AU2001280850A1 - Electronic assembly comprising substrate with embedded capacitors and methods of manufacture - Google Patents
Electronic assembly comprising substrate with embedded capacitors and methods of manufactureInfo
- Publication number
- AU2001280850A1 AU2001280850A1 AU2001280850A AU8085001A AU2001280850A1 AU 2001280850 A1 AU2001280850 A1 AU 2001280850A1 AU 2001280850 A AU2001280850 A AU 2001280850A AU 8085001 A AU8085001 A AU 8085001A AU 2001280850 A1 AU2001280850 A1 AU 2001280850A1
- Authority
- AU
- Australia
- Prior art keywords
- capacitor
- manufacture
- substrate
- methods
- electronic assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49822—Multilayer substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
- H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0556—Disposition
- H01L2224/05571—Disposition the external layer being disposed in a recess of the surface
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/05573—Single external layer
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/16235—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation the bump connector connecting to a via metallisation of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
- H01L2924/097—Glass-ceramics, e.g. devitrified glass
- H01L2924/09701—Low temperature co-fired ceramic [LTCC]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
- H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0183—Dielectric layers
- H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/049—PCB for one component, e.g. for mounting onto mother PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10674—Flip chip
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
- H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Semiconductor Integrated Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Die Bonding (AREA)
- Ceramic Capacitors (AREA)
Abstract
To reduce switching noise, the power supply terminals of an integrated circuit die can be coupled to the respective terminals of at least one embedded capacitor in a multiplayer ceramic substrate. In one embodiment, the capacitor is formed of at least one high permittivity layer. In another embodiment, several high permittivity layers are interleaved with conductive layers. Alternatively, the capacitor can comprise at least one embedded discrete capacitor. Also described are an electronic system, a data processing system, and various methods of manufacture.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/631,037 | 2000-07-31 | ||
US09/631,037 US6611419B1 (en) | 2000-07-31 | 2000-07-31 | Electronic assembly comprising substrate with embedded capacitors |
PCT/US2001/023721 WO2002011207A2 (en) | 2000-07-31 | 2001-07-26 | Electronic assembly comprising substrate with embedded capacitors and methods of manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001280850A1 true AU2001280850A1 (en) | 2002-02-13 |
Family
ID=24529522
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001280850A Abandoned AU2001280850A1 (en) | 2000-07-31 | 2001-07-26 | Electronic assembly comprising substrate with embedded capacitors and methods of manufacture |
Country Status (9)
Country | Link |
---|---|
US (1) | US6611419B1 (en) |
EP (2) | EP1515365B1 (en) |
JP (1) | JP2004505469A (en) |
KR (1) | KR100591217B1 (en) |
CN (1) | CN100492628C (en) |
AT (1) | ATE360889T1 (en) |
AU (1) | AU2001280850A1 (en) |
DE (1) | DE60128145T2 (en) |
WO (1) | WO2002011207A2 (en) |
Families Citing this family (96)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7321485B2 (en) | 1997-04-08 | 2008-01-22 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US9054094B2 (en) | 1997-04-08 | 2015-06-09 | X2Y Attenuators, Llc | Energy conditioning circuit arrangement for integrated circuit |
US7336468B2 (en) | 1997-04-08 | 2008-02-26 | X2Y Attenuators, Llc | Arrangement for energy conditioning |
US6970362B1 (en) * | 2000-07-31 | 2005-11-29 | Intel Corporation | Electronic assemblies and systems comprising interposer with embedded capacitors |
