AU2001282398A1 - Vibration and shock resistant heat sink assembly - Google Patents

Vibration and shock resistant heat sink assembly

Info

Publication number
AU2001282398A1
AU2001282398A1 AU2001282398A AU8239801A AU2001282398A1 AU 2001282398 A1 AU2001282398 A1 AU 2001282398A1 AU 2001282398 A AU2001282398 A AU 2001282398A AU 8239801 A AU8239801 A AU 8239801A AU 2001282398 A1 AU2001282398 A1 AU 2001282398A1
Authority
AU
Australia
Prior art keywords
vibration
heat sink
sink assembly
resistant heat
shock resistant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001282398A
Inventor
Chong-Sheng Wang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TE Connectivity Solutions GmbH
Original Assignee
Tyco Electronics Logistics AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tyco Electronics Logistics AG filed Critical Tyco Electronics Logistics AG
Publication of AU2001282398A1 publication Critical patent/AU2001282398A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4093—Snap-on arrangements, e.g. clips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
AU2001282398A 2000-08-11 2001-07-19 Vibration and shock resistant heat sink assembly Abandoned AU2001282398A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/637,418 2000-08-11
US09/637,418 US6293331B1 (en) 2000-08-11 2000-08-11 Vibration and shock resistant heat sink assembly
PCT/IB2001/001593 WO2002015265A2 (en) 2000-08-11 2001-07-19 Vibration and shock resistant heat sink assembly

Publications (1)

Publication Number Publication Date
AU2001282398A1 true AU2001282398A1 (en) 2002-02-25

Family

ID=24555846

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001282398A Abandoned AU2001282398A1 (en) 2000-08-11 2001-07-19 Vibration and shock resistant heat sink assembly

Country Status (6)

Country Link
US (1) US6293331B1 (en)
CN (1) CN1284232C (en)
AU (1) AU2001282398A1 (en)
MX (1) MXPA03001294A (en)
TW (1) TWI272891B (en)
WO (1) WO2002015265A2 (en)

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US6430052B1 (en) * 2001-05-08 2002-08-06 Cisco Technology, Inc. Techniques for cooling a circuit board component
US6386274B1 (en) * 2001-06-28 2002-05-14 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6452803B1 (en) * 2001-07-20 2002-09-17 Foxconn Precision Components Co., Ltd. Heat sink assembly
US6633489B2 (en) * 2001-07-31 2003-10-14 Hewlett-Packard Development Company, L.P. Dynamic isolating mount for processor packages
US6549407B1 (en) * 2001-12-27 2003-04-15 Intel Corporation Heat exchanger retention mechanism
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US6683787B1 (en) 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6690575B1 (en) 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6697255B1 (en) 2002-02-14 2004-02-24 Mercury Computer Systems, Inc. Circuit board assembly with integrated shaping and control of flow resistance curve
US6661657B1 (en) 2002-02-14 2003-12-09 Mercury Computer Systems, Inc. Circuit board assembly for use in a central inlet chassis configuration
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US7452712B2 (en) 2002-07-30 2008-11-18 Applied Biosystems Inc. Sample block apparatus and method of maintaining a microcard on a sample block
US6728104B1 (en) 2002-10-23 2004-04-27 Cisco Technology, Inc. Methods and apparatus for cooling a circuit board component
US6714416B1 (en) 2002-11-13 2004-03-30 Cisco Technology, Inc. Mechanisms and techniques for fastening a heat sink to a circuit board component
US6944023B2 (en) * 2002-11-15 2005-09-13 Celestica International Inc. System and method for mounting a heat sink
US7413851B2 (en) * 2002-12-13 2008-08-19 Aurelium Biopharma, Inc. Nucleophosmin directed diagnostics and therapeutics for multidrug resistant neoplastic disease
US7242583B2 (en) * 2002-12-16 2007-07-10 Paricon Technologies, Corporation System for loading a heat sink mechanism independently of clamping load on electrical device
US6914780B1 (en) 2003-01-16 2005-07-05 Cisco Technology, Inc. Methods and apparatus for cooling a circuit board component using a heat pipe assembly
US7570443B2 (en) * 2003-09-19 2009-08-04 Applied Biosystems, Llc Optical camera alignment
US20050237528A1 (en) * 2003-09-19 2005-10-27 Oldham Mark F Transparent heater for thermocycling
US7139174B1 (en) 2003-10-29 2006-11-21 Cisco Technology, Inc. Techniques for attaching a heat sink assembly to a circuit board component
US7203065B1 (en) * 2003-11-24 2007-04-10 Ciena Corporation Heatsink assembly
IL159399A0 (en) * 2003-12-16 2004-06-01 Rafael Armament Dev Authority Integrated-circuit cooling system
US7113406B1 (en) 2004-07-22 2006-09-26 Cisco Technology, Inc. Methods and apparatus for fastening a set of heatsinks to a circuit board
US20060026835A1 (en) * 2004-08-03 2006-02-09 Wood James G Heat exchanger fins and method for fabricating fins particularly suitable for stirling engines
US7324344B2 (en) * 2004-12-01 2008-01-29 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US7321493B2 (en) * 2004-12-01 2008-01-22 Cisco Technology, Inc. Techniques for attaching a heatsink to a circuit board using anchors which install from an underside of the circuit board
US7362578B2 (en) * 2005-08-16 2008-04-22 Tyco Electronics Corporation Heat sink fastening system
CN101231546A (en) * 2007-01-24 2008-07-30 鸿富锦精密工业（深圳）有限公司 Combination of cooling device
CN101742819B (en) * 2008-11-21 2013-03-20 鸿富锦精密工业（深圳）有限公司 Circuit board compobination
TWM361659U (en) * 2009-01-13 2009-07-21 Hon Hai Prec Ind Co Ltd Electrical connector assembly and clip thereof
CN101853058A (en) * 2009-03-30 2010-10-06 鸿富锦精密工业（深圳）有限公司 Radiator of main board
CN102395936B (en) * 2009-04-14 2013-12-11 富士通株式会社 Electronic apparatus
US20110035935A1 (en) * 2009-08-12 2011-02-17 Pen-Chun YU Heat sink fast disassembling structure
US20210235596A1 (en) * 2020-01-23 2021-07-29 Intel Corporation Heat dissipation device having shielding/containment extensions
GB2598343B (en) * 2020-08-27 2022-11-30 Continental Automotive Romania Srl Circular heatsink
DE102020133973A1 (en) * 2020-12-17 2022-06-23 Avl Software And Functions Gmbh Heat exchanger, in particular for power electronics

