AU2001234935A1 - Pre-plate treating system - Google Patents
Pre-plate treating systemInfo
- Publication number
- AU2001234935A1 AU2001234935A1 AU2001234935A AU3493501A AU2001234935A1 AU 2001234935 A1 AU2001234935 A1 AU 2001234935A1 AU 2001234935 A AU2001234935 A AU 2001234935A AU 3493501 A AU3493501 A AU 3493501A AU 2001234935 A1 AU2001234935 A1 AU 2001234935A1
- Authority
- AU
- Australia
- Prior art keywords
- treating system
- plate treating
- plate
- treating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Manufacturing Of Printed Wiring (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US18091700P | 2000-02-08 | 2000-02-08 | |
US06180917 | 2000-02-08 | ||
PCT/US2001/004076 WO2001059185A2 (en) | 2000-02-08 | 2001-02-08 | Pre-plate treating system |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001234935A1 true AU2001234935A1 (en) | 2001-08-20 |
Family
ID=22662189
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001234935A Abandoned AU2001234935A1 (en) | 2000-02-08 | 2001-02-08 | Pre-plate treating system |
Country Status (3)
Country | Link |
---|---|
AU (1) | AU2001234935A1 (en) |
TW (1) | TW555892B (en) |
WO (1) | WO2001059185A2 (en) |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5857520B2 (en) * | 1982-08-25 | 1983-12-20 | 正巳 小林 | Gold plating method for stainless steel strips for electronic components |
US4510018A (en) * | 1984-02-21 | 1985-04-09 | The Lea Manufacturing Company | Solution and process for treating copper and copper alloys |
EP1054081B1 (en) * | 1993-03-18 | 2006-02-01 | ATOTECH Deutschland GmbH | Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating |
-
2001
- 2001-02-08 TW TW90102763A patent/TW555892B/en not_active IP Right Cessation
- 2001-02-08 AU AU2001234935A patent/AU2001234935A1/en not_active Abandoned
- 2001-02-08 WO PCT/US2001/004076 patent/WO2001059185A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW555892B (en) | 2003-10-01 |
WO2001059185A8 (en) | 2001-11-22 |
WO2001059185A2 (en) | 2001-08-16 |
WO2001059185A3 (en) | 2002-03-07 |
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