 1991-11-29 1994-11-01 The United States Of America As Represented By The Secretary Of The Air Force Aerogel mesh getter
US5259110A (en) 1992-04-03 1993-11-09 International Business Machines Corporation Method for forming a multilayer microelectronic wiring module
US6027771A (en) 1993-02-25 2000-02-22 Moriya; Akira Liquid crystal polymer film and a method for manufacturing the same
US5681624A (en) 1993-02-25 1997-10-28 Japan Gore-Tex, Inc. Liquid crystal polymer film and a method for manufacturing the same
DE69426026T2 (en) 1994-05-18 2001-05-17 Polyplastics Co METHOD FOR PRODUCING A CONDUCTIVE CIRCUIT ON THE SURFACE OF A MOLDED BODY
JP2590435B2 (en) 1994-06-06 1997-03-12 工業技術院長 Method for producing liquid crystalline polymer microspheres
JP2939477B2 (en) 1994-08-16 1999-08-25 エイチエヌエイ・ホールディングス・インコーポレーテッド Liquid crystal polymer-metal laminate and method for producing the laminate
US5529740A (en) 1994-09-16 1996-06-25 Jester; Randy D. Process for treating liquid crystal polymer film
US5719354A (en) 1994-09-16 1998-02-17 Hoechst Celanese Corp. Monolithic LCP polymer microelectronic wiring modules
US5545475A (en) * 1994-09-20 1996-08-13 W. L. Gore & Associates Microfiber-reinforced porous polymer film and a method for manufacturing the same and composites made thereof
US5863366A (en) * 1995-06-07 1999-01-26 Heartport, Inc. Method of manufacture of a cannula for a medical device
US5847039A (en) * 1995-06-09 1998-12-08 Sumitomo Chemical Company, Limited Liquid crystalline polyester resin compositions
WO1997019127A1 (en) 1995-11-22 1997-05-29 Hoechst Celanese Corporation Liquid crystal polymer films
DE19604158A1 (en) * 1996-02-06 1997-08-07 Hilti Ag Device for testing holding force of fastening anchors etc.
DE69712551T3 (en) 1996-02-19 2008-02-21 Sumitomo Chemical Co. Ltd. Liquid crystalline polyester resin composition
US5863666A (en) 1997-08-07 1999-01-26 Gould Electronics Inc. High performance flexible laminate
EP0865905B1 (en) * 1997-03-19 2004-09-15 Sumitomo Chemical Company, Limited Laminate of liquid crystal polyester resin composition
JP2000044797A (en) 1998-04-06 2000-02-15 Kuraray Co Ltd Liquid crystalline polymer film and laminate, preparation of them, and multilayered mounting circuit base board
CN1116164C (en) 1998-04-09 2003-07-30 可乐丽股份有限公司 Method of forming polymer film coating and method for preparing laminated body of polymer layer and metal foil layer
US6565954B2 (en) 1998-05-14 2003-05-20 Matsushita Electric Industrial Co., Ltd. Circuit board and method of manufacturing the same
CA2273542A1 (en) 1998-06-23 1999-12-23 Nelco International Corporation Thin film laminates
JP4216433B2 (en) * 1999-03-29 2009-01-28 株式会社クラレ Method for producing metal-clad laminate for circuit board
JP3860679B2 (en) 1999-03-30 2006-12-20 株式会社クラレ Method for modifying thermoplastic liquid crystal polymer film
US6296949B1 (en) 1999-09-16 2001-10-02 Ga-Tek Inc. Copper coated polyimide with metallic protective layer
US6374242B1 (en) * 1999-09-29 2002-04-16 Lockheed Martin Corporation Natural-language information processor with association searches limited within blocks
JP2001244630A (en) 2000-02-25 2001-09-07 Kuraray Co Ltd Multilayer interconnection circuit board and manufacturing method therefor
US6403211B1 (en) 2000-07-18 2002-06-11 3M Innovative Properties Company Liquid crystal polymer for flexible circuits
US6923919B2 (en) 2000-07-18 2005-08-02 3M Innovative Properties Company Liquid crystal polymers for flexible circuits
EP1194020A3 (en) 2000-09-27 2004-03-31 Matsushita Electric Industrial Co., Ltd. Resin board, manufacturing process for resin board, connection medium body, circuit board and manufacturing process for circuit board

Also Published As

Publication number Publication date
US20020076538A1 (en) 2002-06-20
WO2002049404A2 (en) 2002-06-20
JP2004516662A (en) 2004-06-03
WO2002049404A3 (en) 2003-02-27
US20030207048A1 (en) 2003-11-06
US6602583B2 (en) 2003-08-05
EP1342394A2 (en) 2003-09-10

Similar Documents

Publication Publication Date Title
AU2002227246A1 (en) Liquid crystalline polymer bond plies and circuits formed therefrom
AU2001236895A1 (en) Integrated circuit
MXPA03005901A (en) Hot-melt adhesive based on blend of amorphous and crystalline polymers for multilayer bonding.
AU2002211686A1 (en) Bandage using molecular sieves
AU2002218182A1 (en) Adhesives having barrier properties
AU2001229781A1 (en) Block copolymer based hot melt adhesive
AU2002366084A1 (en) Absorbent articles having improved stretchability
AU2002220062A1 (en) Highly functional polymer latex
AU1850702A (en) Rubber-modified resin and thermoplastic resin composition containing the same
AU4647601A (en) Vascular device
AU2001251080A1 (en) Absorbent articles
AU2001261442A1 (en) Polymer blends and articles produced therewith
AU2002213767A1 (en) Tenacity plastic and its preparation method
AU3759301A (en) Polymeric films and packages produced therefrom
AU2001276749A1 (en) Polymer composition
AU2001288086A1 (en) Vulcanizable adhesive composition
AU2002344368A1 (en) Biodegradable biaxially drawn film with controlled tear resistance
AU2002214840A1 (en) Photoluminescent plastic aggregates
AU2001271517A1 (en) Coextruded plastic catheter
AU2002232838A1 (en) Two-port demodulation device
AU3979700A (en) Use of osseo-promotive membranes in orthopaedics
AU2001237402A1 (en) Absorbent articles
AU2001229664A1 (en) Thermoplastic adhesive
AU7521200A (en) Decorative film with integrated break line
AU1441501A (en) Biodegradable thermoplastic composition