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NL260951A (en) 1960-03-07
US3146384A (en) 1961-08-11 1964-08-25 Robert A Ruehle Mounting device for semiconductors
US3182114A (en) 1963-01-04 1965-05-04 Fan Tron Corp Rectifier unit with heat dissipator
US3229756A (en) 1964-01-21 1966-01-18 Laszlo Z Keresztury Semiconductor heat sink and/or cooler
US3417300A (en) 1965-12-15 1968-12-17 Texas Instruments Inc Economy high power package
US4345267A (en) 1980-03-31 1982-08-17 Amp Incorporated Active device substrate connector having a heat sink
US4396935A (en) 1980-10-06 1983-08-02 Ncr Corporation VLSI Packaging system
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GB8325320D0 (en) 1983-09-21 1983-10-26 Plessey Co Plc Diamond heatsink assemblies
DE3335365A1 (en) 1983-09-29 1985-04-18 Siemens AG, 1000 Berlin und 8000 München DEVICE FOR DETACHABLE FIXING OF A REFRIGERATOR BODY ON AN INTEGRATED BLOCK
US4607685A (en) 1984-07-06 1986-08-26 Burroughs Corporation Heat sink for integrated circuit package
US4593342A (en) 1984-11-15 1986-06-03 General Electric Company Heat sink assembly for protecting pins of electronic devices
US4745456A (en) 1986-09-11 1988-05-17 Thermalloy Incorporated Heat sink clip assembly
US4753287A (en) 1986-10-24 1988-06-28 Bicc Plc Circuit board installation
FR2625038B1 (en) 1987-12-22 1990-08-17 Cit Alcatel METHOD AND DEVICE FOR COOLING AN INTEGRATED CIRCUIT HOUSING
US5053853A (en) 1990-05-08 1991-10-01 International Business Machines Corporation Modular electronic packaging system
US5170323A (en) 1991-07-16 1992-12-08 United Technologies Corporation Electrical component clamping and thermal transfer device
US5353193A (en) * 1993-02-26 1994-10-04 Lsi Logic Corporation High power dissipating packages with matched heatspreader heatsink assemblies
US5397919A (en) 1993-03-04 1995-03-14 Square Head, Inc. Heat sink assembly for solid state devices
US5313099A (en) 1993-03-04 1994-05-17 Square Head, Inc. Heat sink assembly for solid state devices
US5566052A (en) * 1995-06-08 1996-10-15 Northern Telecom Limited Electronic devices with electromagnetic radiation interference shields and heat sinks
US5667870A (en) * 1995-07-24 1997-09-16 Chip Coolers, Inc. Plastic article with interrupted interior threads for securing a threaded heat sink to a heat generating member
DE29516627U1 (en) 1995-10-20 1995-12-14 Lin, Jen-Cheng, Taipeh/T'ai-pei CPU heatsink fastener
US5708564A (en) 1996-05-07 1998-01-13 Lin; Andy Heat sink mounting structure

Also Published As

Publication number Publication date
CN1446376A (en) 2003-10-01
WO2002015265A2 (en) 2002-02-21
TWI272891B (en) 2007-02-01
US6293331B1 (en) 2001-09-25
CN1284232C (en) 2006-11-08
WO2002015265A3 (en) 2003-03-13
MXPA03001294A (en) 2004-07-30

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