AU2001296724A1 - Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device - Google Patents

Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device

Info

Publication number
AU2001296724A1
AU2001296724A1 AU2001296724A AU9672401A AU2001296724A1 AU 2001296724 A1 AU2001296724 A1 AU 2001296724A1 AU 2001296724 A AU2001296724 A AU 2001296724A AU 9672401 A AU9672401 A AU 9672401A AU 2001296724 A1 AU2001296724 A1 AU 2001296724A1
Authority
AU
Australia
Prior art keywords
methods
forming
device including
microelectronic magnetic
microelectronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001296724A
Inventor
Thomas P. Duffy
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Primarion Inc
Original Assignee
Primarion Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Primarion Inc filed Critical Primarion Inc
Publication of AU2001296724A1 publication Critical patent/AU2001296724A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/0006—Printed inductances
    • H01F17/0033—Printed inductances with the coil helically wound around a magnetic core
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
    • H01F41/041—Printed circuit coils
    • H01F41/046—Printed circuit coils structurally combined with ferromagnetic material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/165—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00—Fixed inductances of the signal type 
    • H01F17/04—Fixed inductances of the signal type  with magnetic core
    • H01F17/06—Fixed inductances of the signal type  with magnetic core with core substantially closed in itself, e.g. toroid
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/08—Magnetic details
    • H05K2201/083—Magnetic materials
    • H05K2201/086—Magnetic materials for inductive purposes, e.g. printed inductor with ferrite core
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/097—Alternating conductors, e.g. alternating different shaped pads, twisted pairs; Alternating components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/4902—Electromagnet, transformer or inductor
    • Y10T29/49075—Electromagnet, transformer or inductor including permanent magnet or core
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base
    • Y10T29/49165—Manufacturing circuit on or in base by forming conductive walled aperture in base
AU2001296724A 2000-10-10 2001-10-09 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device Abandoned AU2001296724A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US23899400P 2000-10-10 2000-10-10
US60238994 2000-10-10
PCT/US2001/031457 WO2002032198A2 (en) 2000-10-10 2001-10-09 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device

Publications (1)

Publication Number Publication Date
AU2001296724A1 true AU2001296724A1 (en) 2002-04-22

Family

ID=22900179

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001296724A Abandoned AU2001296724A1 (en) 2000-10-10 2001-10-09 Microelectronic magnetic structure, device including the structure, and methods of forming the structure and device

Country Status (4)

Country Link
US (1) US20020047768A1 (en)
AU (1) AU2001296724A1 (en)
TW (1) TW511419B (en)
WO (1) WO2002032198A2 (en)

