AU2001279126A1 - In-situ method and apparatus for end point detection in chemical mechanical polishing - Google Patents
In-situ method and apparatus for end point detection in chemical mechanical polishingInfo
- Publication number
- AU2001279126A1 AU2001279126A1 AU2001279126A AU7912601A AU2001279126A1 AU 2001279126 A1 AU2001279126 A1 AU 2001279126A1 AU 2001279126 A AU2001279126 A AU 2001279126A AU 7912601 A AU7912601 A AU 7912601A AU 2001279126 A1 AU2001279126 A1 AU 2001279126A1
- Authority
- AU
- Australia
- Prior art keywords
- end point
- mechanical polishing
- chemical mechanical
- point detection
- situ method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000001514 detection method Methods 0.000 title 1
- 238000011065 in-situ storage Methods 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 238000005498 polishing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/005—Control means for lapping machines or devices
- B24B37/013—Devices or means for detecting lapping completion
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09628471 | 2000-07-31 | ||
| US09/628,471 US6476921B1 (en) | 2000-07-31 | 2000-07-31 | In-situ method and apparatus for end point detection in chemical mechanical polishing |
| US25893100P | 2000-12-29 | 2000-12-29 | |
| US60258931 | 2000-12-29 | ||
| PCT/US2001/024146 WO2002010729A1 (en) | 2000-07-31 | 2001-07-31 | In-situ method and apparatus for end point detection in chemical mechanical polishing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| AU2001279126A1 true AU2001279126A1 (en) | 2002-02-13 |
Family
ID=26946968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| AU2001279126A Abandoned AU2001279126A1 (en) | 2000-07-31 | 2001-07-31 | In-situ method and apparatus for end point detection in chemical mechanical polishing |
Country Status (9)
| Country | Link |
|---|---|
| US (1) | US6798529B2 (en) |
| EP (1) | EP1322940A4 (en) |
| JP (1) | JP2004514273A (en) |
| KR (1) | KR20030025281A (en) |
| CN (1) | CN1466676A (en) |
| AU (1) | AU2001279126A1 (en) |
| MY (1) | MY128145A (en) |
| TW (1) | TW491753B (en) |
| WO (1) | WO2002010729A1 (en) |
Families Citing this family (59)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020023715A1 (en) * | 2000-05-26 | 2002-02-28 | Norio Kimura | Substrate polishing apparatus and substrate polishing mehod |
| US6799136B2 (en) * | 2001-08-09 | 2004-09-28 | Texas Instruments Incorporated | Method of estimation of wafer polish rates |
| KR100434189B1 (en) | 2002-03-21 | 2004-06-04 | 삼성전자주식회사 | Apparatus and method for chemically and mechanically polishing semiconductor wafer |
| US6806948B2 (en) * | 2002-03-29 | 2004-10-19 | Lam Research Corporation | System and method of broad band optical end point detection for film change indication |
| CN1302522C (en) * | 2002-05-15 | 2007-02-28 | 旺宏电子股份有限公司 | Terminal detection system for chemical and mechanical polisher |
| DE10223945B4 (en) * | 2002-05-29 | 2006-12-21 | Advanced Micro Devices, Inc., Sunnyvale | Method for improving the production of damascene metal structures |
| US7853904B2 (en) * | 2002-06-07 | 2010-12-14 | Cadence Design Systems, Inc. | Method and system for handling process related variations for integrated circuits based upon reflections |
| AU2003274370A1 (en) * | 2002-06-07 | 2003-12-22 | Praesagus, Inc. | Characterization adn reduction of variation for integrated circuits |
| US7363099B2 (en) * | 2002-06-07 | 2008-04-22 | Cadence Design Systems, Inc. | Integrated circuit metrology |
| US20040038502A1 (en) * | 2002-06-26 | 2004-02-26 | Sethuraman Jayashankar | Method of detecting chemical mechanical polishing endpoints in thin film head processes |