JP4129717B2 (en) * | 2001-05-30 | 2008-08-06 | 株式会社ルネサステクノロジ | Semiconductor device |
US7385286B2 (en) * | 2001-06-05 | 2008-06-10 | Matsushita Electric Industrial Co., Ltd. | Semiconductor module |
JPWO2003007379A1 (en) * | 2001-07-12 | 2004-11-04 | 株式会社日立製作所 | Electronic circuit components |
JP3967108B2 (en) * | 2001-10-26 | 2007-08-29 | 富士通株式会社 | Semiconductor device and manufacturing method thereof |
US8749054B2 (en) | 2010-06-24 | 2014-06-10 | L. Pierre de Rochemont | Semiconductor carrier with vertical power FET module |
JP2004079701A (en) * | 2002-08-14 | 2004-03-11 | Sony Corp | Semiconductor device and its manufacturing method |
JP4243117B2 (en) * | 2002-08-27 | 2009-03-25 | 新光電気工業株式会社 | Semiconductor package, manufacturing method thereof, and semiconductor device |
US6844505B1 (en) * | 2002-11-04 | 2005-01-18 | Ncr Corporation | Reducing noise effects in circuit boards |
US20040231885A1 (en) * | 2003-03-07 | 2004-11-25 | Borland William J. | Printed wiring boards having capacitors and methods of making thereof |
US7626828B1 (en) * | 2003-07-30 | 2009-12-01 | Teradata Us, Inc. | Providing a resistive element between reference plane layers in a circuit board |
US8569142B2 (en) * | 2003-11-28 | 2013-10-29 | Blackberry Limited | Multi-level thin film capacitor on a ceramic substrate and method of manufacturing the same |
US6943294B2 (en) * | 2003-12-22 | 2005-09-13 | Intel Corporation | Integrating passive components on spacer in stacked dies |
US7132743B2 (en) * | 2003-12-23 | 2006-11-07 | Intel Corporation | Integrated circuit package substrate having a thin film capacitor structure |
US7256980B2 (en) * | 2003-12-30 | 2007-08-14 | Du Pont | Thin film capacitors on ceramic |
US20050154105A1 (en) * | 2004-01-09 | 2005-07-14 | Summers John D. | Compositions with polymers for advanced materials |
US20070019789A1 (en) * | 2004-03-29 | 2007-01-25 | Jmar Research, Inc. | Systems and methods for achieving a required spot says for nanoscale surface analysis using soft x-rays |
JP2005286112A (en) * | 2004-03-30 | 2005-10-13 | Airex Inc | Printed circuit board and its manufacturing method |
KR101053587B1 (en) * | 2004-06-04 | 2011-08-03 | 엘지전자 주식회사 | Board Assembly for Remote Control of Washing Machine |
US20060001149A1 (en) * | 2004-06-30 | 2006-01-05 | Victor Prokofiev | Packaged substrate having variable width conductors and a variably spaced reference plane |
US7216406B2 (en) * | 2004-09-29 | 2007-05-15 | Intel Corporation | Method forming split thin film capacitors with multiple voltages |
EP2426785A2 (en) | 2004-10-01 | 2012-03-07 | L. Pierre De Rochemont | Ceramic antenna module and methods of manufacture thereof |
US7501698B2 (en) * | 2004-10-26 | 2009-03-10 | Kabushiki Kaisha Toshiba | Method and system for an improved power distribution network for use with a semiconductor device |
US7269029B2 (en) * | 2004-11-09 | 2007-09-11 | International Business Machines Corporation | Rapid fire test board |
US7613007B2 (en) * | 2004-12-21 | 2009-11-03 | E. I. Du Pont De Nemours And Company | Power core devices |
US20060158828A1 (en) * | 2004-12-21 | 2006-07-20 | Amey Daniel I Jr | Power core devices and methods of making thereof |
US7778038B2 (en) * | 2004-12-21 | 2010-08-17 | E.I. Du Pont De Nemours And Company | Power core devices and methods of making thereof |
TWI414218B (en) * | 2005-02-09 | 2013-11-01 | Ngk Spark Plug Co | Wiring board and capacitor to be built into wiring board |
WO2006104613A2 (en) | 2005-03-01 | 2006-10-05 | X2Y Attenuators, Llc | Conditioner with coplanar conductors |
US7548432B2 (en) * | 2005-03-24 | 2009-06-16 | Agency For Science, Technology And Research | Embedded capacitor structure |
US7492570B2 (en) * | 2005-04-13 | 2009-02-17 | Kabushiki Kaisha Toshiba | Systems and methods for reducing simultaneous switching noise in an integrated circuit |
US20060289976A1 (en) * | 2005-06-23 | 2006-12-28 | Intel Corporation | Pre-patterned thin film capacitor and method for embedding same in a package substrate |
