AU2001292244A1 - Resist pattern, process for producing the same, and utilization thereof - Google Patents
Resist pattern, process for producing the same, and utilization thereofInfo
- Publication number
- AU2001292244A1 AU2001292244A1 AU2001292244A AU9224401A AU2001292244A1 AU 2001292244 A1 AU2001292244 A1 AU 2001292244A1 AU 2001292244 A AU2001292244 A AU 2001292244A AU 9224401 A AU9224401 A AU 9224401A AU 2001292244 A1 AU2001292244 A1 AU 2001292244A1
- Authority
- AU
- Australia
- Prior art keywords
- utilization
- producing
- same
- resist pattern
- resist
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
- G03F7/028—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with photosensitivity-increasing substances, e.g. photoinitiators
- G03F7/031—Organic compounds not covered by group G03F7/029
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/0045—Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
- G03F7/091—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers characterised by antireflection means or light filtering or absorbing means, e.g. anti-halation, contrast enhancement
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
- H05K3/061—Etching masks
- H05K3/064—Photoresists
Applications Claiming Priority (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000-293255 | 2000-09-27 | ||
| JP2000293255 | 2000-09-27 | ||
| JP2000-320168 | 2000-10-20 | ||
| JP2000320168 | 2000-10-20 | ||
| JP2001-275523 | 2001-09-11 | ||
| JP2001275523 | 2001-09-11 | ||
| PCT/JP2001/008356 WO2002027407A1 (en) | 2000-09-27 | 2001-09-26 | Resist pattern, process for producing the same, and utilization thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001292244A1 true AU2001292244A1 (en) | 2002-04-08 |
Family
ID=27344757
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001292244A Abandoned AU2001292244A1 (en) | 2000-09-27 | 2001-09-26 | Resist pattern, process for producing the same, and utilization thereof |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US7309559B2 (en) |
| JP (1) | JP3503639B2 (en) |
| KR (1) | KR100578987B1 (en) |
| AU (1) | AU2001292244A1 (en) |
| TW (1) | TW562997B (en) |
| WO (1) | WO2002027407A1 (en) |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7344970B2 (en) * | 2002-04-11 | 2008-03-18 | Shipley Company, L.L.C. | Plating method |
| JP2006313173A (en) * | 2003-07-03 | 2006-11-16 | Hitachi Chem Co Ltd | Photosensitive resin composition, laminated body thereof and method for producing same |
| US8338087B2 (en) * | 2004-03-03 | 2012-12-25 | Advanced Technology Materials, Inc | Composition and process for post-etch removal of photoresist and/or sacrificial anti-reflective material deposited on a substrate |
| JP2006243680A (en) * | 2004-03-22 | 2006-09-14 | Fuji Photo Film Co Ltd | Pattern forming process |
| WO2006038279A1 (en) * | 2004-10-04 | 2006-04-13 | Hitachi Chemical Co., Ltd. | Photosensitive element, method of forming resist pattern therewith, and process for producing printed wiring board |
| EP2368939A1 (en) * | 2004-10-07 | 2011-09-28 | Hitachi Chemical Co., Ltd. | Resin composition for optical material, and resin film for optical material |
| CN102012634A (en) | 2005-05-23 | 2011-04-13 | 日立化成工业株式会社 | Photosensitive resin composition, photosensitive element, method for forming resist pattern and method for producing printed wiring board |
