AU2001268730A1 - Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substratesfor opto-electronic and electronic devices - Google Patents

Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substratesfor opto-electronic and electronic devices

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Publication number
AU2001268730A1
AU2001268730A1 AU2001268730A AU6873001A AU2001268730A1 AU 2001268730 A1 AU2001268730 A1 AU 2001268730A1 AU 2001268730 A AU2001268730 A AU 2001268730A AU 6873001 A AU6873001 A AU 6873001A AU 2001268730 A1 AU2001268730 A1 AU 2001268730A1
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AU
Australia
Prior art keywords
electronic
substratesfor
opto
gallium
indium
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Abandoned
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AU2001268730A
Inventor
George R Brandes
Jeffrey S. Flynn
David M. Keogh
Barbara E. Landini
Robert P. Vaudo
Xueping Xu
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Advanced Technology Materials Inc
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Advanced Technology Materials Inc
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Publication date
Application filed by Advanced Technology Materials Inc filed Critical Advanced Technology Materials Inc
Publication of AU2001268730A1 publication Critical patent/AU2001268730A1/en
Abandoned legal-status Critical Current

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    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
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    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
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    • C30B25/00Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
    • C30B25/02Epitaxial-layer growth
    • C30B25/18Epitaxial-layer growth characterised by the substrate
    • C30B25/183Epitaxial-layer growth characterised by the substrate being provided with a buffer layer, e.g. a lattice matching layer
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    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
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    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/10Inorganic compounds or compositions
    • C30B29/40AIIIBV compounds wherein A is B, Al, Ga, In or Tl and B is N, P, As, Sb or Bi
    • C30B29/403AIII-nitrides
    • C30B29/406Gallium nitride
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    • H01L33/26Materials of the light emitting region
    • H01L33/30Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table
    • H01L33/32Materials of the light emitting region containing only elements of Group III and Group V of the Periodic Table containing nitrogen
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  • General Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Chemical Vapour Deposition (AREA)
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AU2001268730A 2000-06-28 2001-06-27 Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substratesfor opto-electronic and electronic devices Abandoned AU2001268730A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09605195 2000-06-28
US09/605,195 US6447604B1 (en) 2000-03-13 2000-06-28 Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substrates for opto-electronic and electronic devices
PCT/US2001/020409 WO2002001608A2 (en) 2000-06-28 2001-06-27 METHOD FOR ACHIEVING IMPROVED EPITAXY QUALITY (SURFACE TEXTURE AND DEFECT DENSITY) ON FREE-STANDING (ALUMINUM, INDIUM, GALLIUM) NITRIDE ((Al,In,Ga)N) SUBSTRATES FOR OPTO-ELECTRONIC AND ELECTRONIC DEVICES

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AU2001268730A1 true AU2001268730A1 (en) 2002-01-08

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AU2001268730A Abandoned AU2001268730A1 (en) 2000-06-28 2001-06-27 Method for achieving improved epitaxy quality (surface texture and defect density) on free-standing (aluminum, indium, gallium) nitride ((al,in,ga)n) substratesfor opto-electronic and electronic devices

