US6339604B1
(en)
|
1998-06-12 |
2002-01-15 |
General Scanning, Inc. |
Pulse control in laser systems
|
US6144118A
(en)
|
1998-09-18 |
2000-11-07 |
General Scanning, Inc. |
High-speed precision positioning apparatus
|
US8217304B2
(en)
*
|
2001-03-29 |
2012-07-10 |
Gsi Group Corporation |
Methods and systems for thermal-based laser processing a multi-material device
|
US7723642B2
(en)
|
1999-12-28 |
2010-05-25 |
Gsi Group Corporation |
Laser-based system for memory link processing with picosecond lasers
|
US7838794B2
(en)
|
1999-12-28 |
2010-11-23 |
Gsi Group Corporation |
Laser-based method and system for removing one or more target link structures
|
US7671295B2
(en)
*
|
2000-01-10 |
2010-03-02 |
Electro Scientific Industries, Inc. |
Processing a memory link with a set of at least two laser pulses
|
US6882665B2
(en)
*
|
2000-10-10 |
2005-04-19 |
Fuji Photo Film Co., Ltd. |
Light wavelength converting module
|
US6642601B2
(en)
*
|
2000-12-18 |
2003-11-04 |
Texas Instruments Incorporated |
Low current substantially silicide fuse for integrated circuits
|
US7048907B2
(en)
*
|
2001-02-05 |
2006-05-23 |
Biophysics Assay Laboratory, Inc. |
Synthesis, compositions and methods for the measurement of the concentration of stable-isotope labeled compounds in life forms and life form excretory products
|
US20070173075A1
(en)
*
|
2001-03-29 |
2007-07-26 |
Joohan Lee |
Laser-based method and system for processing a multi-material device having conductive link structures
|
US7563695B2
(en)
*
|
2002-03-27 |
2009-07-21 |
Gsi Group Corporation |
Method and system for high-speed precise laser trimming and scan lens for use therein
|
US6951995B2
(en)
|
2002-03-27 |
2005-10-04 |
Gsi Lumonics Corp. |
Method and system for high-speed, precise micromachining an array of devices
|
US7616669B2
(en)
*
|
2003-06-30 |
2009-11-10 |
Electro Scientific Industries, Inc. |
High energy pulse suppression method
|
US6947454B2
(en)
*
|
2003-06-30 |
2005-09-20 |
Electro Scientific Industries, Inc. |
Laser pulse picking employing controlled AOM loading
|
US6836329B1
(en)
|
2003-07-09 |
2004-12-28 |
International Business Machines Corporation |
Real time IR optical sensor
|
US7804043B2
(en)
*
|
2004-06-15 |
2010-09-28 |
Laserfacturing Inc. |
Method and apparatus for dicing of thin and ultra thin semiconductor wafer using ultrafast pulse laser
|
US8148211B2
(en)
*
|
2004-06-18 |
2012-04-03 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
|
US7629234B2
(en)
*
|
2004-06-18 |
2009-12-08 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
|
US20090011614A1
(en)
*
|
2004-06-18 |
2009-01-08 |
Electro Scientific Industries, Inc. |
Reconfigurable semiconductor structure processing using multiple laser beam spots
|
TWI366216B
(en)
*
|
2004-06-18 |
2012-06-11 |
Electro Scient Ind Inc |
Semiconductor structure processing using multiple laser beam spots
|
US8383982B2
(en)
*
|
2004-06-18 |
2013-02-26 |
Electro Scientific Industries, Inc. |
Methods and systems for semiconductor structure processing using multiple laser beam spots
|
US7935941B2
(en)
*
|
2004-06-18 |
2011-05-03 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
|
US7687740B2
(en)
*
|
2004-06-18 |
2010-03-30 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
|
US7435927B2
(en)
*
|
2004-06-18 |
2008-10-14 |
Electron Scientific Industries, Inc. |
Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
|
US7633034B2
(en)
*
|
2004-06-18 |
2009-12-15 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
|
JP5294629B2
(en)
*
|
2004-06-18 |
2013-09-18 |
エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド |
Semiconductor structure processing using multiple laser beam spots
|
US7923306B2
(en)
*
|
2004-06-18 |
2011-04-12 |
Electro Scientific Industries, Inc. |
Semiconductor structure processing using multiple laser beam spots
|
US20060000814A1
(en)
*
|
2004-06-30 |
2006-01-05 |
Bo Gu |
Laser-based method and system for processing targeted surface material and article produced thereby
|
JP4698200B2
(en)
*
|
2004-10-27 |