| KR100935780B1 (en) * | 2005-05-30 | 2010-01-06 | 히다치 가세고교 가부시끼가이샤 | Photosensitive resin composition, photosensitive element employing the same, method of forming resist pattern, and process for producing printed wiring board |
| WO2007040204A1 (en) * | 2005-10-04 | 2007-04-12 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, and method for manufacturing printed wiring board |
| WO2007049519A1 (en) * | 2005-10-25 | 2007-05-03 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element comprising the same, method of forming resist pattern, and process for producing printed wiring board |
| EP1783548B1 (en) * | 2005-11-08 | 2017-03-08 | Rohm and Haas Electronic Materials LLC | Method of forming a patterned layer on a substrate |
| TW200745749A (en) * | 2006-02-21 | 2007-12-16 | Hitachi Chemical Co Ltd | Photosensitive resin composition, method for forming resist pattern, method for manufacturing printed wiring board, and method for producing substrate for plasma display panel |
| JP2010501687A (en) * | 2006-08-30 | 2010-01-21 | スティッチング ダッチ ポリマー インスティテュート | Method for preparing polymer relief structure |
| US7756601B1 (en) * | 2007-03-05 | 2010-07-13 | R.P. Gatta, Inc. | Intuitive controller for vertical lift assist device |
| CN102037406A (en) * | 2008-06-02 | 2011-04-27 | 日立化成工业株式会社 | Photosensitive resin composition, photosensitive element, resist pattern manufacturing method, and printed circuit board manufacturing method |
| US9081275B2 (en) * | 2010-12-02 | 2015-07-14 | Industrial Technology Research Institute | Photosensitive composition and photoresist |
| CN107422606A (en) * | 2010-12-16 | 2017-12-01 | 日立化成株式会社 | The manufacture method of photosensitive element, the forming method of corrosion-resisting pattern and printed wiring board |
| TWI503625B (en) * | 2013-08-23 | 2015-10-11 | Ind Tech Res Inst | Photosensitive composition and photoresist |
| US10564543B2 (en) * | 2014-09-18 | 2020-02-18 | Hitachi Chemical Company, Ltd. | Photosensitive resin composition, photosensitive element, method for producing substrate with resist pattern, and method for producing printed wiring board |
| JPWO2016104585A1 (en) * | 2014-12-25 | 2017-10-05 | 日立化成株式会社 | Photosensitive resin composition, photosensitive element using the same, resist pattern forming method, and printed wiring board manufacturing method |
| JP7246615B2 (en) * | 2017-12-20 | 2023-03-28 | 住友電気工業株式会社 | Printed wiring board manufacturing method and laminate |
Family Cites Families (27)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3479185A (en) | 1965-06-03 | 1969-11-18 | Du Pont | Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers |
| DE2027467C3 (en) | 1970-06-04 | 1974-08-15 | Kalle Ag, 6202 Wiesbaden-Biebrich | Photopolymerizable copying compound |
| DE2727469A1 (en) | 1977-06-18 | 1978-12-21 | Hoechst Ag | NEW HEXAHYDROPYRIMIDINE, METHOD FOR THE PRODUCTION THEREOF AND MEDICINAL PRODUCTS CONTAINING THESE COMPOUNDS |
| JPS5427104A (en) | 1977-08-01 | 1979-03-01 | Yokohama Rubber Co Ltd:The | Run-flat tire for use in two-wheel car |
| DE2850585A1 (en) | 1978-11-22 | 1980-06-04 | Hoechst Ag | PHOTOPOLYMERIZABLE MIXTURE |
| US4629680A (en) * | 1984-01-30 | 1986-12-16 | Fuji Photo Film Co., Ltd. | Photopolymerizable materials capable of being developed by a weak alkaline aqueous solution |
| DE3620254C2 (en) * | 1985-06-18 | 1994-05-05 | Canon Kk | By blasting with effective energy curable resin mixture |
| US5238782A (en) * | 1986-12-26 | 1993-08-24 | Fuji Photo Film Co., Ltd. | Photopolymerizable composition |