Country Status (7)

Country Link
US (1) US6447604B1 (en)
EP (4) EP1299900B1 (en)
JP (2) JP5361107B2 (en)
KR (2) KR100810554B1 (en)
AU (1) AU2001268730A1 (en)
TW (1) TW516102B (en)
WO (1) WO2002001608A2 (en)

Families Citing this family (162)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5679152A (en) * 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
US6958093B2 (en) * 1994-01-27 2005-10-25 Cree, Inc. Free-standing (Al, Ga, In)N and parting method for forming same
JP2001168388A (en) * 1999-09-30 2001-06-22 Sharp Corp Gallium nitride compound semiconductor chip, its manufacturing method and gallium nitride compound semiconductor wafer
JP4556300B2 (en) * 2000-07-18 2010-10-06 ソニー株式会社 Crystal growth method
JP2002075965A (en) * 2000-08-25 2002-03-15 Toyoda Gosei Co Ltd Iii nitride compound semiconductor element
US6649287B2 (en) * 2000-12-14 2003-11-18 Nitronex Corporation Gallium nitride materials and methods
EP2400046A1 (en) * 2001-03-30 2011-12-28 Technologies and Devices International Inc. Method and apparatus for growing submicron group III nitride structures utilizing HVPE techniques
US6958497B2 (en) 2001-05-30 2005-10-25 Cree, Inc. Group III nitride based light emitting diode structures with a quantum well and superlattice, group III nitride based quantum well structures and group III nitride based superlattice structures
RU2296189C2 (en) * 2001-06-06 2007-03-27 АММОНО Сп.з о.о. Method and apparatus for producing three-dimensional monocrystalline gallium-containing nitride (variants)
US6648966B2 (en) * 2001-08-01 2003-11-18 Crystal Photonics, Incorporated Wafer produced thereby, and associated methods and devices using the wafer
US7105865B2 (en) * 2001-09-19 2006-09-12 Sumitomo Electric Industries, Ltd. AlxInyGa1−x−yN mixture crystal substrate
JP3801125B2 (en) * 2001-10-09 2006-07-26 住友電気工業株式会社 Single crystal gallium nitride substrate, method for crystal growth of single crystal gallium nitride, and method for manufacturing single crystal gallium nitride substrate
DE60234856D1 (en) 2001-10-26 2010-02-04 Ammono Sp Zoo SUBSTRATE FOR EPITAXIA
EP1453158A4 (en) * 2001-10-26 2007-09-19 Ammono Sp Zoo Nitride semiconductor laser element, and production method therefor
US7638346B2 (en) * 2001-12-24 2009-12-29 Crystal Is, Inc. Nitride semiconductor heterostructures and related methods
US8545629B2 (en) * 2001-12-24 2013-10-01 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
US20060005763A1 (en) * 2001-12-24 2006-01-12 Crystal Is, Inc. Method and apparatus for producing large, single-crystals of aluminum nitride
EP1474824B1 (en) 2002-02-15 2016-02-10 Toyoda Gosei Co.,Ltd. Production method for group iii nitride semiconductor layer
JP2004006568A (en) * 2002-03-26 2004-01-08 Sumitomo Chem Co Ltd Manufacture of 3-5 group compound semiconductor
JP4932121B2 (en) * 2002-03-26 2012-05-16 日本電気株式会社 Method for manufacturing group III-V nitride semiconductor substrate
WO2003089696A1 (en) * 2002-04-15 2003-10-30 The Regents Of The University Of California Dislocation reduction in non-polar gallium nitride thin films
US8809867B2 (en) 2002-04-15 2014-08-19 The Regents Of The University Of California Dislocation reduction in non-polar III-nitride thin films
WO2003094240A1 (en) 2002-04-30 2003-11-13 Cree, Inc. High voltage switching devices and process for forming same
JP2003327497A (en) * 2002-05-13 2003-11-19 Sumitomo Electric Ind Ltd GaN SINGLE CRYSTAL SUBSTRATE, NITRIDE-BASED SEMICONDUCTOR EPITAXIAL SUBSTRATE, NITRIDE-BASED SEMICONDUCTOR DEVICE AND METHOD OF PRODUCING THE SAME
WO2003097906A1 (en) * 2002-05-17 2003-11-27 Ammono Sp.Zo.O. Bulk single crystal production facility employing supercritical ammonia
WO2003098757A1 (en) * 2002-05-17 2003-11-27 Ammono Sp.Zo.O. Light emitting element structure having nitride bulk single crystal layer
US20060138431A1 (en) * 2002-05-17 2006-06-29 Robert Dwilinski Light emitting device structure having nitride bulk single crystal layer
