AU2002220666A1 - Method for depositing especially, crystalline layers and device for carrying out the method - Google Patents
Method for depositing especially, crystalline layers and device for carrying out the methodInfo
- Publication number
- AU2002220666A1 AU2002220666A1 AU2002220666A AU2066602A AU2002220666A1 AU 2002220666 A1 AU2002220666 A1 AU 2002220666A1 AU 2002220666 A AU2002220666 A AU 2002220666A AU 2066602 A AU2066602 A AU 2066602A AU 2002220666 A1 AU2002220666 A1 AU 2002220666A1
- Authority
- AU
- Australia
- Prior art keywords
- carrying
- crystalline layers
- depositing especially
- depositing
- crystalline
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/14—Feed and outlet means for the gases; Modifying the flow of the reactive gases
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
- C23C16/455—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating characterised by the method used for introducing gases into reaction chamber or for modifying gas flows in reaction chamber
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10057134.4 | 2000-11-17 | ||
DE10057134A DE10057134A1 (en) | 2000-11-17 | 2000-11-17 | Process for depositing crystalline layers onto crystalline substrates in a process chamber of a CVD reactor comprises adjusting the kinematic viscosity of the carrier gas mixed |
PCT/EP2001/012467 WO2002044445A1 (en) | 2000-11-17 | 2001-10-27 | Method for depositing especially, crystalline layers and device for carrying out the method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002220666A1 true AU2002220666A1 (en) | 2002-06-11 |
Family
ID=7663706
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002220666A Abandoned AU2002220666A1 (en) | 2000-11-17 | 2001-10-27 | Method for depositing especially, crystalline layers and device for carrying out the method |
Country Status (7)
Country | Link |
---|---|
US (1) | US6972050B2 (en) |
JP (1) | JP4303966B2 (en) |
KR (1) | KR20030091937A (en) |
AU (1) | AU2002220666A1 (en) |
DE (1) | DE10057134A1 (en) |
TW (1) | TW574446B (en) |
WO (1) | WO2002044445A1 (en) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10043601A1 (en) * | 2000-09-01 | 2002-03-14 | Aixtron Ag | Device and method for depositing, in particular, crystalline layers on, in particular, crystalline substrates |
DE10320597A1 (en) * | 2003-04-30 | 2004-12-02 | Aixtron Ag | Method and device for depositing semiconductor layers with two process gases, one of which is preconditioned |
DE102004009130A1 (en) * | 2004-02-25 | 2005-09-15 | Aixtron Ag | Inlet system for a MOCVD reactor |
JP4598568B2 (en) * | 2005-03-09 | 2010-12-15 | 大陽日酸株式会社 | Vapor growth equipment |
DE102005056320A1 (en) * | 2005-11-25 | 2007-06-06 | Aixtron Ag | CVD reactor with a gas inlet member |
US20080314311A1 (en) * | 2007-06-24 | 2008-12-25 | Burrows Brian H | Hvpe showerhead design |
US20090149008A1 (en) * | 2007-10-05 | 2009-06-11 | Applied Materials, Inc. | Method for depositing group iii/v compounds |
US20090141436A1 (en) * | 2007-11-30 | 2009-06-04 | Yoshimichi Matsuoka | Trim element for housing of computing device |
EP2353176A4 (en) * | 2008-11-07 | 2013-08-28 | Asm Inc | Reaction chamber |
US8183132B2 (en) * | 2009-04-10 | 2012-05-22 | Applied Materials, Inc. | Methods for fabricating group III nitride structures with a cluster tool |
US8491720B2 (en) | 2009-04-10 | 2013-07-23 | Applied Materials, Inc. | HVPE precursor source hardware |
US8138069B2 (en) * | 2009-04-24 | 2012-03-20 | Applied Materials, Inc. | Substrate pretreatment for subsequent high temperature group III depositions |
US20100273291A1 (en) * | 2009-04-28 | 2010-10-28 | Applied Materials, Inc. | Decontamination of mocvd chamber using nh3 purge after in-situ cleaning |
US20110256692A1 (en) | 2010-04-14 | 2011-10-20 | Applied Materials, Inc. | Multiple precursor concentric delivery showerhead |
TWI534291B (en) | 2011-03-18 | 2016-05-21 | 應用材料股份有限公司 | Showerhead assembly |
DE102011054566A1 (en) * | 2011-10-18 | 2013-04-18 | Aixtron Se | Method for separating multi-component metal-organic semiconductor layers on substrate, involves enabling process gas total flow so that partial fluxes are introduced in process chamber to optimize lateral homogeneity on deposited layer |
DE102011056538A1 (en) | 2011-12-16 | 2013-06-20 | Aixtron Se | Method for removing unwanted residues of process chamber of chemical vapor deposition reactor, involves forming non-volatile intermediate, so that surface coverage degree of residue is increased/decreased at respective phases of cycle |
US20130171350A1 (en) * | 2011-12-29 | 2013-07-04 | Intermolecular Inc. | High Throughput Processing Using Metal Organic Chemical Vapor Deposition |
TWI624561B (en) * | 2016-08-12 | 2018-05-21 | 漢民科技股份有限公司 | Gas injector for semiconductor processes and film deposition apparatus |
RU2673515C2 (en) | 2017-02-02 | 2018-11-27 | Общество С Ограниченной Ответственностью "Монолюм" | Gases to the reactor supplying method for the group iii metals nitrides based epitaxial structures growing and device for its implementation |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0691020B2 (en) * | 1986-02-14 | 1994-11-14 | 日本電信電話株式会社 | Vapor growth method and apparatus |
US4844006A (en) * | 1988-03-07 | 1989-07-04 | Akzo America Inc. | Apparatus to provide a vaporized reactant for chemical-vapor deposition |
JPH04175294A (en) * | 1990-11-09 | 1992-06-23 | Fujitsu Ltd | Vapor growth equipment |
EP0548990B1 (en) * | 1991-12-26 | 1997-03-12 | Canon Kabushiki Kaisha | Chemical vapor deposition method for forming a deposited film with the use of a liquid raw material and apparatus suitable for practising said method |
US6337102B1 (en) * | 1997-11-17 | 2002-01-08 | The Trustees Of Princeton University | Low pressure vapor phase deposition of organic thin films |
DE19855637A1 (en) * | 1998-12-02 | 2000-06-15 | Aixtron Ag | Process and system for semiconductor crystal production with temperature management |
-
2000
- 2000-11-17 DE DE10057134A patent/DE10057134A1/en not_active Withdrawn
-
2001
- 2001-10-27 JP JP2002546789A patent/JP4303966B2/en not_active Expired - Fee Related
- 2001-10-27 AU AU2002220666A patent/AU2002220666A1/en not_active Abandoned
- 2001-10-27 KR KR10-2003-7006038A patent/KR20030091937A/en not_active Application Discontinuation
- 2001-10-27 WO PCT/EP2001/012467 patent/WO2002044445A1/en active Application Filing
- 2001-11-15 TW TW90128323A patent/TW574446B/en active
-
2003
- 2003-05-15 US US10/439,195 patent/US6972050B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
WO2002044445A9 (en) | 2003-08-07 |
KR20030091937A (en) | 2003-12-03 |
TW574446B (en) | 2004-02-01 |
WO2002044445A1 (en) | 2002-06-06 |
DE10057134A1 (en) | 2002-05-23 |
US6972050B2 (en) | 2005-12-06 |
US20040013801A1 (en) | 2004-01-22 |
JP4303966B2 (en) | 2009-07-29 |
JP2004514642A (en) | 2004-05-20 |
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