AU2002215091A1 - Integrated circuit connection by conductive deposition through a perforated film - Google Patents
Integrated circuit connection by conductive deposition through a perforated filmInfo
- Publication number
- AU2002215091A1 AU2002215091A1 AU2002215091A AU1509102A AU2002215091A1 AU 2002215091 A1 AU2002215091 A1 AU 2002215091A1 AU 2002215091 A AU2002215091 A AU 2002215091A AU 1509102 A AU1509102 A AU 1509102A AU 2002215091 A1 AU2002215091 A1 AU 2002215091A1
- Authority
- AU
- Australia
- Prior art keywords
- integrated circuit
- circuit connection
- perforated film
- conductive deposition
- deposition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
- G06K19/07747—Mounting details of integrated circuit chips at least one of the integrated circuit chips being mounted as a module
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49827—Via connections through the substrates, e.g. pins going through the substrate, coaxial cables
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/4985—Flexible insulating substrates
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- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5388—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates for flat cards, e.g. credit cards
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- H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
- H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
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- H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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- H01L2223/66—High-frequency adaptations
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- H01L2224/481—Disposition
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
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- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
- H01L2224/48228—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item the bond pad being disposed in a recess of the surface of the item
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
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- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0013940 | 2000-10-30 | ||
FR0013940A FR2816107B1 (en) | 2000-10-30 | 2000-10-30 | MOVIE INTEGRATED CIRCUIT MODULE AND MANUFACTURING METHOD THEREOF |
PCT/FR2001/003375 WO2002037553A1 (en) | 2000-10-30 | 2001-10-30 | Integrated circuit connection by conductive deposition through a perforated film |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002215091A1 true AU2002215091A1 (en) | 2002-05-15 |
Family
ID=8855908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002215091A Abandoned AU2002215091A1 (en) | 2000-10-30 | 2001-10-30 | Integrated circuit connection by conductive deposition through a perforated film |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2002215091A1 (en) |
FR (1) | FR2816107B1 (en) |
WO (1) | WO2002037553A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1821241A3 (en) * | 2006-02-15 | 2008-07-23 | Assa Abloy AB | Hybrid frequency contactless transponder unit, module for and method of manufacturing |
EP1821242A1 (en) * | 2006-02-15 | 2007-08-22 | Assa Abloy Identification Technology Group AB | Contactless multi-frequency transponder unit, its electronic module and method for manufacturing the unit. |
EP3422828A1 (en) * | 2017-06-29 | 2019-01-02 | voestalpine Stahl GmbH | Method and device for producing an electrical connector contact - kontaktinator |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4246595A (en) * | 1977-03-08 | 1981-01-20 | Matsushita Electric Industrial Co., Ltd. | Electronics circuit device and method of making the same |
FR2527036A1 (en) * | 1982-05-14 | 1983-11-18 | Radiotechnique Compelec | METHOD FOR CONNECTING A SEMICONDUCTOR TO ELEMENTS OF A SUPPORT, PARTICULARLY A PORTABLE CARD |
FR2738077B1 (en) * | 1995-08-23 | 1997-09-19 | Schlumberger Ind Sa | ELECTRONIC MICRO-BOX FOR ELECTRONIC MEMORY CARD AND EMBODIMENT PROCESS |
JPH10138671A (en) * | 1996-11-12 | 1998-05-26 | Citizen Watch Co Ltd | Module for ic card |
FR2779851B1 (en) * | 1998-06-12 | 2002-11-29 | Gemplus Card Int | METHOD FOR MANUFACTURING AN INTEGRATED CIRCUIT CARD AND CARD OBTAINED |
DE19830540A1 (en) * | 1998-07-08 | 2000-01-13 | Siemens Ag | Electronic flexible type circuit board especially for power semiconductors, sensors and passive components |
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2000
- 2000-10-30 FR FR0013940A patent/FR2816107B1/en not_active Expired - Fee Related
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2001
- 2001-10-30 WO PCT/FR2001/003375 patent/WO2002037553A1/en active Application Filing
- 2001-10-30 AU AU2002215091A patent/AU2002215091A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2002037553A1 (en) | 2002-05-10 |
FR2816107B1 (en) | 2003-11-28 |
FR2816107A1 (en) | 2002-05-03 |
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