US20040001889A1 (en) 2002-06-25 2004-01-01 Guohua Chen Short duration depot formulations
JP4663319B2 (en) * 2002-06-26 2011-04-06 アンモノ・スプウカ・ジ・オグラニチョノン・オドポヴィエドニアウノシツィオン Method for producing gallium-containing nitride bulk single crystal
GB2392169A (en) 2002-08-23 2004-02-25 Sharp Kk MBE growth of an AlgaN layer or AlGaN multilayer structure
DE10250915B4 (en) * 2002-10-31 2009-01-22 Osram Opto Semiconductors Gmbh Method for depositing a material on a substrate wafer
US20040134418A1 (en) * 2002-11-08 2004-07-15 Taisuke Hirooka SiC substrate and method of manufacturing the same
US7387677B2 (en) * 2002-12-11 2008-06-17 Ammono Sp. Z O.O. Substrate for epitaxy and method of preparing the same
AU2003285767A1 (en) * 2002-12-11 2004-06-30 Ammono Sp. Z O.O. Process for obtaining bulk monocrystalline gallium-containing nitride
EP3211659A1 (en) 2002-12-27 2017-08-30 Soraa Inc. Gallium nitride crystal
US7524691B2 (en) * 2003-01-20 2009-04-28 Panasonic Corporation Method of manufacturing group III nitride substrate
US7221037B2 (en) * 2003-01-20 2007-05-22 Matsushita Electric Industrial Co., Ltd. Method of manufacturing group III nitride substrate and semiconductor device
JP4052150B2 (en) * 2003-03-05 2008-02-27 住友電気工業株式会社 Manufacturing method of nitride semiconductor device
JP4382748B2 (en) * 2003-03-19 2009-12-16 独立行政法人科学技術振興機構 Semiconductor crystal growth method
US7091524B2 (en) * 2003-03-25 2006-08-15 Matsushita Electric Industrial Co., Ltd. Semiconductor device and method for fabricating the same
US7309534B2 (en) * 2003-05-29 2007-12-18 Matsushita Electric Industrial Co., Ltd. Group III nitride crystals usable as group III nitride substrate, method of manufacturing the same, and semiconductor device including the same
US7255742B2 (en) * 2003-07-02 2007-08-14 Matsushita Electric Industrial Co., Ltd. Method of manufacturing Group III nitride crystals, method of manufacturing semiconductor substrate, Group III nitride crystals, semiconductor substrate, and electronic device
KR100531178B1 (en) * 2003-07-08 2005-11-28 재단법인서울대학교산학협력재단 Growth method of nitride epitaxial layer using conversion of nitride interlayer into metallic phase
US7170095B2 (en) * 2003-07-11 2007-01-30 Cree Inc. Semi-insulating GaN and method of making the same
JP3841092B2 (en) * 2003-08-26 2006-11-01 住友電気工業株式会社 Light emitting device
JP2005101475A (en) * 2003-08-28 2005-04-14 Hitachi Cable Ltd Iii-v group nitride semiconductor substrate and method for manufacturing the same
US7288152B2 (en) * 2003-08-29 2007-10-30 Matsushita Electric Industrial Co., Ltd. Method of manufacturing GaN crystals and GaN crystal substrate, GaN crystals and GaN crystal substrate obtained by the method, and semiconductor device including the same
JP4559190B2 (en) * 2003-11-06 2010-10-06 昭和電工株式会社 Compound semiconductor device
US7323256B2 (en) * 2003-11-13 2008-01-29 Cree, Inc. Large area, uniformly low dislocation density GaN substrate and process for making the same
US7118813B2 (en) * 2003-11-14 2006-10-10 Cree, Inc. Vicinal gallium nitride substrate for high quality homoepitaxy
JP3894191B2 (en) * 2003-11-26 2007-03-14 住友電気工業株式会社 Method for forming gallium nitride based semiconductor film and semiconductor substrate product
US7901994B2 (en) * 2004-01-16 2011-03-08 Cree, Inc. Methods of manufacturing group III nitride semiconductor devices with silicon nitride layers
US7045404B2 (en) * 2004-01-16 2006-05-16 Cree, Inc. Nitride-based transistors with a protective layer and a low-damage recess and methods of fabrication thereof
WO2005088666A1 (en) * 2004-03-12 2005-09-22 Hamamatsu Photonics K.K. Process for producing layered member and layered member
KR100718188B1 (en) * 2004-05-07 2007-05-15 삼성코닝 주식회사 Non-polar single crystalline a-plane nitride semiconductor wafer and preparation thereof
JP2006016294A (en) * 2004-05-31 2006-01-19 Sumitomo Electric Ind Ltd Method for growing group iii nitride crystal, group iii nitride crystal substrate, and semiconductor device