| US7042564B2 (en) * | 2002-08-08 | 2006-05-09 | Applied Materials, Israel, Ltd. | Wafer inspection methods and an optical inspection tool |
| US7235488B2 (en) | 2002-08-28 | 2007-06-26 | Micron Technology, Inc. | In-situ chemical-mechanical planarization pad metrology using ultrasonic imaging |
| US6970043B2 (en) * | 2002-10-29 | 2005-11-29 | Fairchild Semiconductor Corporation | Low voltage, low power differential receiver |
| US6676483B1 (en) * | 2003-02-03 | 2004-01-13 | Rodel Holdings, Inc. | Anti-scattering layer for polishing pad windows |
| SG125108A1 (en) * | 2003-03-11 | 2006-09-29 | Asml Netherlands Bv | Assembly comprising a sensor for determining at least one of tilt and height of a substrate, a method therefor and a lithographic projection apparatus |
| US7217649B2 (en) * | 2003-03-14 | 2007-05-15 | Lam Research Corporation | System and method for stress free conductor removal |
| US7232766B2 (en) * | 2003-03-14 | 2007-06-19 | Lam Research Corporation | System and method for surface reduction, passivation, corrosion prevention and activation of copper surface |
| US7009281B2 (en) * | 2003-03-14 | 2006-03-07 | Lam Corporation | Small volume process chamber with hot inner surfaces |
| US7078344B2 (en) * | 2003-03-14 | 2006-07-18 | Lam Research Corporation | Stress free etch processing in combination with a dynamic liquid meniscus |
| JP4219718B2 (en) * | 2003-03-28 | 2009-02-04 | Ｈｏｙａ株式会社 | Manufacturing method of glass substrate for EUV mask blanks and manufacturing method of EUV mask blanks |
| US20050026542A1 (en) * | 2003-07-31 | 2005-02-03 | Tezer Battal | Detection system for chemical-mechanical planarization tool |
| JP4174399B2 (en) * | 2003-09-24 | 2008-10-29 | 株式会社東芝 | INSPECTION SYSTEM, INSPECTION METHOD, AND ELECTRONIC DEVICE MANUFACTURING METHOD |
| US7050880B2 (en) * | 2003-12-30 | 2006-05-23 | Sc Solutions | Chemical-mechanical planarization controller |
| US7315642B2 (en) * | 2004-02-12 | 2008-01-01 | Applied Materials, Israel, Ltd. | System and method for measuring thin film thickness variations and for compensating for the variations |
| US20050197721A1 (en) * | 2004-02-20 | 2005-09-08 | Yung-Cheng Chen | Control of exposure energy on a substrate |
| EP1758711B1 (en) * | 2004-06-21 | 2013-08-07 | Ebara Corporation | Polishing apparatus and polishing method |
| JP4505634B2 (en) * | 2004-08-13 | 2010-07-21 | 国立大学法人東北大学 | Method for evaluating electronic component using semiconductor and method for managing electronic component using semiconductor |
| KR20060078252A (en) * | 2004-12-31 | 2006-07-05 | 동부일렉트로닉스 주식회사 | Monitor pattern for sti cmp process |
| KR101361875B1 (en) | 2005-05-26 | 2014-02-12 | 가부시키가이샤 니콘 | Method for detecting polishing end in cmp polishing device, cmp polishing device, and semiconductor device manufacturing method |
| EP1808823A1 (en) * | 2005-12-14 | 2007-07-18 | Wincor Nixdorf International GmbH | Apparatus for assessing the authenticity of a valuable medium |
| US7849281B2 (en) * | 2006-04-03 | 2010-12-07 | Emc Corporation | Method and system for implementing hierarchical permission maps in a layered volume graph |
| JP5283506B2 (en) * | 2006-09-12 | 2013-09-04 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| US8260035B2 (en) * | 2006-09-22 | 2012-09-04 | Kla-Tencor Corporation | Threshold determination in an inspection system |
| CN102490112B (en) * | 2006-10-06 | 2015-03-25 | 株式会社荏原制作所 | Processing end point detecting method, polishing method and polishing apparatus |
| JP4988380B2 (en) * | 2007-02-26 | 2012-08-01 | ルネサスエレクトロニクス株式会社 | Semiconductor device manufacturing method and semiconductor manufacturing apparatus |
| US20090181475A1 (en) * | 2008-01-11 | 2009-07-16 | Novellus Systems, Inc. | Detecting the presence of a workpiece relative to a carrier head |
