AU2001278560A1 - Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card - Google Patents

Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card

Info

Publication number
AU2001278560A1
AU2001278560A1 AU2001278560A AU7856001A AU2001278560A1 AU 2001278560 A1 AU2001278560 A1 AU 2001278560A1 AU 2001278560 A AU2001278560 A AU 2001278560A AU 7856001 A AU7856001 A AU 7856001A AU 2001278560 A1 AU2001278560 A1 AU 2001278560A1
Authority
AU
Australia
Prior art keywords
card
tips
plane
testing
making
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001278560A
Inventor
Abdel Nacer Ait Mani
Andre Belmont
Laurent Robert
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mesatronic SA
Original Assignee
Mesatronic SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mesatronic SA filed Critical Mesatronic SA
Publication of AU2001278560A1 publication Critical patent/AU2001278560A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/0735—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card arranged on a flexible frame or film
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects
    • G01R1/06738—Geometry aspects related to tip portion
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007—Surface contacts, e.g. bumps
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49147—Assembling terminal to base
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155—Manufacturing circuit on or in base

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

The invention concerns a method for making a card with tips for testing semiconductor chips with microsphere bond pads. A first adhesive coat is vacuum deposited on a flexible polyimide film, followed by a second metal coat. A combination of UV photolithography and electroforming of a metal material enables to obtain the implantation of the tips. The pattern of the strip conductors is obtained by a second UV lithography operation whereby the second metal layer and the first adhesive coat are etched. An insulating protective resist is deposited on the active conductive zone. The flexible film is mounted on a truncated maintaining component whereof the vertical translational and planar rotational movements are made possible by a guide supported on a spring suspension. The defective alignment between the plane of the tips and the plane of the tips and the printed circuit plane is corrected by a correcting system with three support points adjustable with screws.
AU2001278560A 2000-07-28 2001-07-24 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card Abandoned AU2001278560A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR0009930 2000-07-28
FR0009930A FR2812400B1 (en) 2000-07-28 2000-07-28 METHOD FOR MANUFACTURING A MULTIPLE CONTACT POINT CARD FOR TESTING MICROBALL INTEGRATED CIRCUITS, AND TEST DEVICE USING THE CARD
PCT/FR2001/002411 WO2002010779A1 (en) 2000-07-28 2001-07-24 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card

Publications (1)

Publication Number Publication Date
AU2001278560A1 true AU2001278560A1 (en) 2002-02-13

Family

ID=8853028

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001278560A Abandoned AU2001278560A1 (en) 2000-07-28 2001-07-24 Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card

Country Status (10)

Country Link
US (1) US6873145B2 (en)
EP (1) EP1218757B1 (en)
JP (1) JP2004505280A (en)
KR (1) KR100798669B1 (en)
CN (1) CN1158531C (en)
AT (1) ATE262183T1 (en)
AU (1) AU2001278560A1 (en)
DE (1) DE60102345T2 (en)
FR (1) FR2812400B1 (en)
WO (1) WO2002010779A1 (en)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100373405C (en) * 2003-02-19 2008-03-05 中兴通讯股份有限公司 A network card packaging arrangement and packaging method thereof
JP2004356362A (en) * 2003-05-29 2004-12-16 Dainippon Screen Mfg Co Ltd Substrate for manufacturing probe card, testing device, device, and method for three-dimensional molding
JP3976276B2 (en) * 2005-06-10 2007-09-12 日本航空電子工業株式会社 Inspection device
FR2899691B1 (en) * 2006-04-06 2008-05-30 Mesatronic Sa FLEXIBLE MEMBRANE TEST CARD PROVIDED WITH CONTACT POINTS GUIDED BY A CENTRALLY ADJUSTED SUSPENSION MECHANISM
JP5288248B2 (en) * 2008-06-04 2013-09-11 軍生 木本 Electrical signal connection device
CN102094624B (en) * 2009-12-14 2013-10-30 西安威尔罗根能源科技有限公司 Power supply circuit of main current for microsphere focused logging
FR3006551B1 (en) * 2013-05-30 2016-12-09 Linxens Holding METHOD FOR MANUFACTURING A PRINTED CIRCUIT, PRINTED CIRCUIT OBTAINED BY THIS METHOD AND ELECTRONIC MODULE COMPRISING SUCH A CIRCUIT PRINTED