US7956360B2 (en) * 2004-06-03 2011-06-07 The Regents Of The University Of California Growth of planar reduced dislocation density M-plane gallium nitride by hydride vapor phase epitaxy
US8398767B2 (en) * 2004-06-11 2013-03-19 Ammono S.A. Bulk mono-crystalline gallium-containing nitride and its application
JP2006016249A (en) * 2004-07-01 2006-01-19 Sumitomo Electric Ind Ltd AlxXGayIn1-x-yN SUBSTRATE AND CLEANING METHOD FOR THE SAME
TWI408263B (en) * 2004-07-01 2013-09-11 Sumitomo Electric Industries Alxgayin1-x-yn substrate, cleaning method of alxgayin1-x-yn substrate, aln substrate, and cleaning method of aln substrate
JP2006044982A (en) * 2004-08-04 2006-02-16 Sumitomo Electric Ind Ltd Nitride semiconductor single crystal substrate and method for synthesizing the same
US20060211210A1 (en) * 2004-08-27 2006-09-21 Rensselaer Polytechnic Institute Material for selective deposition and etching
TWI375994B (en) * 2004-09-01 2012-11-01 Sumitomo Electric Industries Epitaxial substrate and semiconductor element
JP2006108435A (en) 2004-10-06 2006-04-20 Sumitomo Electric Ind Ltd Nitride semiconductor wafer
PL371405A1 (en) * 2004-11-26 2006-05-29 Ammono Sp.Z O.O. Method for manufacture of volumetric monocrystals by their growth on crystal nucleus
PL371753A1 (en) * 2004-12-15 2006-06-26 Instytut Wysokich Ciśnień Polskiej Akademii Nauk Method for manufacture of admixture epitaxial layers InxAlyGa1-x-yN, InxAlyGa1-x-yN admixture epitaxial layer and semiconductor multilayer structure containing InxAlyGa1-x-yN epitaxial layer for which 1˛ x > 0.001 and 0.999 ˛ y > 0
US20060138601A1 (en) * 2004-12-27 2006-06-29 Memc Electronic Materials, Inc. Internally gettered heteroepitaxial semiconductor wafers and methods of manufacturing such wafers
US20090026488A1 (en) * 2005-02-21 2009-01-29 Mitsubishi Chemical Corporation Nitride semiconductor material and production process of nitride semiconductor crystal
WO2006093174A1 (en) * 2005-03-04 2006-09-08 Sumitomo Electric Industries, Ltd. Vertical gallium nitride semiconductor device and epitaxial substrate
JP4792802B2 (en) * 2005-04-26 2011-10-12 住友電気工業株式会社 Surface treatment method of group III nitride crystal
DE102005021099A1 (en) * 2005-05-06 2006-12-07 Universität Ulm GaN layers
JP5023318B2 (en) * 2005-05-19 2012-09-12 国立大学法人三重大学 3-5 nitride semiconductor multilayer substrate, 3-5 nitride semiconductor free-standing substrate manufacturing method, and semiconductor device
JP5638198B2 (en) * 2005-07-11 2014-12-10 クリー インコーポレイテッドCree Inc. Laser diode orientation on miscut substrates
US8946674B2 (en) * 2005-08-31 2015-02-03 University Of Florida Research Foundation, Inc. Group III-nitrides on Si substrates using a nanostructured interlayer
KR100707166B1 (en) * 2005-10-12 2007-04-13 삼성코닝 주식회사 Fabrication method of gan substrate
US8349077B2 (en) 2005-11-28 2013-01-08 Crystal Is, Inc. Large aluminum nitride crystals with reduced defects and methods of making them
EP1954857B1 (en) 2005-12-02 2018-09-26 Crystal Is, Inc. Doped aluminum nitride crystals and methods of making them
US7777217B2 (en) 2005-12-12 2010-08-17 Kyma Technologies, Inc. Inclusion-free uniform semi-insulating group III nitride substrate and methods for making same
DE602006004834D1 (en) * 2005-12-22 2009-03-05 Freiberger Compound Mat Gmbh A method of selectively masking III-N layers and producing self-supporting III-N layers or devices
KR100695118B1 (en) * 2005-12-27 2007-03-14 삼성코닝 주식회사 Fabrication method of multi-freestanding gan wafer
CN101454487B (en) 2006-03-30 2013-01-23 晶体公司 Methods for controllable doping of aluminum nitride bulk crystals
US9034103B2 (en) 2006-03-30 2015-05-19 Crystal Is, Inc. Aluminum nitride bulk crystals having high transparency to ultraviolet light and methods of forming them
US7585772B2 (en) * 2006-07-26 2009-09-08 Freiberger Compound Materials Gmbh Process for smoothening III-N substrates
US20080050889A1 (en) * 2006-08-24 2008-02-28 Applied Materials, Inc. Hotwall reactor and method for reducing particle formation in GaN MOCVD