WO2007005642A2 (en) | 2005-06-30 | 2007-01-11 | Derochemont L Pierre | Electrical components and method of manufacture |
US8350657B2 (en) | 2005-06-30 | 2013-01-08 | Derochemont L Pierre | Power management module and method of manufacture |
US7621041B2 (en) | 2005-07-11 | 2009-11-24 | E. I. Du Pont De Nemours And Company | Methods for forming multilayer structures |
US7435627B2 (en) * | 2005-08-11 | 2008-10-14 | International Business Machines Corporation | Techniques for providing decoupling capacitance |
US7701052B2 (en) * | 2005-10-21 | 2010-04-20 | E. I. Du Pont De Nemours And Company | Power core devices |
US7705423B2 (en) * | 2005-10-21 | 2010-04-27 | Georgia Tech Research Corporation | Device having an array of embedded capacitors for power delivery and decoupling of high speed input/output circuitry of an integrated circuit |
US7456459B2 (en) * | 2005-10-21 | 2008-11-25 | Georgia Tech Research Corporation | Design of low inductance embedded capacitor layer connections |
US7504706B2 (en) * | 2005-10-21 | 2009-03-17 | E. I. Du Pont De Nemours | Packaging having an array of embedded capacitors for power delivery and decoupling in the mid-frequency range and methods of forming thereof |
US8520402B1 (en) * | 2005-10-25 | 2013-08-27 | Xilinx, Inc. | Decoupling capacitor circuit assembly |
US8354294B2 (en) | 2006-01-24 | 2013-01-15 | De Rochemont L Pierre | Liquid chemical deposition apparatus and process and products therefrom |
KR100744903B1 (en) * | 2006-02-22 | 2007-08-01 | 삼성전기주식회사 | Multi-layer board with decoupling function |
US20080019552A1 (en) * | 2006-03-27 | 2008-01-24 | Kurt Eldracher | Personal audio device accessory |
US7848512B2 (en) * | 2006-03-27 | 2010-12-07 | Kurt Eldracher | Personal audio device accessory |
US20070236859A1 (en) * | 2006-04-10 | 2007-10-11 | Borland William J | Organic encapsulant compositions for protection of electronic components |
US20070244267A1 (en) * | 2006-04-10 | 2007-10-18 | Dueber Thomas E | Hydrophobic crosslinkable compositions for electronic applications |
US20070291440A1 (en) * | 2006-06-15 | 2007-12-20 | Dueber Thomas E | Organic encapsulant compositions based on heterocyclic polymers for protection of electronic components |
US7751205B2 (en) * | 2006-07-10 | 2010-07-06 | Ibiden Co., Ltd. | Package board integrated with power supply |
TWI326908B (en) * | 2006-09-11 | 2010-07-01 | Ind Tech Res Inst | Packaging structure and fabricating method thereof |
US7902662B2 (en) * | 2007-04-02 | 2011-03-08 | E.I. Du Pont De Nemours And Company | Power core devices and methods of making thereof |
US7841075B2 (en) * | 2007-06-19 | 2010-11-30 | E. I. Du Pont De Nemours And Company | Methods for integration of thin-film capacitors into the build-up layers of a PWB |
US7791896B1 (en) | 2007-06-20 | 2010-09-07 | Teradata Us, Inc. | Providing an embedded capacitor in a circuit board |
TWI364824B (en) * | 2007-08-08 | 2012-05-21 | Advanced Semiconductor Eng | Semiconductor structure and method of fabricating the same |
US8564967B2 (en) | 2007-12-03 | 2013-10-22 | Cda Processing Limited Liability Company | Device and method for reducing impedance |
US7863724B2 (en) * | 2008-02-12 | 2011-01-04 | International Business Machines Corporation | Circuit substrate having post-fed die side power supply connections |
US7959598B2 (en) | 2008-08-20 | 2011-06-14 | Asante Solutions, Inc. | Infusion pump systems and methods |
FI20095110A0 (en) | 2009-02-06 | 2009-02-06 | Imbera Electronics Oy | Electronic module with EMI protection |
US8391017B2 (en) * | 2009-04-28 | 2013-03-05 | Georgia Tech Research Corporation | Thin-film capacitor structures embedded in semiconductor packages and methods of making |
US8409963B2 (en) * | 2009-04-28 | 2013-04-02 | CDA Procesing Limited Liability Company | Methods of embedding thin-film capacitors into semiconductor packages using temporary carrier layers |
US8922347B1 (en) | 2009-06-17 | 2014-12-30 | L. Pierre de Rochemont | R.F. energy collection circuit for wireless devices |