2011-06-08 |
日立造船株式会社 |
Laser processing method and laser processing apparatus
|
US20060114948A1
(en)
*
|
2004-11-29 |
2006-06-01 |
Lo Ho W |
Workpiece processing system using a common imaged optical assembly to shape the spatial distributions of light energy of multiple laser beams
|
US20100193481A1
(en)
*
|
2004-11-29 |
2010-08-05 |
Electro Scientific Industries, Inc. |
Laser constructed with multiple output couplers to generate multiple output beams
|
US7396706B2
(en)
*
|
2004-12-09 |
2008-07-08 |
Electro Scientific Industries, Inc. |
Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks
|
US20060191884A1
(en)
*
|
2005-01-21 |
2006-08-31 |
Johnson Shepard D |
High-speed, precise, laser-based material processing method and system
|
US7318778B2
(en)
*
|
2005-06-11 |
2008-01-15 |
Owens Mark R |
Golf putter with removable laser
|
US7315038B2
(en)
*
|
2005-08-26 |
2008-01-01 |
Electro Scientific Industries, Inc. |
Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as an alignment target
|
US7297972B2
(en)
*
|
2005-08-26 |
2007-11-20 |
Electro Scientific Industries, Inc. |
Methods and systems for positioning a laser beam spot relative to a semiconductor integrated circuit using a processing target as a metrology target
|
US20070215575A1
(en)
*
|
2006-03-15 |
2007-09-20 |
Bo Gu |
Method and system for high-speed, precise, laser-based modification of one or more electrical elements
|
US8084706B2
(en)
*
|
2006-07-20 |
2011-12-27 |
Gsi Group Corporation |
System and method for laser processing at non-constant velocities
|
KR100804425B1
(en)
*
|
2006-10-02 |
2008-02-20 |
(주)미래컴퍼니 |
Apparatus and method for controlling laser pulse
|
JP2008147406A
(en)
*
|
2006-12-08 |
2008-06-26 |
Cyber Laser Kk |
Method and device for correcting integrated circuit by laser
|
CA2688771A1
(en)
*
|
2007-05-18 |
2008-11-27 |
Gsi Group Corporation |
Laser processing of conductive links
|
JP2009018335A
(en)
*
|
2007-07-13 |
2009-01-29 |
Sharp Corp |
Device and method for emitting beam and method of manufacturing functional element
|
US20100067886A1
(en)
*
|
2008-09-16 |
2010-03-18 |
Tokyo Electron Limited |
Ir laser optics system for dielectric treatment module
|
US8294887B1
(en)
*
|
2009-07-22 |
2012-10-23 |
Kla-Tencor Corporation |
Fast laser power control with improved reliability for surface inspection
|
WO2011082065A2
(en)
*
|
2009-12-30 |
2011-07-07 |
Gsi Group Corporation |
Link processing with high speed beam deflection
|
US8642448B2
(en)
|
2010-06-22 |
2014-02-04 |
Applied Materials, Inc. |
Wafer dicing using femtosecond-based laser and plasma etch
|
US8912077B2
(en)
|
2011-06-15 |
2014-12-16 |
Applied Materials, Inc. |
Hybrid laser and plasma etch wafer dicing using substrate carrier
|
US9126285B2
(en)
|
2011-06-15 |
2015-09-08 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using physically-removable mask
|
US9129904B2
(en)
|
2011-06-15 |
2015-09-08 |
Applied Materials, Inc. |
Wafer dicing using pulse train laser with multiple-pulse bursts and plasma etch
|
US8598016B2
(en)
|
2011-06-15 |
2013-12-03 |
Applied Materials, Inc. |
In-situ deposited mask layer for device singulation by laser scribing and plasma etch
|
US9029242B2
(en)
|
2011-06-15 |
2015-05-12 |
Applied Materials, Inc. |
Damage isolation by shaped beam delivery in laser scribing process
|
US8759197B2
(en)
|
2011-06-15 |
2014-06-24 |
Applied Materials, Inc. |
Multi-step and asymmetrically shaped laser beam scribing
|
US8703581B2
(en)
|
2011-06-15 |
2014-04-22 |
Applied Materials, Inc. |
Water soluble mask for substrate dicing by laser and plasma etch
|
US8507363B2
(en)
|
2011-06-15 |
2013-08-13 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using water-soluble die attach film
|
US8557683B2
(en)
|
2011-06-15 |
2013-10-15 |
Applied Materials, Inc. |
Multi-step and asymmetrically shaped laser beam scribing
|
US8557682B2
(en)
|
2011-06-15 |
2013-10-15 |
Applied Materials, Inc. |
Multi-layer mask for substrate dicing by laser and plasma etch
|
KR102138223B1
(en)
|
2011-07-05 |
2020-07-28 |