US8222057B2 (en) * 2006-08-29 2012-07-17 University Of Florida Research Foundation, Inc. Crack free multilayered devices, methods of manufacture thereof and articles comprising the same
DE102006043400A1 (en) * 2006-09-15 2008-03-27 Osram Opto Semiconductors Gmbh Optoelectronic semiconductor chip
US9416464B1 (en) 2006-10-11 2016-08-16 Ostendo Technologies, Inc. Apparatus and methods for controlling gas flows in a HVPE reactor
EP2080823B1 (en) * 2006-10-19 2020-03-25 Sumitomo Electric Industries, Ltd. Gan substrate, substrate with epitaxial layer, processes for producing these, and process for producing semiconductor element
US8283694B2 (en) 2006-10-19 2012-10-09 Sumitomo Electric Industries, Ltd. GaN substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device
US20080092819A1 (en) * 2006-10-24 2008-04-24 Applied Materials, Inc. Substrate support structure with rapid temperature change
CN101600819B (en) * 2006-12-08 2012-08-15 卢米洛格股份有限公司 Method for manufacturing a single crystal of nitride by epitaxial growth on a substrate preventing growth on the edges of the substrate
US9771666B2 (en) 2007-01-17 2017-09-26 Crystal Is, Inc. Defect reduction in seeded aluminum nitride crystal growth
CN107059116B (en) 2007-01-17 2019-12-31 晶体公司 Defect reduction in seeded aluminum nitride crystal growth
US7834367B2 (en) 2007-01-19 2010-11-16 Cree, Inc. Low voltage diode with reduced parasitic resistance and method for fabricating
CN101652832B (en) * 2007-01-26 2011-06-22 晶体公司 Thick pseudomorphic nitride epitaxial layers
US8080833B2 (en) 2007-01-26 2011-12-20 Crystal Is, Inc. Thick pseudomorphic nitride epitaxial layers
US8157914B1 (en) 2007-02-07 2012-04-17 Chien-Min Sung Substrate surface modifications for compositional gradation of crystalline materials and associated products
FR2914488B1 (en) * 2007-03-30 2010-08-27 Soitec Silicon On Insulator DOPE HEATING SUBSTRATE
WO2008128181A1 (en) * 2007-04-12 2008-10-23 The Regents Of The University Of California Method for deposition of (al,in,ga,b)n
US8088220B2 (en) * 2007-05-24 2012-01-03 Crystal Is, Inc. Deep-eutectic melt growth of nitride crystals
US7799600B2 (en) * 2007-05-31 2010-09-21 Chien-Min Sung Doped diamond LED devices and associated methods
JP4924225B2 (en) * 2007-06-13 2012-04-25 住友電気工業株式会社 GaN crystal growth method
WO2009011100A1 (en) 2007-07-19 2009-01-22 Mitsubishi Chemical Corporation Iii nitride semiconductor substrate and method for cleaning the same
JP2010537436A (en) * 2007-08-31 2010-12-02 ラティス パワー (チアンシ) コーポレイション Method for fabricating low resistivity ohmic contacts to p-type III-V nitride semiconductor material at low temperature
KR20100064383A (en) 2007-09-19 2010-06-14 더 리전츠 오브 더 유니버시티 오브 캘리포니아 (al, in, ga, b)n device structures on a patterned substrate
US9012937B2 (en) 2007-10-10 2015-04-21 Cree, Inc. Multiple conversion material light emitting diode package and method of fabricating same
KR100972974B1 (en) * 2007-12-17 2010-07-29 삼성엘이디 주식회사 Surface reformation method of Group ? nitride substrate, Group ? nitride substrate prepared therefrom, and nitride semiconductor light emitting device with the same
JP5391653B2 (en) * 2008-01-15 2014-01-15 住友電気工業株式会社 Method for growing aluminum nitride crystal and method for producing aluminum nitride crystal
US7781780B2 (en) * 2008-03-31 2010-08-24 Bridgelux, Inc. Light emitting diodes with smooth surface for reflective electrode
JP5108641B2 (en) * 2008-06-12 2012-12-26 住友電気工業株式会社 GaN single crystal substrate, nitride semiconductor epitaxial substrate, and nitride semiconductor device
JP2010010300A (en) * 2008-06-25 2010-01-14 Sumitomo Electric Ind Ltd Gallium nitride semiconductor light-emitting element and epitaxial wafer
JP2008252124A (en) * 2008-06-27 2008-10-16 Sumitomo Electric Ind Ltd Nitride-based semiconductor device
JP2010037139A (en) * 2008-08-05 2010-02-18 Shin Etsu Handotai Co Ltd Method for manufacturing semiconductor substrate
TWI457984B (en) * 2008-08-06 2014-10-21 Soitec Silicon On Insulator Relaxation of strained layers