US8952858B2 (en) | 2009-06-17 | 2015-02-10 | L. Pierre de Rochemont | Frequency-selective dipole antennas |
KR101169531B1 (en) * | 2009-07-03 | 2012-07-27 | 가부시키가이샤 테라미크로스 | Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereof |
WO2011077918A1 (en) * | 2009-12-24 | 2011-06-30 | 株式会社村田製作所 | Circuit module |
US8552708B2 (en) | 2010-06-02 | 2013-10-08 | L. Pierre de Rochemont | Monolithic DC/DC power management module with surface FET |
US9023493B2 (en) | 2010-07-13 | 2015-05-05 | L. Pierre de Rochemont | Chemically complex ablative max-phase material and method of manufacture |
US8415781B2 (en) * | 2010-08-09 | 2013-04-09 | Ibiden Co., Ltd. | Electronic component and method for manufacturing the same |
CN109148425B (en) | 2010-08-23 | 2022-10-04 | L·皮尔·德罗什蒙 | Power field effect transistor with resonant transistor gate |
JP6223828B2 (en) | 2010-11-03 | 2017-11-01 | デ,ロシェモント,エル.,ピエール | Semiconductor chip carrier having monolithically integrated quantum dot device and manufacturing method thereof |
US20120292777A1 (en) * | 2011-05-18 | 2012-11-22 | Lotz Jonathan P | Backside Power Delivery Using Die Stacking |
FR2987545B1 (en) * | 2012-02-23 | 2015-02-06 | Thales Sa | MULTILAYER PRINTED CIRCUIT COMPRISING LOW DIELECTRIC LOSS TRANSMISSION LINES AND METHOD THEREOF |
KR101472628B1 (en) * | 2012-07-02 | 2014-12-15 | 삼성전기주식회사 | Capacitor embedded PCB(printed circuit board) |
KR102078015B1 (en) | 2013-11-07 | 2020-04-07 | 삼성전기주식회사 | Low temperature co-fired ceramic substrate with embedded capacitors |
TWI529906B (en) * | 2013-12-09 | 2016-04-11 | 矽品精密工業股份有限公司 | Manufacturing method of semiconductor package |
US9628052B2 (en) * | 2014-02-18 | 2017-04-18 | Qualcomm Incorporated | Embedded multi-terminal capacitor |
US9659850B2 (en) * | 2014-12-08 | 2017-05-23 | Qualcomm Incorporated | Package substrate comprising capacitor, redistribution layer and discrete coaxial connection |
KR102365103B1 (en) * | 2014-12-12 | 2022-02-21 | 삼성전자주식회사 | Semiconductor |
JP2016162904A (en) * | 2015-03-03 | 2016-09-05 | ルネサスエレクトロニクス株式会社 | Semiconductor device manufacturing method |
US10068181B1 (en) | 2015-04-27 | 2018-09-04 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafer and methods for making the same |
WO2017123525A1 (en) | 2016-01-13 | 2017-07-20 | Bigfoot Biomedical, Inc. | User interface for diabetes management system |
AU2017207484B2 (en) | 2016-01-14 | 2021-05-13 | Bigfoot Biomedical, Inc. | Adjusting insulin delivery rates |
US11538753B2 (en) | 2016-12-30 | 2022-12-27 | Intel Corporation | Electronic chip with under-side power block |
US10978403B2 (en) | 2019-01-30 | 2021-04-13 | Delta Electronics, Inc. | Package structure and method for fabricating the same |
US11033682B2 (en) | 2017-01-13 | 2021-06-15 | Bigfoot Biomedical, Inc. | Insulin delivery methods, systems and devices |
USD874471S1 (en) | 2017-06-08 | 2020-02-04 | Insulet Corporation | Display screen with a graphical user interface |
US11121301B1 (en) | 2017-06-19 | 2021-09-14 | Rigetti & Co, Inc. | Microwave integrated quantum circuits with cap wafers and their methods of manufacture |
US10134712B1 (en) * | 2017-08-23 | 2018-11-20 | Micron Technology, Inc. | Methods and systems for improving power delivery and signaling in stacked semiconductor devices |
USD928199S1 (en) | 2018-04-02 | 2021-08-17 | Bigfoot Biomedical, Inc. | Medication delivery device with icons |
TW202038266A (en) * | 2018-11-26 | 2020-10-16 | 瑞典商斯莫勒科技公司 | Semiconductor assembly with discrete energy storage component |
USD920343S1 (en) | 2019-01-09 | 2021-05-25 | Bigfoot Biomedical, Inc. | Display screen or portion thereof with graphical user interface associated with insulin delivery |
US11404388B2 (en) | 2019-04-29 | 2022-08-02 | Qualcomm Incorporated | Surface mount passive component shorted together and a die |
US11202375B2 (en) * | 2019-04-29 | 2021-12-14 | Qualcomm Incorporated | Surface mount passive component shorted together |