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2077718A1 (en) * 1970-02-09 1971-11-05 Comp Generale Electricite
JP3096234B2 (en) * 1995-10-30 2000-10-10 日東電工株式会社 Method of manufacturing probe structure
FR2762140B1 (en) * 1997-04-10 2000-01-14 Mesatronic METHOD FOR MANUFACTURING A MULTIPLE CONTACT POINT CARD FOR TESTING SEMICONDUCTOR CHIPS
JPH1123615A (en) * 1997-05-09 1999-01-29 Hitachi Ltd Connector and inspection system
JP2000150594A (en) * 1998-11-05 2000-05-30 Hitachi Ltd Connecting apparatus, manufacture of wiring film with biasing member and manufacture of inspection system and semiconductor element
JP3949849B2 (en) * 1999-07-19 2007-07-25 日東電工株式会社 Manufacturing method of interposer for chip size package and interposer for chip size package
JP2001267747A (en) * 2000-03-22 2001-09-28 Nitto Denko Corp Manufacturing method for multi-layered circuit board

Also Published As

Publication number Publication date
EP1218757B1 (en) 2004-03-17
US6873145B2 (en) 2005-03-29
US20020121912A1 (en) 2002-09-05
JP2004505280A (en) 2004-02-19
EP1218757A1 (en) 2002-07-03
CN1386198A (en) 2002-12-18
DE60102345T2 (en) 2005-03-17
KR100798669B1 (en) 2008-01-28
FR2812400A1 (en) 2002-02-01
KR20020035886A (en) 2002-05-15
ATE262183T1 (en) 2004-04-15
DE60102345D1 (en) 2004-04-22
CN1158531C (en) 2004-07-21
WO2002010779A1 (en) 2002-02-07
FR2812400B1 (en) 2002-09-27

Similar Documents

Publication Publication Date Title
KR0150334B1 (en) Probe card having vertical needle
KR100423683B1 (en) Interconnect assembly for printed circuit boards and method of fabrication
KR100928881B1 (en) Inspection Contact and Probe Card
US6859054B1 (en) Probe contact system using flexible printed circuit board
US4526859A (en) Metallization of a ceramic substrate
JPH07321170A (en) Probe collection body for ic circuit testing instrument
AU6662998A (en) Probe card and system for testing wafers
JPH09281144A (en) Probe card and its manufacture
US5629630A (en) Semiconductor wafer contact system and method for contacting a semiconductor wafer
WO1999045588A3 (en) Semiconductor device comprising a glass supporting body onto which a substrate with semiconductor elements and a metallization is attached by means of an adhesive
US6897089B1 (en) Method and system for fabricating semiconductor components using wafer level contact printing
CA2358405A1 (en) Text probe interface assembly and manufacture method
AU2001278560A1 (en) Method for making a card with multiple contact tips for testing microsphere integrated circuits, and testing device using said card
KR100728453B1 (en) Probe arrangement assembly, method of manufacturing probe arrangement assembly, probe mounting method using probe arrangement assembly, and probe mounting apparatus
JP2009503535A (en) Vertical probe, manufacturing method thereof, and probe bonding method
US5087877A (en) Test contact fixture using flexible circuit tape
JP2001332323A (en) Silicon electrode and high frequency contact point sheet as well as manufacturing method of silicon electrode
JP3544036B2 (en) Bare chip test socket
KR101922848B1 (en) Probe card with elastic body
JPH02221881A (en) Probe for testing integrated circuit device
JPH11154694A (en) Method of alignment for batch wafer measuring test and method for manufacturing probe card
JP2003121468A (en) Electrode prober
US5900316A (en) Flexible conductive sheet
GB2177253A (en) Electrical interconnection arrangement
US5898311A (en) Shorting pad having a flexible conductive sheet