US20100072484A1 (en) * 2008-09-23 2010-03-25 Triquint Semiconductor, Inc. Heteroepitaxial gallium nitride-based device formed on an off-cut substrate
TWI384548B (en) * 2008-11-10 2013-02-01 Univ Nat Central Manufacturing method of nitride crystalline film, nitride film and substrate structure
KR101123009B1 (en) * 2008-11-14 2012-03-15 삼성엘이디 주식회사 Method for etching group iii nitride semiconducotr
US8344420B1 (en) 2009-07-24 2013-01-01 Triquint Semiconductor, Inc. Enhancement-mode gallium nitride high electron mobility transistor
JP5409170B2 (en) 2009-07-30 2014-02-05 キヤノン株式会社 Semiconductor device manufacturing method and semiconductor device
JP5146432B2 (en) * 2009-09-29 2013-02-20 豊田合成株式会社 Method for epitaxial growth of group III nitride compound semiconductor and method for manufacturing group III nitride compound semiconductor device
JP5365454B2 (en) 2009-09-30 2013-12-11 住友電気工業株式会社 Group III nitride semiconductor substrate, epitaxial substrate, and semiconductor device
US8575660B2 (en) * 2009-10-14 2013-11-05 International Rectifier Corporation Group III-V semiconductor device with strain-relieving interlayers
US8318515B2 (en) 2009-12-08 2012-11-27 Corning Incorporated Growth methodology for light emitting semiconductor devices
US8604461B2 (en) * 2009-12-16 2013-12-10 Cree, Inc. Semiconductor device structures with modulated doping and related methods
US8536615B1 (en) 2009-12-16 2013-09-17 Cree, Inc. Semiconductor device structures with modulated and delta doping and related methods
US8575592B2 (en) * 2010-02-03 2013-11-05 Cree, Inc. Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses
JP2011192834A (en) * 2010-03-15 2011-09-29 Advanced Power Device Research Association Semiconductor device, and method of manufacturing semiconductor device
JP2011213557A (en) * 2010-04-01 2011-10-27 Hitachi Cable Ltd Method for producing conductive group iii nitride single crystal substrate
CN103038400B (en) 2010-06-30 2016-06-22 晶体公司 Use the growth of the bulk aluminum nitride single crystal of thermal gradient control
RU2013122654A (en) * 2010-10-21 2014-11-27 Общество с ограниченной ответственностью "Совершенные кристаллы" METHOD FOR PRODUCING NITRIDE CRYSTAL III GROUP WITH A LOW DENSITY OF DISLOCATIONS
JP2013546181A (en) * 2010-10-28 2013-12-26 ユニバーシティ オブ ユタ リサーチ ファウンデーション Method for enhancing P-type doping in III-V semiconductors
FR2969815B1 (en) * 2010-12-27 2013-11-22 Soitec Silicon On Insulator Tech METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
US8962359B2 (en) 2011-07-19 2015-02-24 Crystal Is, Inc. Photon extraction from nitride ultraviolet light-emitting devices
US20130023079A1 (en) * 2011-07-20 2013-01-24 Sang Won Kang Fabrication of light emitting diodes (leds) using a degas process
US20130019927A1 (en) * 2011-07-21 2013-01-24 Zimmerman Scott M Use of freestanding nitride veneers in semiconductor devices
KR101978536B1 (en) 2011-09-30 2019-05-14 쌩-고벵 크리스톡스 에 드테끄퇴르 Group iii-v substrate material with particular crystallographic features and methods of making
KR20130045716A (en) * 2011-10-26 2013-05-06 삼성전자주식회사 Semiconductor device and method of fabricating the device
JP5767141B2 (en) * 2012-03-02 2015-08-19 株式会社サイオクス Gallium nitride substrate and optical device using the same
KR20130101799A (en) * 2012-03-06 2013-09-16 서울옵토디바이스주식회사 Light emitting diode having improved light extraction efficiency and method of fabricating the same
WO2014009856A1 (en) 2012-07-11 2014-01-16 Koninklijke Philips N.V. Reducing or eliminating nanopipe defects in iii-nitride structures
TWI529964B (en) 2012-12-31 2016-04-11 聖戈班晶體探測器公司 Group iii-v substrate material with thin buffer layer and methods of making
US20150280057A1 (en) 2013-03-15 2015-10-01 James R. Grandusky Methods of forming planar contacts to pseudomorphic electronic and optoelectronic devices
JP6279619B2 (en) 2014-01-28 2018-02-14 住友化学株式会社 Manufacturing method of semiconductor substrate
KR102140789B1 (en) 2014-02-17 2020-08-03 삼성전자주식회사 Evaluating apparatus for quality of crystal, and Apparatus and method for manufacturing semiconductor light emitting device which include the same