USD977502S1 (en) | 2020-06-09 | 2023-02-07 | Insulet Corporation | Display screen with graphical user interface |
Family Cites Families (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4926241A (en) | 1988-02-19 | 1990-05-15 | Microelectronics And Computer Technology Corporation | Flip substrate for chip mount |
EP0359513A3 (en) | 1988-09-14 | 1990-12-19 | Hitachi, Ltd. | Semiconductor chip carrier and method of making it |
US5060116A (en) | 1990-04-20 | 1991-10-22 | Grobman Warren D | Electronics system with direct write engineering change capability |
US5177594A (en) | 1991-01-09 | 1993-01-05 | International Business Machines Corporation | Semiconductor chip interposer module with engineering change wiring and distributed decoupling capacitance |
US5177670A (en) | 1991-02-08 | 1993-01-05 | Hitachi, Ltd. | Capacitor-carrying semiconductor module |
JP2966972B2 (en) | 1991-07-05 | 1999-10-25 | 株式会社日立製作所 | Semiconductor chip carrier, module mounting the same, and electronic device incorporating the same |
US5800575A (en) | 1992-04-06 | 1998-09-01 | Zycon Corporation | In situ method of forming a bypass capacitor element internally within a capacitive PCB |
JPH05335183A (en) | 1992-05-28 | 1993-12-17 | Murata Mfg Co Ltd | Electronic component provided with multilayer board and manufacture thereof |
US5354955A (en) | 1992-12-02 | 1994-10-11 | International Business Machines Corporation | Direct jump engineering change system |
US5377139A (en) | 1992-12-11 | 1994-12-27 | Motorola, Inc. | Process forming an integrated circuit |
JP3325351B2 (en) * | 1993-08-18 | 2002-09-17 | 株式会社東芝 | Semiconductor device |
US5523619A (en) * | 1993-11-03 | 1996-06-04 | International Business Machines Corporation | High density memory structure |
JP3309522B2 (en) | 1993-11-15 | 2002-07-29 | 株式会社村田製作所 | Multilayer substrate and manufacturing method thereof |
US5639989A (en) | 1994-04-19 | 1997-06-17 | Motorola Inc. | Shielded electronic component assembly and method for making the same |
US5469324A (en) | 1994-10-07 | 1995-11-21 | Storage Technology Corporation | Integrated decoupling capacitive core for a printed circuit board and method of making same |
JPH08167630A (en) * | 1994-12-15 | 1996-06-25 | Hitachi Ltd | Chip connection structure |
JPH08172274A (en) | 1994-12-20 | 1996-07-02 | Murata Mfg Co Ltd | Ceramic multilayer board |
US5714801A (en) * | 1995-03-31 | 1998-02-03 | Kabushiki Kaisha Toshiba | Semiconductor package |
US5818699A (en) | 1995-07-05 | 1998-10-06 | Kabushiki Kaisha Toshiba | Multi-chip module and production method thereof |
US5691568A (en) | 1996-05-31 | 1997-11-25 | Lsi Logic Corporation | Wire bondable package design with maxium electrical performance and minimum number of layers |
US5796587A (en) | 1996-06-12 | 1998-08-18 | International Business Machines Corporation | Printed circut board with embedded decoupling capacitance and method for producing same |
US5745335A (en) | 1996-06-27 | 1998-04-28 | Gennum Corporation | Multi-layer film capacitor structures and method |
US5949654A (en) | 1996-07-03 | 1999-09-07 | Kabushiki Kaisha Toshiba | Multi-chip module, an electronic device, and production method thereof |
TW424321B (en) * | 1996-10-31 | 2001-03-01 | Sharp Kk | Integrated electronic circuit |
JP3882954B2 (en) | 1997-03-19 | 2007-02-21 | Tdk株式会社 | Chip type multilayer ceramic capacitor |
US6072690A (en) * | 1998-01-15 | 2000-06-06 | International Business Machines Corporation | High k dielectric capacitor with low k sheathed signal vias |
US6075427A (en) | 1998-01-23 | 2000-06-13 | Lucent Technologies Inc. | MCM with high Q overlapping resonator |
US5939782A (en) * | 1998-03-03 | 1999-08-17 | Sun Microsystems, Inc. | Package construction for integrated circuit chip with bypass capacitor |
US6218729B1 (en) * | 1999-03-11 | 2001-04-17 | Atmel Corporation | Apparatus and method for an integrated circuit having high Q reactive components |