| DE102008021569A1 (en) * | 2008-04-30 | 2009-11-05 | Advanced Micro Devices, Inc., Sunnyvale | System and method for optical endpoint detection during CMP using a substrate spanning signal |
| US20090275265A1 (en) * | 2008-05-02 | 2009-11-05 | Applied Materials, Inc. | Endpoint detection in chemical mechanical polishing using multiple spectra |
| KR101013569B1 (en) * | 2008-12-30 | 2011-02-14 | 창익기계공업(주) | Feeding device and key-pad puncher thereof |
| EP2571655B1 (en) * | 2010-05-18 | 2014-04-23 | Marposs Societa' Per Azioni | Method and apparatus for optically measuring by interferometry the thickness of an object |
| IT1399875B1 (en) * | 2010-05-18 | 2013-05-09 | Marposs Spa | METHOD AND EQUIPMENT FOR THE OPTICAL MEASUREMENT BY INTERFEROMETRY OF THE THICKNESS OF AN OBJECT |
| IT1399876B1 (en) * | 2010-05-18 | 2013-05-09 | Marposs Spa | METHOD AND EQUIPMENT FOR THE OPTICAL MEASUREMENT BY INTERFEROMETRY OF THE THICKNESS OF AN OBJECT |
| CN102812157B (en) * | 2010-11-30 | 2014-08-20 | 深圳市华星光电技术有限公司 | Method For Etching Metal, Control Method For Etching Metal And Apparatus Thereof |
| CN102221416B (en) * | 2011-03-10 | 2012-10-10 | 清华大学 | Polishing solution physical parameter measuring apparatus, measuring method and chemically mechanical polishing equipment |
| US8563335B1 (en) * | 2012-04-23 | 2013-10-22 | Applied Materials, Inc. | Method of controlling polishing using in-situ optical monitoring and fourier transform |
| US9011202B2 (en) | 2012-04-25 | 2015-04-21 | Applied Materials, Inc. | Fitting of optical model with diffraction effects to measured spectrum |
| US9248544B2 (en) * | 2012-07-18 | 2016-02-02 | Applied Materials, Inc. | Endpoint detection during polishing using integrated differential intensity |
| US20140078495A1 (en) * | 2012-09-14 | 2014-03-20 | Stmicroelectronics, Inc. | Inline metrology for attaining full wafer map of uniformity and surface charge |
| US10513006B2 (en) * | 2013-02-04 | 2019-12-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | High throughput CMP platform |
| US9242337B2 (en) | 2013-03-15 | 2016-01-26 | Applied Materials, Inc. | Dynamic residue clearing control with in-situ profile control (ISPC) |
| US10309013B2 (en) * | 2013-03-15 | 2019-06-04 | Applied Materials, Inc. | Method and system for identifying a clean endpoint time for a chamber |
| CN103394994B (en) * | 2013-07-18 | 2017-12-15 | 上海集成电路研发中心有限公司 | A kind of polishing method of wafer |
| TW201543016A (en) * | 2014-05-06 | 2015-11-16 | 蘋果傑克１９９有限合夥公司 | Stress analysis of semiconductor wafers |
| CN104034765A (en) * | 2014-07-07 | 2014-09-10 | 中国船舶重工集团公司第七二五研究所 | Electrochemical detection method through partial morphology scanning |
| CN105437076A (en) * | 2014-08-27 | 2016-03-30 | 中芯国际集成电路制造(上海)有限公司 | Real-time control method and system for wafer contour |
| US11639881B1 (en) | 2014-11-19 | 2023-05-02 | Carlos A. Rosero | Integrated, continuous diagnosis, and fault detection of hydrodynamic bearings by capacitance sensing |
| US9835449B2 (en) | 2015-08-26 | 2017-12-05 | Industrial Technology Research Institute | Surface measuring device and method thereof |
| CN108608328B (en) * | 2018-07-06 | 2023-09-26 | 中国工程物理研究院激光聚变研究中心 | Polishing friction force measuring device and measuring method thereof |
| US11756840B2 (en) * | 2018-09-20 | 2023-09-12 | Taiwan Semiconductor Manufacturing Co., Ltd. | Reflectance measurement system and method thereof |
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|---|---|---|---|---|
| US4959113C1 (en) | 1989-07-31 | 2001-03-13 | Rodel Inc | Method and composition for polishing metal surfaces |
| US5094536A (en) * | 1990-11-05 | 1992-03-10 | Litel Instruments | Deformable wafer chuck |