EP3111520B1 (en) 2014-02-25 2020-07-08 Koninklijke Philips N.V. Light emitting semiconductor devices with getter layer
WO2015159342A1 (en) 2014-04-14 2015-10-22 株式会社サイオクス Nitride semiconductor single crystal substrate manufacturing method
JP2015053482A (en) * 2014-09-02 2015-03-19 住友電気工業株式会社 Group iii nitride semiconductor substrate, epitaxial substrate, and semiconductor device
JP6394545B2 (en) * 2015-09-10 2018-09-26 豊田合成株式会社 Semiconductor device, method for manufacturing the same, and power conversion device
CN108140695B (en) 2015-09-17 2021-02-09 晶体公司 Ultraviolet light emitting device comprising two-dimensional hole gas
CN115020192A (en) * 2015-11-12 2022-09-06 胜高股份有限公司 Method for producing group III nitride semiconductor substrate, and group III nitride semiconductor substrate
RU2622466C1 (en) * 2016-08-22 2017-06-15 Елена Михайловна Борисова Method of anticorrosive processing of aluminium surface or aluminium alloys
EP3340279A1 (en) 2016-12-21 2018-06-27 IMEC vzw Method for selective epitaxial growth of a group iii-nitride layer
US10643849B2 (en) * 2017-02-15 2020-05-05 Soko Kagaku Co., Ltd. Manufacturing method of nitride semiconductor ultraviolet light emitting element, and nitride semiconductor ultraviolet light emitting element
RU2657674C1 (en) * 2017-08-14 2018-06-14 Федеральное государственное бюджетное учреждение науки Институт общей и неорганической химии им. Н.С. Курнакова Российской академии наук (ИОНХ РАН) METHOD FOR PRODUCING HETEROSTRUCTURE Mg(Fe1-XGaX)2O4/SI WITH STABLE INTERPHASE BOUNDARY
JP7401182B2 (en) * 2018-03-02 2023-12-19 住友化学株式会社 GaN laminate and method for manufacturing the same
JP6998798B2 (en) * 2018-03-02 2022-01-18 株式会社サイオクス GaN laminate and its manufacturing method
KR20220140711A (en) 2020-01-13 2022-10-18 듀렉트 코퍼레이션 Reduced Impurity Sustained Release Drug Delivery Systems and Related Methods
JP7269190B2 (en) * 2020-02-27 2023-05-08 株式会社東芝 Nitride crystal, optical device, semiconductor device, method for producing nitride crystal
CN115298833A (en) * 2020-03-31 2022-11-04 丰田合成株式会社 Semiconductor element and device
CN111463109A (en) * 2020-04-13 2020-07-28 中国科学院半导体研究所 Method for inhibiting back decomposition of GaN substrate in epitaxial growth process
KR20220055526A (en) 2020-10-26 2022-05-04 삼성디스플레이 주식회사 Stacked structure including semiconductor structure and method for manufacturing same
CN114438596A (en) * 2022-01-27 2022-05-06 西湖大学 Easy-to-strip wafer-level gallium nitride epitaxial growth method

Family Cites Families (42)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3598526A (en) 1967-04-27 1971-08-10 Dow Chemical Co Method for preparing monocrystalline aluminum nitride
US3607014A (en) 1968-12-09 1971-09-21 Dow Chemical Co Method for preparing aluminum nitride and metal fluoride single crystals
US4397901A (en) * 1979-07-31 1983-08-09 Warren James W Composite article and method of making same
JPS62272541A (en) * 1986-05-20 1987-11-26 Fujitsu Ltd Surface treating method for semiconductor substrate
US5411914A (en) * 1988-02-19 1995-05-02 Massachusetts Institute Of Technology III-V based integrated circuits having low temperature growth buffer or passivation layers
FR2629636B1 (en) * 1988-04-05 1990-11-16 Thomson Csf METHOD FOR PRODUCING AN ALTERNATION OF LAYERS OF SINGLE-CRYSTAL SEMICONDUCTOR MATERIAL AND LAYERS OF INSULATING MATERIAL
US5006914A (en) 1988-12-02 1991-04-09 Advanced Technology Materials, Inc. Single crystal semiconductor substrate articles and semiconductor devices comprising same
US5030583A (en) 1988-12-02 1991-07-09 Advanced Technolgy Materials, Inc. Method of making single crystal semiconductor substrate articles and semiconductor device
JP2837423B2 (en) * 1989-04-07 1998-12-16 富士通株式会社 Semiconductor substrate pretreatment method
US5362328A (en) 1990-07-06 1994-11-08 Advanced Technology Materials, Inc. Apparatus and method for delivering reagents in vapor form to a CVD reactor, incorporating a cleaning subsystem