US6183669B1 (en) * | 1999-03-25 | 2001-02-06 | Murata Manufacturing Co., Ltd. | Paste composition, circuit board using the same, ceramic green sheet, ceramic substrate, and method for manufacturing ceramic multilayer substrate |
US6252761B1 (en) | 1999-09-15 | 2001-06-26 | National Semiconductor Corporation | Embedded multi-layer ceramic capacitor in a low-temperature con-fired ceramic (LTCC) substrate |
US6452776B1 (en) | 2000-04-06 | 2002-09-17 | Intel Corporation | Capacitor with defect isolation and bypass |
-
2000
- 2000-07-31 US US09/631,037 patent/US6611419B1/en not_active Expired - Lifetime
-
2001
- 2001-07-26 WO PCT/US2001/023721 patent/WO2002011207A2/en active IP Right Grant
- 2001-07-26 AU AU2001280850A patent/AU2001280850A1/en not_active Abandoned
- 2001-07-26 EP EP04025966A patent/EP1515365B1/en not_active Expired - Lifetime
- 2001-07-26 AT AT01959277T patent/ATE360889T1/en not_active IP Right Cessation
- 2001-07-26 EP EP01959277A patent/EP1358675B1/en not_active Expired - Lifetime
- 2001-07-26 KR KR1020027004176A patent/KR100591217B1/en not_active IP Right Cessation
- 2001-07-26 DE DE60128145T patent/DE60128145T2/en not_active Expired - Lifetime
- 2001-07-26 JP JP2002516833A patent/JP2004505469A/en active Pending
- 2001-07-26 CN CNB01802999XA patent/CN100492628C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
ATE360889T1 (en) | 2007-05-15 |
EP1358675A2 (en) | 2003-11-05 |
DE60128145D1 (en) | 2007-06-06 |
WO2002011207A3 (en) | 2003-08-28 |
DE60128145T2 (en) | 2008-01-03 |
CN100492628C (en) | 2009-05-27 |
EP1515365A2 (en) | 2005-03-16 |
EP1515365A3 (en) | 2006-10-04 |
US6611419B1 (en) | 2003-08-26 |
KR20020042698A (en) | 2002-06-05 |
KR100591217B1 (en) | 2006-06-22 |
WO2002011207A2 (en) | 2002-02-07 |
JP2004505469A (en) | 2004-02-19 |
CN1470069A (en) | 2004-01-21 |
EP1515365B1 (en) | 2010-03-31 |
EP1358675B1 (en) | 2007-04-25 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
AU2001280850A1 (en) | Electronic assembly comprising substrate with embedded capacitors and methods of manufacture | |
WO2002011206A3 (en) | Electronic assembly comprising interposer with embedded capacitors and methods of manufacture | |
WO2002019430A3 (en) | Hybrid substrate with embedded capacitors and methods of manufacture | |
AU2001266944A1 (en) | Electronic package having embedded capacitors and method of fabrication therefor | |
TWI268524B (en) | Capacitance material, printed circuit board having the same and manufacturing method thereof, and capacitor structure | |
TW351911B (en) | Laminar stackable circuit board structure with capacitor | |
TW200519989A (en) | Film capacitor, built-in high-density assembled substrate thereof, and method for making said film capacitor | |
TW200505033A (en) | Capacitor and method of fabricating the same | |
WO2002058234A3 (en) | High frequency printed circuit board via | |
EP1553630A4 (en) | Modular board device and high frequency module and method for producing them | |
MY117854A (en) | Printed circuit board with embedded decoupling capacitance and method for producing same | |
TW200509368A (en) | Circuit module and manufacturing method thereof | |
EP1696716A4 (en) | Multilayer printed wiring board | |
EP1699277A4 (en) | Ceramic multilayer substrate | |
EP1549121A3 (en) | Inductor element containing circuit board and power amplifier module | |
JP2004002956A5 (en) | ||
WO2002100140A3 (en) | Circuit board with at least one electronic component | |
WO2005062803A3 (en) | Printed circuit dielectric foil and embedded capacitors | |
MY129379A (en) | Layered polymer on aluminum stacked capacitor | |
MY128174A (en) | Thin film capacitor and thin film electronic component and method for manufacturing the same. | |
MY126602A (en) | Electronic device and manufacture thereof | |
WO2003073814A3 (en) | Laminated socket contacts | |
MY133591A (en) | Electronic assembly comprising substrate with embedded capacitors | |
TW200520157A (en) | Device and method for manufacturing the same | |
TW200640302A (en) | Passive component module and structure of passive component module embedded in circuit board |