AU2001265361A1 - Apparatus and method for spinning a work piece - Google Patents

Apparatus and method for spinning a work piece

Info

Publication number
AU2001265361A1
AU2001265361A1 AU2001265361A AU6536101A AU2001265361A1 AU 2001265361 A1 AU2001265361 A1 AU 2001265361A1 AU 2001265361 A AU2001265361 A AU 2001265361A AU 6536101 A AU6536101 A AU 6536101A AU 2001265361 A1 AU2001265361 A1 AU 2001265361A1
Authority
AU
Australia
Prior art keywords
spinning
work piece
piece
work
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001265361A
Inventor
Richard Abraham
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedfam IPEC Corp
Original Assignee
Speedfam IPEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Speedfam IPEC Corp filed Critical Speedfam IPEC Corp
Publication of AU2001265361A1 publication Critical patent/AU2001265361A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68792—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the construction of the shaft

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Spinning Or Twisting Of Yarns (AREA)
AU2001265361A 2000-06-02 2001-06-04 Apparatus and method for spinning a work piece Abandoned AU2001265361A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09586207 2000-06-02
US09/586,207 US6363623B1 (en) 2000-06-02 2000-06-02 Apparatus and method for spinning a work piece
PCT/US2001/018109 WO2001093316A2 (en) 2000-06-02 2001-06-04 Apparatus and method for spinning a work piece

Publications (1)

Publication Number Publication Date
AU2001265361A1 true AU2001265361A1 (en) 2001-12-11

Family

ID=24344763

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001265361A Abandoned AU2001265361A1 (en) 2000-06-02 2001-06-04 Apparatus and method for spinning a work piece

Country Status (3)

Country Link
US (1) US6363623B1 (en)
AU (1) AU2001265361A1 (en)
WO (1) WO2001093316A2 (en)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6578853B1 (en) * 2000-12-22 2003-06-17 Lam Research Corporation Chuck assembly for use in a spin, rinse, and dry module and methods for making and implementing the same
US6752442B2 (en) * 2001-11-09 2004-06-22 Speedfam-Ipec Corporation Workpiece handling end-effector and a method for processing workpieces using a workpiece handling end-effector
US7032287B1 (en) * 2002-07-19 2006-04-25 Nanometrics Incorporated Edge grip chuck
US20040094187A1 (en) * 2002-11-15 2004-05-20 Lee Yong Ho Apparatus and method for holding a semiconductor wafer using centrifugal force
US7306002B2 (en) * 2003-01-04 2007-12-11 Yong Bae Kim System and method for wet cleaning a semiconductor wafer
US20050020077A1 (en) * 2003-04-18 2005-01-27 Applied Materials, Inc. Formation of protection layer by dripping DI on wafer with high rotation to prevent stain formation from H2O2/H2SO4 chemical splash
US20070232072A1 (en) * 2003-04-18 2007-10-04 Bo Zheng Formation of protection layer on wafer to prevent stain formation
US20050000173A1 (en) * 2003-07-02 2005-01-06 Vkr Holding A/S Skylight with sealing gasket
DE102004036435B4 (en) * 2003-08-07 2007-08-30 Nanophotonics Ag Holding device for disc-shaped objects
KR100672937B1 (en) * 2004-07-19 2007-01-24 삼성전자주식회사 Apparatus for treating semiconductor substrates
US10179351B2 (en) 2005-02-07 2019-01-15 Planar Semiconductor, Inc. Method and apparatus for cleaning flat objects with pulsed liquid jet
TWM285024U (en) * 2005-09-28 2006-01-01 Micro Digital Automation Corp Spin cleaning mechanism of photomasks
KR100695229B1 (en) * 2005-10-26 2007-03-14 세메스 주식회사 Spin chuck
US9732416B1 (en) 2007-04-18 2017-08-15 Novellus Systems, Inc. Wafer chuck with aerodynamic design for turbulence reduction
US8419964B2 (en) 2008-08-27 2013-04-16 Novellus Systems, Inc. Apparatus and method for edge bevel removal of copper from silicon wafers
US8172646B2 (en) * 2009-02-27 2012-05-08 Novellus Systems, Inc. Magnetically actuated chuck for edge bevel removal
KR101055601B1 (en) * 2011-01-25 2011-08-09 주식회사 쓰리디플러스 Spin chuck for manufacturing substrate
JP5712782B2 (en) * 2011-05-13 2015-05-07 株式会社Sumco Susceptor support shaft for epitaxial wafer growth apparatus and epitaxial growth apparatus
US9421617B2 (en) 2011-06-22 2016-08-23 Tel Nexx, Inc. Substrate holder
US9117856B2 (en) 2011-07-06 2015-08-25 Tel Nexx, Inc. Substrate loader and unloader having an air bearing support
US9038262B2 (en) * 2012-02-23 2015-05-26 Beijing Sevenstar Electronics Co., Ltd. Device for holding disk-shaped articles and method thereof
JP5962981B2 (en) * 2012-08-24 2016-08-03 株式会社Ｓｃｒｅｅｎホールディングス Substrate rotation holding device and substrate processing apparatus
JP6562507B2 (en) * 2015-09-28 2019-08-21 株式会社Ｓｃｒｅｅｎホールディングス Substrate holding device and substrate processing apparatus having the same
US10373858B2 (en) 2016-04-06 2019-08-06 Lam Research Corporation Chuck for edge bevel removal and method for centering a wafer prior to edge bevel removal
CN106373918A (en) * 2016-09-30 2017-02-01 无锡宏纳科技有限公司 Wafer clamping device with sliding card position device
US10704142B2 (en) * 2017-07-27 2020-07-07 Applied Materials, Inc. Quick disconnect resistance temperature detector assembly for rotating pedestal
CN109248894A (en) * 2018-12-03 2019-01-22 杭州众硅电子科技有限公司 A kind of fastening structure for rinsing, cleaning with the equipment of dry wafer
CN111312644A (en) * 2020-02-26 2020-06-19 厦门通富微电子有限公司 Automatic wafer alignment device and etching machine
CN111508889A (en) * 2020-03-13 2020-08-07 宁波润华全芯微电子设备有限公司 Wafer bearing table for clamping wafer by using centrifugal force
CN112846521B (en) * 2020-12-31 2024-03-12 大族激光科技产业集团股份有限公司 Clamp and laser marking system
CN116783695A (en) * 2021-01-12 2023-09-19 应用材料公司 Clamping mechanism for fixing substrate on carrier

