AU2001234935A1 - Pre-plate treating system - Google Patents

Pre-plate treating system

Info

Publication number
AU2001234935A1
AU2001234935A1 AU2001234935A AU3493501A AU2001234935A1 AU 2001234935 A1 AU2001234935 A1 AU 2001234935A1 AU 2001234935 A AU2001234935 A AU 2001234935A AU 3493501 A AU3493501 A AU 3493501A AU 2001234935 A1 AU2001234935 A1 AU 2001234935A1
Authority
AU
Australia
Prior art keywords
treating system
plate treating
plate
treating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234935A
Inventor
James M. Taylor
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Duratech Industries Inc
Original Assignee
Duratech Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Duratech Industries Inc filed Critical Duratech Industries Inc
Publication of AU2001234935A1 publication Critical patent/AU2001234935A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/34—Pretreatment of metallic surfaces to be electroplated
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
AU2001234935A 2000-02-08 2001-02-08 Pre-plate treating system Abandoned AU2001234935A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US18091700P 2000-02-08 2000-02-08
US06180917 2000-02-08
PCT/US2001/004076 WO2001059185A2 (en) 2000-02-08 2001-02-08 Pre-plate treating system

Publications (1)

Publication Number Publication Date
AU2001234935A1 true AU2001234935A1 (en) 2001-08-20

Family

ID=22662189

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234935A Abandoned AU2001234935A1 (en) 2000-02-08 2001-02-08 Pre-plate treating system

Country Status (3)

Country Link
AU (1) AU2001234935A1 (en)
TW (1) TW555892B (en)
WO (1) WO2001059185A2 (en)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5857520B2 (en) * 1982-08-25 1983-12-20 正巳 小林 Gold plating method for stainless steel strips for electronic components
US4510018A (en) * 1984-02-21 1985-04-09 The Lea Manufacturing Company Solution and process for treating copper and copper alloys
EP1054081B1 (en) * 1993-03-18 2006-02-01 ATOTECH Deutschland GmbH Composition and process for treating a surface coated with a self-accelerating and replenishing non-formaldehyde immersion coating

Also Published As

Publication number Publication date
TW555892B (en) 2003-10-01
WO2001059185A8 (en) 2001-11-22
WO2001059185A2 (en) 2001-08-16
WO2001059185A3 (en) 2002-03-07

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