일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 |
Systems and methods for providing temperature stability of acousto-optic beam deflectors and acousto-optic modulators during use
|
US8951819B2
(en)
|
2011-07-11 |
2015-02-10 |
Applied Materials, Inc. |
Wafer dicing using hybrid split-beam laser scribing process with plasma etch
|
US8652940B2
(en)
|
2012-04-10 |
2014-02-18 |
Applied Materials, Inc. |
Wafer dicing used hybrid multi-step laser scribing process with plasma etch
|
US8946057B2
(en)
|
2012-04-24 |
2015-02-03 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing using UV-curable adhesive film
|
US8969177B2
(en)
|
2012-06-29 |
2015-03-03 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing with a double sided UV-curable adhesive film
|
US9048309B2
(en)
|
2012-07-10 |
2015-06-02 |
Applied Materials, Inc. |
Uniform masking for wafer dicing using laser and plasma etch
|
US8845854B2
(en)
|
2012-07-13 |
2014-09-30 |
Applied Materials, Inc. |
Laser, plasma etch, and backside grind process for wafer dicing
|
US8940619B2
(en)
|
2012-07-13 |
2015-01-27 |
Applied Materials, Inc. |
Method of diced wafer transportation
|
US8859397B2
(en)
|
2012-07-13 |
2014-10-14 |
Applied Materials, Inc. |
Method of coating water soluble mask for laser scribing and plasma etch
|
US8993414B2
(en)
|
2012-07-13 |
2015-03-31 |
Applied Materials, Inc. |
Laser scribing and plasma etch for high die break strength and clean sidewall
|
KR101868609B1
(en)
*
|
2012-08-14 |
2018-06-19 |
한국단자공업 주식회사 |
Fuse making method
|
US9159574B2
(en)
|
2012-08-27 |
2015-10-13 |
Applied Materials, Inc. |
Method of silicon etch for trench sidewall smoothing
|
US8809165B2
(en)
*
|
2012-08-27 |
2014-08-19 |
Infineon Technologies Ag |
Method for fusing a laser fuse and method for processing a wafer
|
KR20140036593A
(en)
|
2012-09-17 |
2014-03-26 |
삼성디스플레이 주식회사 |
Laser processing apparatus
|
US9252057B2
(en)
|
2012-10-17 |
2016-02-02 |
Applied Materials, Inc. |
Laser and plasma etch wafer dicing with partial pre-curing of UV release dicing tape for film frame wafer application
|
US8975162B2
(en)
|
2012-12-20 |
2015-03-10 |
Applied Materials, Inc. |
Wafer dicing from wafer backside
|
US9236305B2
(en)
|
2013-01-25 |
2016-01-12 |
Applied Materials, Inc. |
Wafer dicing with etch chamber shield ring for film frame wafer applications
|
US8980726B2
(en)
|
2013-01-25 |
2015-03-17 |
Applied Materials, Inc. |
Substrate dicing by laser ablation and plasma etch damage removal for ultra-thin wafers
|
WO2014159464A1
(en)
|
2013-03-14 |
2014-10-02 |
Applied Materials, Inc. |
Multi-layer mask including non-photodefinable laser energy absorbing layer for substrate dicing by laser and plasma etch
|
US8883614B1
(en)
|
2013-05-22 |
2014-11-11 |
Applied Materials, Inc. |
Wafer dicing with wide kerf by laser scribing and plasma etching hybrid approach
|
US9105710B2
(en)
|
2013-08-30 |
2015-08-11 |
Applied Materials, Inc. |
Wafer dicing method for improving die packaging quality
|
US9224650B2
(en)
|
2013-09-19 |
2015-12-29 |
Applied Materials, Inc. |
Wafer dicing from wafer backside and front side
|
US9460966B2
(en)
|
2013-10-10 |
2016-10-04 |
Applied Materials, Inc. |
Method and apparatus for dicing wafers having thick passivation polymer layer
|
US9041198B2
(en)
|
2013-10-22 |
2015-05-26 |
Applied Materials, Inc. |
Maskless hybrid laser scribing and plasma etching wafer dicing process
|
US9312177B2
(en)
|
2013-12-06 |
2016-04-12 |
Applied Materials, Inc. |
Screen print mask for laser scribe and plasma etch wafer dicing process
|
US9299614B2
(en)
|
2013-12-10 |
2016-03-29 |
Applied Materials, Inc. |
Method and carrier for dicing a wafer
|
US9293304B2
(en)
|
2013-12-17 |
2016-03-22 |
Applied Materials, Inc. |
Plasma thermal shield for heat dissipation in plasma chamber
|
US8927393B1
(en)
|
2014-01-29 |
2015-01-06 |
Applied Materials, Inc. |
Water soluble mask formation by dry film vacuum lamination for laser and plasma dicing
|
US9018079B1
(en)
|
2014-01-29 |