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4651440A (en) 1986-05-16 1987-03-24 Eastman Kodak Company Spin drying apparatus
JPH0590238A (en) * 1991-09-27 1993-04-09 Dainippon Screen Mfg Co Ltd Substrate rotary holding jig of pivoted substrate treating device
US5350427A (en) * 1993-06-14 1994-09-27 Varian Associates, Inc. Wafer retaining platen having peripheral clamp and wafer lifting means
US5364474A (en) 1993-07-23 1994-11-15 Williford Jr John F Method for removing particulate matter
US5518542A (en) * 1993-11-05 1996-05-21 Tokyo Electron Limited Double-sided substrate cleaning apparatus
US5863348A (en) * 1993-12-22 1999-01-26 International Business Machines Corporation Programmable method for cleaning semiconductor elements
JP3556043B2 (en) 1996-03-19 2004-08-18 株式会社荏原製作所 Substrate drying equipment
US5775000A (en) 1996-05-13 1998-07-07 Ebara Corporation Substrate gripper device for spin drying
US5851041A (en) * 1996-06-26 1998-12-22 Ontrak Systems, Inc. Wafer holder with spindle assembly and wafer holder actuator
US5778554A (en) 1996-07-15 1998-07-14 Oliver Design, Inc. Wafer spin dryer and method of drying a wafer
JP3831043B2 (en) * 1997-01-24 2006-10-11 東京エレクトロン株式会社 Rotation processing device
US5974681A (en) * 1997-09-10 1999-11-02 Speedfam-Ipec Corp. Apparatus for spin drying a workpiece
US6167893B1 (en) * 1999-02-09 2001-01-02 Novellus Systems, Inc. Dynamic chuck for semiconductor wafer or other substrate

Also Published As

Publication number Publication date
WO2001093316A3 (en) 2002-06-20
WO2001093316A2 (en) 2001-12-06
US6363623B1 (en) 2002-04-02

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