| US5069002A (en) | 1991-04-17 | 1991-12-03 | Micron Technology, Inc. | Apparatus for endpoint detection during mechanical planarization of semiconductor wafers |
| US5499733A (en) | 1992-09-17 | 1996-03-19 | Luxtron Corporation | Optical techniques of measuring endpoint during the processing of material layers in an optically hostile environment |
| US5486129A (en) | 1993-08-25 | 1996-01-23 | Micron Technology, Inc. | System and method for real-time control of semiconductor a wafer polishing, and a polishing head |
| JP3311116B2 (en) | 1993-10-28 | 2002-08-05 | 株式会社東芝 | Semiconductor manufacturing equipment |
| US5433651A (en) | 1993-12-22 | 1995-07-18 | International Business Machines Corporation | In-situ endpoint detection and process monitoring method and apparatus for chemical-mechanical polishing |
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| US5985679A (en) | 1997-06-12 | 1999-11-16 | Lsi Logic Corporation | Automated endpoint detection system during chemical-mechanical polishing |
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| US6531397B1 (en) | 1998-01-09 | 2003-03-11 | Lsi Logic Corporation | Method and apparatus for using across wafer back pressure differentials to influence the performance of chemical mechanical polishing |
| US6068539A (en) | 1998-03-10 | 2000-05-30 | Lam Research Corporation | Wafer polishing device with movable window |
| US6063306A (en) | 1998-06-26 | 2000-05-16 | Cabot Corporation | Chemical mechanical polishing slurry useful for copper/tantalum substrate |
| US5972787A (en) | 1998-08-18 | 1999-10-26 | International Business Machines Corp. | CMP process using indicator areas to determine endpoint |
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| US6071177A (en) | 1999-03-30 | 2000-06-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Method and apparatus for determining end point in a polishing process |
| US6068549A (en) | 1999-06-28 | 2000-05-30 | Mitsubishi Materials Corporation | Structure and method for three chamber CMP polishing head |
| US6776692B1 (en) * | 1999-07-09 | 2004-08-17 | Applied Materials Inc. | Closed-loop control of wafer polishing in a chemical mechanical polishing system |
| US6290584B1 (en) | 1999-08-13 | 2001-09-18 | Speedfam-Ipec Corporation | Workpiece carrier with segmented and floating retaining elements |
| US6476921B1 (en) * | 2000-07-31 | 2002-11-05 | Asml Us, Inc. | In-situ method and apparatus for end point detection in chemical mechanical polishing |
| US6257953B1 (en) | 2000-09-25 | 2001-07-10 | Center For Tribology, Inc. | Method and apparatus for controlled polishing |
-
2001
- 2001-07-31 EP EP01957372A patent/EP1322940A4/en not_active Withdrawn
- 2001-07-31 AU AU2001279126A patent/AU2001279126A1/en not_active Abandoned
- 2001-07-31 KR KR10-2003-7001394A patent/KR20030025281A/en not_active Application Discontinuation
- 2001-07-31 JP JP2002516606A patent/JP2004514273A/en active Pending
- 2001-07-31 MY MYPI20013602A patent/MY128145A/en unknown
- 2001-07-31 CN CNA018155251A patent/CN1466676A/en active Pending
- 2001-07-31 WO PCT/US2001/024146 patent/WO2002010729A1/en active Application Filing
- 2001-07-31 TW TW090118624A patent/TW491753B/en not_active IP Right Cessation
- 2001-12-21 US US10/029,080 patent/US6798529B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20030025281A (en) | 2003-03-28 |
| WO2002010729A1 (en) | 2002-02-07 |
| US20030045100A1 (en) | 2003-03-06 |
| JP2004514273A (en) | 2004-05-13 |
| MY128145A (en) | 2007-01-31 |
| TW491753B (en) | 2002-06-21 |
| CN1466676A (en) | 2004-01-07 |
| EP1322940A1 (en) | 2003-07-02 |
| EP1322940A4 (en) | 2006-03-15 |
| US6798529B2 (en) | 2004-09-28 |
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