2015-04-28 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate reactive post mask-opening clean
|
US9299611B2
(en)
|
2014-01-29 |
2016-03-29 |
Applied Materials, Inc. |
Method of wafer dicing using hybrid laser scribing and plasma etch approach with mask plasma treatment for improved mask etch resistance
|
US9012305B1
(en)
|
2014-01-29 |
2015-04-21 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with intermediate non-reactive post mask-opening clean
|
US8991329B1
(en)
|
2014-01-31 |
2015-03-31 |
Applied Materials, Inc. |
Wafer coating
|
US9236284B2
(en)
|
2014-01-31 |
2016-01-12 |
Applied Materials, Inc. |
Cooled tape frame lift and low contact shadow ring for plasma heat isolation
|
US9130030B1
(en)
|
2014-03-07 |
2015-09-08 |
Applied Materials, Inc. |
Baking tool for improved wafer coating process
|
US20150255349A1
(en)
|
2014-03-07 |
2015-09-10 |
JAMES Matthew HOLDEN |
Approaches for cleaning a wafer during hybrid laser scribing and plasma etching wafer dicing processes
|
US9275902B2
(en)
|
2014-03-26 |
2016-03-01 |
Applied Materials, Inc. |
Dicing processes for thin wafers with bumps on wafer backside
|
US9076860B1
(en)
|
2014-04-04 |
2015-07-07 |
Applied Materials, Inc. |
Residue removal from singulated die sidewall
|
US8975163B1
(en)
|
2014-04-10 |
2015-03-10 |
Applied Materials, Inc. |
Laser-dominated laser scribing and plasma etch hybrid wafer dicing
|
US8932939B1
(en)
|
2014-04-14 |
2015-01-13 |
Applied Materials, Inc. |
Water soluble mask formation by dry film lamination
|
US8912078B1
(en)
|
2014-04-16 |
2014-12-16 |
Applied Materials, Inc. |
Dicing wafers having solder bumps on wafer backside
|
US8999816B1
(en)
|
2014-04-18 |
2015-04-07 |
Applied Materials, Inc. |
Pre-patterned dry laminate mask for wafer dicing processes
|
US9159621B1
(en)
|
2014-04-29 |
2015-10-13 |
Applied Materials, Inc. |
Dicing tape protection for wafer dicing using laser scribe process
|
US8912075B1
(en)
|
2014-04-29 |
2014-12-16 |
Applied Materials, Inc. |
Wafer edge warp supression for thin wafer supported by tape frame
|
US8980727B1
(en)
|
2014-05-07 |
2015-03-17 |
Applied Materials, Inc. |
Substrate patterning using hybrid laser scribing and plasma etching processing schemes
|
US9112050B1
(en)
|
2014-05-13 |
2015-08-18 |
Applied Materials, Inc. |
Dicing tape thermal management by wafer frame support ring cooling during plasma dicing
|
US9034771B1
(en)
|
2014-05-23 |
2015-05-19 |
Applied Materials, Inc. |
Cooling pedestal for dicing tape thermal management during plasma dicing
|
US9093518B1
(en)
|
2014-06-30 |
2015-07-28 |
Applied Materials, Inc. |
Singulation of wafers having wafer-level underfill
|
US9165832B1
(en)
|
2014-06-30 |
2015-10-20 |
Applied Materials, Inc. |
Method of die singulation using laser ablation and induction of internal defects with a laser
|
US9142459B1
(en)
|
2014-06-30 |
2015-09-22 |
Applied Materials, Inc. |
Wafer dicing using hybrid laser scribing and plasma etch approach with mask application by vacuum lamination
|
US9130057B1
(en)
|
2014-06-30 |
2015-09-08 |
Applied Materials, Inc. |
Hybrid dicing process using a blade and laser
|
KR101602782B1
(en)
|
2014-07-03 |
2016-03-11 |
주식회사 이오테크닉스 |
Method for marking wafer
|
US9349648B2
(en)
|
2014-07-22 |
2016-05-24 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a rectangular shaped two-dimensional top hat laser beam profile or a linear shaped one-dimensional top hat laser beam profile laser scribing process and plasma etch process
|
US9117868B1
(en)
|
2014-08-12 |
2015-08-25 |
Applied Materials, Inc. |
Bipolar electrostatic chuck for dicing tape thermal management during plasma dicing
|
US9196498B1
(en)
|
2014-08-12 |
2015-11-24 |
Applied Materials, Inc. |
Stationary actively-cooled shadow ring for heat dissipation in plasma chamber
|
US9281244B1
(en)
|
2014-09-18 |
2016-03-08 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using an adaptive optics-controlled laser scribing process and plasma etch process
|
US9177861B1
(en)
|
2014-09-19 |
