AU2001268730A1 - Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substratesfor opto-electronic and electronic devices - Google Patents
Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substratesfor opto-electronic and electronic devicesInfo
- Publication number
- AU2001268730A1 AU2001268730A1 AU2001268730A AU6873001A AU2001268730A1 AU 2001268730 A1 AU2001268730 A1 AU 2001268730A1 AU 2001268730 A AU2001268730 A AU 2001268730A AU 6873001 A AU6873001 A AU 6873001A AU 2001268730 A1 AU2001268730 A1 AU 2001268730A1
- Authority
- AU
- Australia
- Prior art keywords
- electronic
- substratesfor
- opto
- gallium
- indium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 title 1
- 229910052782 aluminium Inorganic materials 0.000 title 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 title 1
- 230000007547 defect Effects 0.000 title 1
- 238000000407 epitaxy Methods 0.000 title 1
- 229910052733 gallium Inorganic materials 0.000 title 1
- 229910052738 indium Inorganic materials 0.000 title 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 title 1
- 238000000034 method Methods 0.000 title 1
- 150000004767 nitrides Chemical class 0.000 title 1
- 230000005693 optoelectronics Effects 0.000 title 1
Classifications
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- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/002—Controlling or regulating
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- C30B23/00—Single-crystal growth by condensing evaporated or sublimed materials
- C30B23/02—Epitaxial-layer growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
- C30B25/18—Epitaxial-layer growth characterised by the substrate
- C30B25/183—Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
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- C—CHEMISTRY; METALLURGY
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- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/40—AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
- C30B29/403—AIII-nitrides
- C30B29/406—Gallium nitride
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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- H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
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- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/26—Materials of the light emitting region
- H01L33/30—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
- H01L33/32—Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
- H01S5/1228—DFB lasers with a complex coupled grating, e.g. gain or loss coupling
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- H01S5/00—Semiconductor lasers
- H01S5/10—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region
- H01S5/12—Construction or shape of the optical resonator, e.g. extended or external cavity, coupled cavities, bent-guide, varying width, thickness or composition of the active region the resonator having a periodic structure, e.g. in distributed feedback [DFB] lasers
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- H01S5/00—Semiconductor lasers
- H01S5/20—Structure or shape of the semiconductor body to guide the optical wave ; Confining structures perpendicular to the optical axis, e.g. index or gain guiding, stripe geometry, broad area lasers, gain tailoring, transverse or lateral reflectors, special cladding structures, MQW barrier reflection layers
- H01S5/2054—Methods of obtaining the confinement
- H01S5/2095—Methods of obtaining the confinement using melting or mass transport
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- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/30—Structure or shape of the active region; Materials used for the active region
- H01S5/32—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures
- H01S5/323—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser
- H01S5/32308—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm
- H01S5/32341—Structure or shape of the active region; Materials used for the active region comprising PN junctions, e.g. hetero- or double- heterostructures in AIIIBV compounds, e.g. AlGaAs-laser, InP-based laser emitting light at a wavelength less than 900 nm blue laser based on GaN or GaP
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Chemical Vapour Deposition (AREA)
- Junction Field-Effect Transistors (AREA)
- Semiconductor Lasers (AREA)
- Led Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09605195 | 2000-06-28 | ||
US09/605,195 US6447604B1 (en) | 2000-03-13 | 2000-06-28 | Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices |
PCT/US2001/020409 WO2002001608A2 (en) | 2000-06-28 | 2001-06-27 | METHOD FOR ACHIEVING IMPROVED EPITAXY QUALITY (SURFACE TEXTURE AND DEFECT DENSITY) ON FREE-STANDING (ALUMINUM, INDIUM, GALLIUM) NITRIDE ((Al,In,Ga)N) SUBSTRATES FOR OPTO-ELECTRONIC AND ELECTRONIC DEVICES |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001268730A1 true AU2001268730A1 (en) | 2002-01-08 |
Family
ID=24422619
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001268730A Abandoned AU2001268730A1 (en) | 2000-06-28 | 2001-06-27 | Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substratesfor opto-electronic and electronic devices |
Country Status (7)
Country | Link |
---|---|
US (1) | US6447604B1 (en) |
EP (4) | EP1299900B1 (en) |
JP (2) | JP5361107B2 (en) |
KR (2) | KR100810554B1 (en) |
AU (1) | AU2001268730A1 (en) |
TW (1) | TW516102B (en) |
WO (1) | WO2002001608A2 (en) |
Families Citing this family (162)
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JP2001168388A (en) * | 1999-09-30 | 2001-06-22 | Sharp Corp | Gallium nitride compound semiconductor chip, its manufacturing method and gallium nitride compound semiconductor wafer |
JP4556300B2 (en) * | 2000-07-18 | 2010-10-06 | ソニー株式会社 | Crystal growth method |
JP2002075965A (en) * | 2000-08-25 | 2002-03-15 | Toyoda Gosei Co Ltd | Iii nitride compound semiconductor element |
US6649287B2 (en) * | 2000-12-14 | 2003-11-18 | Nitronex Corporation | Gallium nitride materials and methods |
EP2400046A1 (en) * | 2001-03-30 | 2011-12-28 | Technologies and Devices International Inc. | Method and apparatus for growing submicron group III nitride structures utilizing HVPE techniques |
US6958497B2 (en) | 2001-05-30 | 2005-10-25 | Cree, Inc. | Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures |
RU2296189C2 (en) * | 2001-06-06 | 2007-03-27 | АММОНО Сп.з о.о. | Method and apparatus for producing three-dimensional monocrystalline gallium-containing nitride (variants) |
US6648966B2 (en) * | 2001-08-01 | 2003-11-18 | Crystal Photonics, Incorporated | Wafer produced thereby, and associated methods and devices using the wafer |
US7105865B2 (en) * | 2001-09-19 | 2006-09-12 | Sumitomo Electric Industries, Ltd. | AlxInyGa1−x−yN mixture crystal substrate |
JP3801125B2 (en) * | 2001-10-09 | 2006-07-26 | 住友電気工業株式会社 | Single crystal gallium nitride substrate, method for crystal growth of single crystal gallium nitride, and method for manufacturing single crystal gallium nitride substrate |
DE60234856D1 (en) | 2001-10-26 | 2010-02-04 | Ammono Sp Zoo | SUBSTRATE FOR EPITAXIA |
EP1453158A4 (en) * | 2001-10-26 | 2007-09-19 | Ammono Sp Zoo | Nitride semiconductor laser element, and production method therefor |
US7638346B2 (en) * | 2001-12-24 | 2009-12-29 | Crystal Is, Inc. | Nitride semiconductor heterostructures and related methods |
US8545629B2 (en) * | 2001-12-24 | 2013-10-01 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