US5204314A (en) 1990-07-06 1993-04-20 Advanced Technology Materials, Inc. Method for delivering an involatile reagent in vapor form to a CVD reactor
JPH04334018A (en) * 1991-05-09 1992-11-20 Nec Corp Heat treatment device
JP2749759B2 (en) * 1993-06-23 1998-05-13 信越化学工業株式会社 Ceramic heater with electrostatic chuck
EP0647730B1 (en) * 1993-10-08 2002-09-11 Mitsubishi Cable Industries, Ltd. GaN single crystal
US5679152A (en) 1994-01-27 1997-10-21 Advanced Technology Materials, Inc. Method of making a single crystals Ga*N article
US5838029A (en) * 1994-08-22 1998-11-17 Rohm Co., Ltd. GaN-type light emitting device formed on a silicon substrate
JP3743013B2 (en) * 1994-12-26 2006-02-08 住友電気工業株式会社 Epitaxial wafer manufacturing method
JPH10326750A (en) * 1997-03-24 1998-12-08 Mitsubishi Electric Corp Selective formation of high quality gallium nitride layer, high quality gallium nitride layer formation substrate and semiconductor device manufactured on high quality gallium nitride layer grown substrate
DE19715572A1 (en) * 1997-04-15 1998-10-22 Telefunken Microelectron Selective epitaxy of III-V nitride semiconductor layers
JPH10335750A (en) * 1997-06-03 1998-12-18 Sony Corp Semiconductor substrate and semiconductor device
PL186905B1 (en) 1997-06-05 2004-03-31 Cantrum Badan Wysokocisnieniow Method of producing high-resistance volumetric gan crystals
JP2002511831A (en) * 1997-07-03 2002-04-16 シービーエル テクノロジーズ Compensation for thermal mismatch forming free-standing substrates by epitaxial deposition
US6015979A (en) * 1997-08-29 2000-01-18 Kabushiki Kaisha Toshiba Nitride-based semiconductor element and method for manufacturing the same
JP4783483B2 (en) * 1997-11-07 2011-09-28 フィリップス ルミレッズ ライティング カンパニー リミテッド ライアビリティ カンパニー Semiconductor substrate and method for forming semiconductor substrate
JPH11163109A (en) * 1997-12-01 1999-06-18 Kyocera Corp Wafer holding device
JPH11204885A (en) * 1998-01-08 1999-07-30 Sony Corp Growing method of nitride iii-v group compound semiconductor layer and manufacture of semiconductor layer
US6086673A (en) * 1998-04-02 2000-07-11 Massachusetts Institute Of Technology Process for producing high-quality III-V nitride substrates
JP4390090B2 (en) * 1998-05-18 2009-12-24 シャープ株式会社 GaN crystal film manufacturing method
US6064078A (en) * 1998-05-22 2000-05-16 Xerox Corporation Formation of group III-V nitride films on sapphire substrates with reduced dislocation densities
JPH11340576A (en) * 1998-05-28 1999-12-10 Sumitomo Electric Ind Ltd Gallium nitride based semiconductor device
JPH11354458A (en) * 1998-06-11 1999-12-24 Matsushita Electron Corp P-type iii-v nitride semiconductor, and its manufacture
TW417315B (en) * 1998-06-18 2001-01-01 Sumitomo Electric Industries GaN single crystal substrate and its manufacture method of the same
WO1999066565A1 (en) * 1998-06-18 1999-12-23 University Of Florida Method and apparatus for producing group-iii nitrides
JP2000082671A (en) * 1998-06-26 2000-03-21 Sony Corp Nitride based iii-v compound semiconductor device and its manufacture
JP3976294B2 (en) * 1998-06-26 2007-09-12 シャープ株式会社 Method for manufacturing nitride-based compound semiconductor light-emitting device
JP2000049136A (en) * 1998-07-30 2000-02-18 Sony Corp Etching mask and its forming method
JP2000068498A (en) 1998-08-21 2000-03-03 Nippon Telegr & Teleph Corp <Ntt> Insulating nitride film and semiconductor device using the same
JP3279528B2 (en) * 1998-09-07 2002-04-30 日本電気株式会社 Method for producing nitride III-V compound semiconductor
JP3669848B2 (en) * 1998-09-16 2005-07-13 日亜化学工業株式会社 Nitride semiconductor laser device
GB9826517D0 (en) * 1998-12-02 1999-01-27 Arima Optoelectronics Corp Semiconductor devices
JP2003517721A (en) * 1999-05-07 2003-05-27 シービーエル テクノロジーズ インコーポレイテッド III-V nitride doped with magnesium and method
JP2000340509A (en) * 1999-05-26 2000-12-08 Sumitomo Electric Ind Ltd Gan substrate and manufacturing method therefor

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