2015-11-03 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using laser scribing process based on an elliptical laser beam profile or a spatio-temporal controlled laser beam profile
|
US11195756B2
(en)
|
2014-09-19 |
2021-12-07 |
Applied Materials, Inc. |
Proximity contact cover ring for plasma dicing
|
US9196536B1
(en)
|
2014-09-25 |
2015-11-24 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a phase modulated laser beam profile laser scribing process and plasma etch process
|
US9130056B1
(en)
|
2014-10-03 |
2015-09-08 |
Applied Materials, Inc. |
Bi-layer wafer-level underfill mask for wafer dicing and approaches for performing wafer dicing
|
US9245803B1
(en)
|
2014-10-17 |
2016-01-26 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a bessel beam shaper laser scribing process and plasma etch process
|
US10692765B2
(en)
|
2014-11-07 |
2020-06-23 |
Applied Materials, Inc. |
Transfer arm for film frame substrate handling during plasma singulation of wafers
|
US9159624B1
(en)
|
2015-01-05 |
2015-10-13 |
Applied Materials, Inc. |
Vacuum lamination of polymeric dry films for wafer dicing using hybrid laser scribing and plasma etch approach
|
US9355907B1
(en)
|
2015-01-05 |
2016-05-31 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a line shaped laser beam profile laser scribing process and plasma etch process
|
US9330977B1
(en)
|
2015-01-05 |
2016-05-03 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a galvo scanner and linear stage hybrid motion laser scribing process and plasma etch process
|
US9601375B2
(en)
|
2015-04-27 |
2017-03-21 |
Applied Materials, Inc. |
UV-cure pre-treatment of carrier film for wafer dicing using hybrid laser scribing and plasma etch approach
|
US9721839B2
(en)
|
2015-06-12 |
2017-08-01 |
Applied Materials, Inc. |
Etch-resistant water soluble mask for hybrid wafer dicing using laser scribing and plasma etch
|
US9478455B1
(en)
|
2015-06-12 |
2016-10-25 |
Applied Materials, Inc. |
Thermal pyrolytic graphite shadow ring assembly for heat dissipation in plasma chamber
|
US20170176520A1
(en)
*
|
2015-12-17 |
2017-06-22 |
Qualcomm Incorporated |
Tunable wavelength electro-optical analyzer
|
US9972575B2
(en)
|
2016-03-03 |
2018-05-15 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a split beam laser scribing process and plasma etch process
|
US9852997B2
(en)
|
2016-03-25 |
2017-12-26 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a rotating beam laser scribing process and plasma etch process
|
JP6210520B1
(en)
*
|
2016-04-27 |
2017-10-11 |
レーザーテック株式会社 |
LIGHT SOURCE DEVICE, INSPECTION DEVICE, AND LIGHT SOURCE DEVICE CONTROL METHOD
|
US9793132B1
(en)
|
2016-05-13 |
2017-10-17 |
Applied Materials, Inc. |
Etch mask for hybrid laser scribing and plasma etch wafer singulation process
|
US10690602B2
(en)
*
|
2017-02-17 |
2020-06-23 |
Kla-Tencor Corporation |
Methods and systems for measurement of thick films and high aspect ratio structures
|
US11158540B2
(en)
|
2017-05-26 |
2021-10-26 |
Applied Materials, Inc. |
Light-absorbing mask for hybrid laser scribing and plasma etch wafer singulation process
|
US10363629B2
(en)
|
2017-06-01 |
2019-07-30 |
Applied Materials, Inc. |
Mitigation of particle contamination for wafer dicing processes
|
US10535561B2
(en)
|
2018-03-12 |
2020-01-14 |
Applied Materials, Inc. |
Hybrid wafer dicing approach using a multiple pass laser scribing process and plasma etch process
|
US11355394B2
(en)
|
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|
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(en)
*
|
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|
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|
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(en)
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|
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|
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|
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*
|
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(en)
*
|
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