AU2001234856A1 - Inverted pressure vessel with shielded closure mechanism - Google Patents

Inverted pressure vessel with shielded closure mechanism

Info

Publication number
AU2001234856A1
AU2001234856A1 AU2001234856A AU3485601A AU2001234856A1 AU 2001234856 A1 AU2001234856 A1 AU 2001234856A1 AU 2001234856 A AU2001234856 A AU 2001234856A AU 3485601 A AU3485601 A AU 3485601A AU 2001234856 A1 AU2001234856 A1 AU 2001234856A1
Authority
AU
Australia
Prior art keywords
pressure vessel
closure mechanism
inverted pressure
shielded closure
shielded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001234856A
Inventor
Mohan Chandra
Robert Farmer
Heiko Moritz
Jonathan Talbot
James Tseronis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SC Fluids Inc
Original Assignee
SC Fluids Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US09/632,770 external-priority patent/US6508259B1/en
Application filed by SC Fluids Inc filed Critical SC Fluids Inc
Publication of AU2001234856A1 publication Critical patent/AU2001234856A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J3/00—Processes of utilising sub-atmospheric or super-atmospheric pressure to effect chemical or physical change of matter; Apparatus therefor
    • B01J3/008—Processes carried out under supercritical conditions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67751—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber vertical transfer of a single workpiece

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2001234856A 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism Abandoned AU2001234856A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09632770 2000-08-04
US09/632,770 US6508259B1 (en) 1999-08-05 2000-08-04 Inverted pressure vessel with horizontal through loading
PCT/US2001/003796 WO2002011911A1 (en) 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism

Publications (1)

Publication Number Publication Date
AU2001234856A1 true AU2001234856A1 (en) 2002-02-18

Family

ID=24536872

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001234856A Abandoned AU2001234856A1 (en) 2000-08-04 2001-02-05 Inverted pressure vessel with shielded closure mechanism

Country Status (7)

Country Link
EP (1) EP1358021A4 (en)
JP (1) JP2004506313A (en)
KR (1) KR20030026333A (en)
CN (1) CN1446127A (en)
AU (1) AU2001234856A1 (en)
IL (1) IL154095A0 (en)
WO (1) WO2002011911A1 (en)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007502550A (en) * 2003-06-13 2007-02-08 ソフィア ウェン， Method and apparatus for thin layer chemical processing of semiconductor wafers
US7941039B1 (en) 2005-07-18 2011-05-10 Novellus Systems, Inc. Pedestal heat transfer and temperature control
US7960297B1 (en) 2006-12-07 2011-06-14 Novellus Systems, Inc. Load lock design for rapid wafer heating
US8052419B1 (en) 2007-11-08 2011-11-08 Novellus Systems, Inc. Closed loop temperature heat up and control utilizing wafer-to-heater pedestal gap modulation
US8033771B1 (en) 2008-12-11 2011-10-11 Novellus Systems, Inc. Minimum contact area wafer clamping with gas flow for rapid wafer cooling
US8371567B2 (en) 2011-04-13 2013-02-12 Novellus Systems, Inc. Pedestal covers
KR20190132561A (en) 2012-01-06 2019-11-27 노벨러스 시스템즈, 인코포레이티드 Adaptive heat transfer methods and systems for uniform heat transfer
US10347547B2 (en) 2016-08-09 2019-07-09 Lam Research Corporation Suppressing interfacial reactions by varying the wafer temperature throughout deposition

Family Cites Families (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3968885A (en) * 1973-06-29 1976-07-13 International Business Machines Corporation Method and apparatus for handling workpieces
DE2940201A1 (en) * 1979-10-04 1981-05-07 Claas Ohg, 4834 Harsewinkel FIELD CHOPPER WITH METAL DETECTOR
US4522788A (en) * 1982-03-05 1985-06-11 Leco Corporation Proximate analyzer
JPS58180631A (en) * 1982-04-16 1983-10-22 日産自動車株式会社 Comber frame of loom
US4626509A (en) * 1983-07-11 1986-12-02 Data Packaging Corp. Culture media transfer assembly
JPH0765197B2 (en) * 1983-11-04 1995-07-12 株式会社日立製作所 Vacuum processing device
US4827867A (en) * 1985-11-28 1989-05-09 Daikin Industries, Ltd. Resist developing apparatus
JPH01246835A (en) * 1988-03-29 1989-10-02 Toshiba Corp Wafer processor
US5224504A (en) * 1988-05-25 1993-07-06 Semitool, Inc. Single wafer processor
US4879431A (en) * 1989-03-09 1989-11-07 Biomedical Research And Development Laboratories, Inc. Tubeless cell harvester
US5169408A (en) * 1990-01-26 1992-12-08 Fsi International, Inc. Apparatus for wafer processing with in situ rinse
US5071485A (en) * 1990-09-11 1991-12-10 Fusion Systems Corporation Method for photoresist stripping using reverse flow
JPH0613361A (en) * 1992-06-26 1994-01-21 Tokyo Electron Ltd Processing apparatus
KR100304127B1 (en) * 1992-07-29 2001-11-30 이노마다 시게오 Electronic-substrate treatment system using portable sealed container and apparatus thereof
JP2548062B2 (en) * 1992-11-13 1996-10-30 日本エー・エス・エム株式会社 Load lock chamber for vertical heat treatment equipment
JPH09213772A (en) * 1996-01-30 1997-08-15 Dainippon Screen Mfg Co Ltd Board holder
JP4246804B2 (en) * 1997-03-26 2009-04-02 株式会社神戸製鋼所 Heating / pressurizing equipment
JPH1194085A (en) * 1997-09-26 1999-04-09 Kobe Steel Ltd Safety device for sealed chamber in high pressure treating device
US6067728A (en) * 1998-02-13 2000-05-30 G.T. Equipment Technologies, Inc. Supercritical phase wafer drying/cleaning system
US6508259B1 (en) * 1999-08-05 2003-01-21 S.C. Fluids, Inc. Inverted pressure vessel with horizontal through loading
IL147986A0 (en) * 1999-08-05 2002-09-12 S C Fluids Inc Inverted pressure vessel with horizontal throug loading
WO2001087505A1 (en) * 2000-05-18 2001-11-22 S. C. Fluids, Inc. Supercritical fluid cleaning process for precision surfaces

Also Published As

Publication number Publication date
EP1358021A4 (en) 2004-03-31
JP2004506313A (en) 2004-02-26
KR20030026333A (en) 2003-03-31
IL154095A0 (en) 2003-07-31
CN1446127A (en) 2003-10-01
EP1358021A1 (en) 2003-11-05
WO2002011911A1 (en) 2002-02-14

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