US20060005763A1 (en) * | 2001-12-24 | 2006-01-12 | Crystal Is, Inc. | Method and apparatus for producing large, single-crystals of aluminum nitride |
EP1474824B1 (en) | 2002-02-15 | 2016-02-10 | Toyoda Gosei Co.,Ltd. | Production method for group iii nitride semiconductor layer |
JP2004006568A (en) * | 2002-03-26 | 2004-01-08 | Sumitomo Chem Co Ltd | Manufacture of 3-5 group compound semiconductor |
JP4932121B2 (en) * | 2002-03-26 | 2012-05-16 | 日本電気株式会社 | Method for manufacturing group III-V nitride semiconductor substrate |
WO2003089696A1 (en) * | 2002-04-15 | 2003-10-30 | The Regents Of The University Of California | Dislocation reduction in non-polar gallium nitride thin films |
US8809867B2 (en) | 2002-04-15 | 2014-08-19 | The Regents Of The University Of California | Dislocation reduction in non-polar III-nitride thin films |
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WO2003098757A1 (en) * | 2002-05-17 | 2003-11-27 | Ammono Sp.Zo.O. | Light emitting element structure having nitride bulk single crystal layer |
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JP3976294B2 (en) * | 1998-06-26 | 2007-09-12 | シャープ株式会社 | Method for manufacturing nitride-based compound semiconductor light-emitting device |
JP2000049136A (en) * | 1998-07-30 | 2000-02-18 | Sony Corp | Etching mask and its forming method |
JP2000068498A (en) | 1998-08-21 | 2000-03-03 | Nippon Telegr & Teleph Corp <Ntt> | Insulating nitride film and semiconductor device using the same |
JP3279528B2 (en) * | 1998-09-07 | 2002-04-30 | 日本電気株式会社 | Method for producing nitride III-V compound semiconductor |
JP3669848B2 (en) * | 1998-09-16 | 2005-07-13 | 日亜化学工業株式会社 | Nitride semiconductor laser device |
GB9826517D0 (en) * | 1998-12-02 | 1999-01-27 | Arima Optoelectronics Corp | Semiconductor devices |
JP2003517721A (en) * | 1999-05-07 | 2003-05-27 | シービーエル テクノロジーズ インコーポレイテッド | III-V nitride doped with magnesium and method |
JP2000340509A (en) * | 1999-05-26 | 2000-12-08 | Sumitomo Electric Ind Ltd | Gan substrate and manufacturing method therefor |
-
2000
- 2000-06-28 US US09/605,195 patent/US6447604B1/en not_active Expired - Lifetime
-
2001
- 2001-06-27 JP JP2002505658A patent/JP5361107B2/en not_active Expired - Lifetime
- 2001-06-27 KR KR1020027017929A patent/KR100810554B1/en active IP Right Grant
- 2001-06-27 KR KR1020077019660A patent/KR100856447B1/en active IP Right Grant
- 2001-06-27 EP EP01946718A patent/EP1299900B1/en not_active Expired - Lifetime
- 2001-06-27 EP EP10011037.8A patent/EP2290136B1/en not_active Expired - Lifetime
- 2001-06-27 EP EP10011036.0A patent/EP2290135B1/en not_active Expired - Lifetime
- 2001-06-27 WO PCT/US2001/020409 patent/WO2002001608A2/en active Application Filing
- 2001-06-27 EP EP10011760A patent/EP2284297B1/en not_active Expired - Lifetime
- 2001-06-27 AU AU2001268730A patent/AU2001268730A1/en not_active Abandoned
- 2001-06-28 TW TW090115729A patent/TW516102B/en not_active IP Right Cessation
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2011
- 2011-08-24 JP JP2011183170A patent/JP2011251905A/en active Pending
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TW516102B (en) | 2003-01-01 |
EP1299900A2 (en) | 2003-04-09 |
EP2290136B1 (en) | 2013-05-08 |
WO2002001608A2 (en) | 2002-01-03 |
KR20030017575A (en) | 2003-03-03 |
EP2290135B1 (en) | 2013-07-24 |
EP2284297B1 (en) | 2012-08-22 |
JP5361107B2 (en) | 2013-12-04 |
WO2002001608A3 (en) | 2002-04-18 |
EP2290136A1 (en) | 2011-03-02 |
EP2284297A1 (en) | 2011-02-16 |
KR20070097594A (en) | 2007-10-04 |
US6447604B1 (en) | 2002-09-10 |
KR100856447B1 (en) | 2008-09-04 |
EP2290135A1 (en) | 2011-03-02 |
EP1299900A4 (en) | 2007-09-26 |
JP2011251905A (en) | 2011-12-15 |
EP1299900B1 (en) | 2012-12-12 |
KR100810554B1 (en) | 2008-03-18 |
JP2004502298A (en) | 2004-01-22 |
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