AU2001259312A1 - Process for improving the adhesion of polymeric materials to metal surfaces - Google Patents

Process for improving the adhesion of polymeric materials to metal surfaces

Info

Publication number
AU2001259312A1
AU2001259312A1 AU2001259312A AU5931201A AU2001259312A1 AU 2001259312 A1 AU2001259312 A1 AU 2001259312A1 AU 2001259312 A AU2001259312 A AU 2001259312A AU 5931201 A AU5931201 A AU 5931201A AU 2001259312 A1 AU2001259312 A1 AU 2001259312A1
Authority
AU
Australia
Prior art keywords
adhesion
improving
polymeric materials
metal surfaces
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001259312A
Inventor
Donald Ferrier
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
MacDermid Inc
Original Assignee
MacDermid Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by MacDermid Inc filed Critical MacDermid Inc
Publication of AU2001259312A1 publication Critical patent/AU2001259312A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/382—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal
    • H05K3/383—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the metal by microetching
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/40—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 containing molybdates, tungstates or vanadates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C22/00—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals
    • C23C22/05—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions
    • C23C22/06—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6
    • C23C22/48—Chemical surface treatment of metallic material by reaction of the surface with a reactive liquid, leaving reaction products of surface material in the coating, e.g. conversion coatings, passivation of metals using aqueous solutions using aqueous acidic solutions with pH less than 6 not containing phosphates, hexavalent chromium compounds, fluorides or complex fluorides, molybdates, tungstates, vanadates or oxalates
    • C23C22/52—Treatment of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0796—Oxidant in aqueous solution, e.g. permanganate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
AU2001259312A 2000-06-08 2001-05-01 Process for improving the adhesion of polymeric materials to metal surfaces Abandoned AU2001259312A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09590046 2000-06-08
US09/590,046 US6383272B1 (en) 2000-06-08 2000-06-08 Process for improving the adhesion of polymeric materials to metal surfaces
PCT/US2001/014012 WO2001094033A1 (en) 2000-06-08 2001-05-01 Process for improving the adhesion of polymeric materials to metal surfaces

Publications (1)

Publication Number Publication Date
AU2001259312A1 true AU2001259312A1 (en) 2001-12-17

Family

ID=24360670

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001259312A Abandoned AU2001259312A1 (en) 2000-06-08 2001-05-01 Process for improving the adhesion of polymeric materials to metal surfaces

Country Status (10)

Country Link
US (2) US6383272B1 (en)
EP (2) EP1289678B1 (en)
JP (1) JP3884706B2 (en)
CN (1) CN1282505C (en)
AU (1) AU2001259312A1 (en)
CA (1) CA2407280A1 (en)
DE (2) DE60122509T2 (en)
ES (2) ES2271008T3 (en)
TW (1) TWI250048B (en)
WO (1) WO2001094033A1 (en)

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US7351353B1 (en) 2000-01-07 2008-04-01 Electrochemicals, Inc. Method for roughening copper surfaces for bonding to substrates
US6419784B1 (en) * 2000-06-21 2002-07-16 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6554948B1 (en) 2000-08-22 2003-04-29 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US6746547B2 (en) * 2002-03-05 2004-06-08 Rd Chemical Company Methods and compositions for oxide production on copper
US20040092102A1 (en) * 2002-11-12 2004-05-13 Sachem, Inc. Chemical mechanical polishing composition and method
US7186305B2 (en) * 2002-11-26 2007-03-06 Donald Ferrier Process for improving the adhesion of polymeric materials to metal surfaces
US7232478B2 (en) * 2003-07-14 2007-06-19 Enthone Inc. Adhesion promotion in printed circuit boards
CN100334927C (en) * 2004-04-13 2007-08-29 广东光华化学厂有限公司 Brownized treatment liquid for increasing adhesion of internal copper surface of circuit board and polymer material
JP4539179B2 (en) * 2004-06-04 2010-09-08 日立金属株式会社 Method for improving the wettability of a nickel plating film formed on the surface of an article
JP4850508B2 (en) * 2005-12-22 2012-01-11 富士通株式会社 Multilayer circuit board and manufacturing method thereof
US20090123656A1 (en) * 2007-11-13 2009-05-14 Ernest Long Composition and method for controlling galvanic corrosion in printed circuit boards
CN101456015B (en) * 2007-12-14 2012-11-21 中国第一汽车股份有限公司 Micro fin-formation technique capable of improving aluminum-sol coating
US8518281B2 (en) * 2008-06-03 2013-08-27 Kesheng Feng Acid-resistance promoting composition
US8088246B2 (en) * 2009-01-08 2012-01-03 Cordani Jr John L Process for improving the adhesion of polymeric materials to metal surfaces
US8308893B2 (en) * 2010-02-01 2012-11-13 Ming De Wang Nano-oxide process for bonding copper/copper alloy and resin
KR20150132540A (en) * 2013-03-16 2015-11-25 피알시-데소토 인터내쇼날, 인코포레이티드 Azole compounds as corrosion inhibitors
WO2015200007A1 (en) * 2014-06-24 2015-12-30 3M Innovative Properties Company Adhesive precursor composition, two-part adhesive kit, and method of making an adhesive composition
CN104928661B (en) * 2015-06-08 2017-10-20 华南理工大学 A kind of compound ion liquid brown liquid for printed circuit board
WO2020148308A1 (en) 2019-01-15 2020-07-23 Atotech Deutschland Gmbh Method of forming copper oxide on a copper surface
CN110856348A (en) * 2019-10-09 2020-02-28 广东利尔化学有限公司 Neutralizing and reducing agent for PCB (printed circuit board) glue removal post-treatment
CN116970934B (en) * 2023-08-03 2024-02-06 广东盈华电子科技有限公司 Double-sided blackening surface treatment process for electrolytic copper foil

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JP3392008B2 (en) * 1996-10-30 2003-03-31 日本表面化学株式会社 Metal protective film forming treatment agent and treatment method
JPS5221460B1 (en) * 1971-04-26 1977-06-10
SE400575B (en) 1974-12-13 1978-04-03 Nordnero Ab BATH FOR CELLING OF COPPER AND ITS ALLOYS
DE2557269A1 (en) 1975-12-19 1977-06-30 Licentia Gmbh Copper etching solution for printed circuits - contains ferric chloride or cupric chloride together with an acid and benzotriazole
JPS52150104A (en) 1976-06-07 1977-12-13 Fuji Photo Film Co Ltd Photoosensitive lithographic press plate material
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JPS57116775A (en) 1981-01-14 1982-07-20 Toshiba Corp Etching solution for nickel
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Also Published As

Publication number Publication date
EP1681373A1 (en) 2006-07-19
DE60122509D1 (en) 2006-10-05
CN1431939A (en) 2003-07-23
ES2271008T3 (en) 2007-04-16
JP2003535224A (en) 2003-11-25
WO2001094033A1 (en) 2001-12-13
EP1289678A1 (en) 2003-03-12
US6503566B2 (en) 2003-01-07
EP1289678B1 (en) 2006-08-23
DE60142648D1 (en) 2010-09-02
US20020124768A1 (en) 2002-09-12
CN1282505C (en) 2006-11-01
TWI250048B (en) 2006-03-01
EP1289678A4 (en) 2004-09-15
ES2347907T3 (en) 2010-11-25
EP1681373B1 (en) 2010-07-21
DE60122509T2 (en) 2007-05-03
JP3884706B2 (en) 2007-02-21
CA2407280A1 (en) 2001-12-13
US6383272B1 (en) 2002-05-07

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