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AU2001263348A1 (en) 2000-05-19 2001-12-03 Philip A. Harding Slot core transformers
US8749054B2 (en) 2010-06-24 2014-06-10 L. Pierre de Rochemont Semiconductor carrier with vertical power FET module
US7135952B2 (en) * 2002-09-16 2006-11-14 Multi-Fineline Electronix, Inc. Electronic transformer/inductor devices and methods for making same
EP2426785A2 (en) 2004-10-01 2012-03-07 L. Pierre De Rochemont Ceramic antenna module and methods of manufacture thereof
US7436282B2 (en) 2004-12-07 2008-10-14 Multi-Fineline Electronix, Inc. Miniature circuitry and inductive components and methods for manufacturing same
KR101165116B1 (en) 2004-12-07 2012-07-12 멀티-파인라인 일렉트로닉스, 인크. Miniature circuitry and inductive componets and methods for manufacturing same
US7642628B2 (en) * 2005-01-11 2010-01-05 Rosemount Inc. MEMS packaging with improved reaction to temperature changes
US8715839B2 (en) 2005-06-30 2014-05-06 L. Pierre de Rochemont Electrical components and method of manufacture
US8350657B2 (en) 2005-06-30 2013-01-08 Derochemont L Pierre Power management module and method of manufacture
US10431367B2 (en) * 2005-09-22 2019-10-01 Radial Electronics, Inc. Method for gapping an embedded magnetic device
TWI295102B (en) * 2006-01-13 2008-03-21 Ind Tech Res Inst Multi-functional substrate structure
US8354294B2 (en) 2006-01-24 2013-01-15 De Rochemont L Pierre Liquid chemical deposition apparatus and process and products therefrom
US7645941B2 (en) 2006-05-02 2010-01-12 Multi-Fineline Electronix, Inc. Shielded flexible circuits and methods for manufacturing same
US7352270B1 (en) 2006-10-27 2008-04-01 Itt Manufacturing Enterprises, Inc. Printed circuit board with magnetic assembly
US7959598B2 (en) 2008-08-20 2011-06-14 Asante Solutions, Inc. Infusion pump systems and methods
US8922347B1 (en) 2009-06-17 2014-12-30 L. Pierre de Rochemont R.F. energy collection circuit for wireless devices
US8952858B2 (en) 2009-06-17 2015-02-10 L. Pierre de Rochemont Frequency-selective dipole antennas
US8456266B2 (en) * 2009-06-22 2013-06-04 Engineered Products Of Virginia, Llc Transformer coil assembly
US8598797B2 (en) * 2010-05-18 2013-12-03 Luxera, Inc. LED driver for driving LED lighting device at high frequency
US8552708B2 (en) 2010-06-02 2013-10-08 L. Pierre de Rochemont Monolithic DC/DC power management module with surface FET
US9023493B2 (en) 2010-07-13 2015-05-05 L. Pierre de Rochemont Chemically complex ablative max-phase material and method of manufacture
JP5976648B2 (en) 2010-08-23 2016-08-24 デ，ロシェモント，エル．，ピエール Power FET with resonant transistor gate
CN103415925A (en) 2010-11-03 2013-11-27 L·皮尔·德罗什蒙 Semiconductor chip carriers with monolithically integrated quantum dot devices and method of manufacture thereof
US20140253279A1 (en) * 2013-03-08 2014-09-11 Qualcomm Incorporated Coupled discrete inductor with flux concentration using high permeable material
KR20150126914A (en) * 2013-03-11 2015-11-13 본스인코오포레이티드 Devices and methods related to laminated polymeric planar magnetics
CN107112111B (en) * 2015-01-07 2018-10-19 株式会社村田制作所 Coil component
GB2535765B (en) * 2015-02-26 2019-06-19 Murata Manufacturing Co Embedded magnetic component transformer device
US10275573B2 (en) 2016-01-13 2019-04-30 Bigfoot Biomedical, Inc. User interface for diabetes management system
US10806859B2 (en) 2016-01-14 2020-10-20 Bigfoot Biomedical, Inc. Adjusting insulin delivery rates
WO2018132765A1 (en) 2017-01-13 2018-07-19 Mazlish Bryan Insulin delivery methods, systems and devices
US10923417B2 (en) * 2017-04-26 2021-02-16 Taiwan Semiconductor Manufacturing Company Limited Integrated fan-out package with 3D magnetic core inductor
US10003337B1 (en) * 2017-05-17 2018-06-19 International Business Machines Corporation Resonant virtual supply booster for synchronous logic circuits and other circuits with use of on-chip integrated magnetic inductor
USD874471S1 (en) 2017-06-08 2020-02-04 Insulet Corporation Display screen with a graphical user interface
USD928199S1 (en) 2018-04-02 2021-08-17 Bigfoot Biomedical, Inc. Medication delivery device with icons
USD920343S1 (en) 2019-01-09 2021-05-25 Bigfoot Biomedical, Inc. Display screen or portion thereof with graphical user interface associated with insulin delivery
USD977502S1 (en) 2020-06-09 2023-02-07 Insulet Corporation Display screen with graphical user interface

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US3898595A (en) * 1970-11-02 1975-08-05 Cunningham Corp Magnetic printed circuit
US5070317A (en) * 1989-01-17 1991-12-03 Bhagat Jayant K Miniature inductor for integrated circuits and devices
US5781091A (en) * 1995-07-24 1998-07-14 Autosplice Systems Inc. Electronic inductive device and method for manufacturing
US5942965A (en) * 1996-09-13 1999-08-24 Murata Manufacturing Co., Ltd. Multilayer substrate
JPH10116746A (en) * 1996-10-09 1998-05-06 Kokusai Electric Co Ltd Manufacture of thin-film inductor element
JP4030028B2 (en) * 1996-12-26 2008-01-09 シチズン電子株式会社 SMD type circuit device and manufacturing method thereof
JP2000182851A (en) * 1998-12-15 2000-06-30 Matsushita Electric Ind Co Ltd Inductor
US6278264B1 (en) * 2000-02-04 2001-08-21 Volterra Semiconductor Corporation Flip-chip switching regulator

Also Published As

Publication number Publication date
WO2002032198A3 (en) 2002-06-13
US20020047768A1 (en) 2002-04-25
WO2002032198A2 (en) 2002-04-18
TW511419B (en) 2002-11-21

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