| JPH05102021A (en) | 1991-10-11 | 1993-04-23 | Hitachi Ltd | High-aspect-ratio fine-pattern formation method of organic film |
| JPH05204139A (en) * | 1992-01-24 | 1993-08-13 | Nippon Paint Co Ltd | Photosensitive resin composition for flexographic printing material |
| JPH05341527A (en) | 1992-06-12 | 1993-12-24 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using same |
| JPH05341526A (en) | 1992-06-12 | 1993-12-24 | Hitachi Chem Co Ltd | Photosensitive resin composition and photosensitive element using same |
| JP3272045B2 (en) | 1992-08-20 | 2002-04-08 | 日本合成化学工業株式会社 | Manufacturing method of printed wiring board |
| JPH06282069A (en) | 1993-03-25 | 1994-10-07 | Asahi Chem Ind Co Ltd | Photosensitive resin composition for thick-film circuit |
| JP3073358B2 (en) | 1993-03-25 | 2000-08-07 | 旭化成工業株式会社 | Thick film circuit board and method of manufacturing the same |
| JP3170940B2 (en) | 1993-04-01 | 2001-05-28 | 松下電器産業株式会社 | Method of forming fine pattern |
| JPH1031303A (en) * | 1994-09-29 | 1998-02-03 | Nippon Zeon Co Ltd | Photosensitive composition and photosensitive rubber plate |
| US5863704A (en) * | 1995-04-26 | 1999-01-26 | Nippon Zeon Company, Ltd. | Photosensitive composition and photosensitive rubber plate |
| JPH08328265A (en) | 1995-05-31 | 1996-12-13 | Matsushita Electric Ind Co Ltd | Formation of fine patterns |
| JP3004595B2 (en) | 1996-10-08 | 2000-01-31 | 日本合成化学工業株式会社 | Photosensitive resin composition and dry film resist using the same |
| JPH1173874A (en) | 1997-09-01 | 1999-03-16 | Toray Ind Inc | Manufacture of plasma display |
| JPH11102067A (en) | 1997-09-26 | 1999-04-13 | Nippon Synthetic Chem Ind Co Ltd:The | Photoresist film |
| JP4004606B2 (en) | 1997-11-14 | 2007-11-07 | 日本合成化学工業株式会社 | Photoresist film |
| US5922509A (en) | 1998-03-18 | 1999-07-13 | Morton International, Inc. | Photoimageable compositions having improved stripping properties in aqueous alkaline solutions |
| TWI240149B (en) * | 2000-06-22 | 2005-09-21 | Hitachi Chemical Co Ltd | Photosensitive resin composition, photosensitive element comprising the same, process for producing resist pattern, and process for producing printed circuit board |
| JPWO2002025377A1 (en) * | 2000-09-20 | 2004-01-29 | 日立化成工業株式会社 | Photosensitive element, method for forming resist pattern, and method for manufacturing printed wiring board |
| TWI262360B (en) * | 2001-03-29 | 2006-09-21 | Hitachi Chemical Co Ltd | Light sensitive film for forming circuit and method for manufacturing printed circuit board |
-
2001
- 2001-09-26 KR KR1020027017789A patent/KR100578987B1/en active IP Right Grant
- 2001-09-26 AU AU2001292244A patent/AU2001292244A1/en not_active Abandoned
- 2001-09-26 TW TW090123704A patent/TW562997B/en not_active IP Right Cessation
- 2001-09-26 JP JP2002530924A patent/JP3503639B2/en not_active Expired - Fee Related
- 2001-09-26 US US10/381,671 patent/US7309559B2/en not_active Expired - Fee Related
- 2001-09-26 WO PCT/JP2001/008356 patent/WO2002027407A1/en active IP Right Grant
Also Published As
| Publication number | Publication date |
|---|---|
| TW562997B (en) | 2003-11-21 |
| US7309559B2 (en) | 2007-12-18 |
| JPWO2002027407A1 (en) | 2004-02-05 |
| US20040063025A1 (en) | 2004-04-01 |
| JP3503639B2 (en) | 2004-03-08 |
| KR20030028765A (en) | 2003-04-10 |
| KR100578987B1 (en) | 2006-05-12 |
| WO2002027407A1 (en) | 2002-04-04 |
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