AU2001227751A1 - Thermal joint and method of use - Google Patents

Thermal joint and method of use

Info

Publication number
AU2001227751A1
AU2001227751A1 AU2001227751A AU2775101A AU2001227751A1 AU 2001227751 A1 AU2001227751 A1 AU 2001227751A1 AU 2001227751 A AU2001227751 A AU 2001227751A AU 2775101 A AU2775101 A AU 2775101A AU 2001227751 A1 AU2001227751 A1 AU 2001227751A1
Authority
AU
Australia
Prior art keywords
thermal joint
joint
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001227751A
Inventor
Choong-Un Kim
Seung-Mun You
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thermax International LLC
Original Assignee
Thermax International LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thermax International LLC filed Critical Thermax International LLC
Publication of AU2001227751A1 publication Critical patent/AU2001227751A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00—Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/01—Manufacture or treatment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3738—Semiconductor materials
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
    • F28F2013/005—Thermal joints
    • F28F2013/006—Heat conductive materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3011—Impedance
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1419—Wax containing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/14—Layer or component removable to expose adhesive
    • Y10T428/1452—Polymer derived only from ethylenically unsaturated monomer

Landscapes

  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Powder Metallurgy (AREA)
AU2001227751A 2000-01-11 2001-01-09 Thermal joint and method of use Abandoned AU2001227751A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09481194 2000-01-11
US09/481,194 US6343647B2 (en) 2000-01-11 2000-01-11 Thermal joint and method of use
PCT/US2001/000622 WO2001052323A2 (en) 2000-01-11 2001-01-09 Thermal joint and method of use

Publications (1)

Publication Number Publication Date
AU2001227751A1 true AU2001227751A1 (en) 2001-07-24

Family

ID=23911006

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001227751A Abandoned AU2001227751A1 (en) 2000-01-11 2001-01-09 Thermal joint and method of use

Country Status (6)

Country Link
US (1) US6343647B2 (en)
JP (1) JP2001257298A (en)
KR (1) KR100459794B1 (en)
AU (1) AU2001227751A1 (en)
TW (1) TW503544B (en)
WO (1) WO2001052323A2 (en)

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US7436058B2 (en) * 2002-05-09 2008-10-14 Intel Corporation Reactive solder material
US20030230403A1 (en) * 2002-06-14 2003-12-18 Webb Brent J. Conductive thermal interface and compound
AU2003268769A1 (en) * 2002-10-07 2004-04-23 Matsushita Electric Industrial Co., Ltd. Element for thermal fuse, thermal fuse and battery including the same
US6665186B1 (en) 2002-10-24 2003-12-16 International Business Machines Corporation Liquid metal thermal interface for an electronic module
JP4014528B2 (en) * 2003-03-28 2007-11-28 日本碍子株式会社 Heat spreader module manufacturing method and heat spreader module
US7416922B2 (en) * 2003-03-31 2008-08-26 Intel Corporation Heat sink with preattached thermal interface material and method of making same
US7014093B2 (en) * 2003-06-26 2006-03-21 Intel Corporation Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same
US7527090B2 (en) * 2003-06-30 2009-05-05 Intel Corporation Heat dissipating device with preselected designed interface for thermal interface materials
US7004243B1 (en) * 2003-07-22 2006-02-28 Unisys Corporation Method of extending the operational period of a heat-exchanger in a chip tester
CN100370635C (en) * 2003-12-22 2008-02-20 中国电子科技集团公司第十八研究所 Compression joint method for thermoelement and electrode
US20060120051A1 (en) * 2004-12-03 2006-06-08 Chris Macris Liquid metal thermal interface material system
JP4378334B2 (en) * 2005-09-09 2009-12-02 日本碍子株式会社 Heat spreader module and manufacturing method thereof
US8280982B2 (en) 2006-05-24 2012-10-02 Time Warner Cable Inc. Personal content server apparatus and methods
US9386327B2 (en) 2006-05-24 2016-07-05 Time Warner Cable Enterprises Llc Secondary content insertion apparatus and methods
US8024762B2 (en) 2006-06-13 2011-09-20 Time Warner Cable Inc. Methods and apparatus for providing virtual content over a network
US7825945B2 (en) * 2006-09-18 2010-11-02 Zink Imaging, Inc. Thermal printer with auxiliary heat sink and methods for printing using same
TWI344196B (en) * 2006-11-15 2011-06-21 Ind Tech Res Inst Melting temperature adjustable metal thermal interface materials and use thereof
US8016022B2 (en) * 2006-11-27 2011-09-13 Honeywell International Inc. Systems and methods for passive thermal management using phase change material
US8181206B2 (en) 2007-02-28 2012-05-15 Time Warner Cable Inc. Personal content server apparatus and methods
US8216418B2 (en) * 2007-06-13 2012-07-10 Lam Research Corporation Electrode assembly and plasma processing chamber utilizing thermally conductive gasket and o-rings
JP4345855B2 (en) * 2007-07-31 2009-10-14 セイコーエプソン株式会社 Semiconductor device, heat radiator, and method for manufacturing semiconductor device
US8152954B2 (en) 2007-10-12 2012-04-10 Lam Research Corporation Showerhead electrode assemblies and plasma processing chambers incorporating the same
US8187414B2 (en) * 2007-10-12 2012-05-29 Lam Research Corporation Anchoring inserts, electrode assemblies, and plasma processing chambers
TWI354529B (en) * 2007-11-23 2011-12-11 Ind Tech Res Inst Metal thermal interface material and thermal modul
US9503691B2 (en) 2008-02-19 2016-11-22 Time Warner Cable Enterprises Llc Methods and apparatus for enhanced advertising and promotional delivery in a network
US8187413B2 (en) * 2008-03-18 2012-05-29 Lam Research Corporation Electrode assembly and plasma processing chamber utilizing thermally conductive gasket
US8679288B2 (en) * 2008-06-09 2014-03-25 Lam Research Corporation Showerhead electrode assemblies for plasma processing apparatuses
US8449679B2 (en) 2008-08-15 2013-05-28 Lam Research Corporation Temperature controlled hot edge ring assembly
WO2011007224A2 (en) * 2009-07-13 2011-01-20 Clipper Windpower, Inc. Low cost, high thermal conductivity heat flux transporter
US20130224510A1 (en) * 2012-02-29 2013-08-29 General Electric Company System including thermal interface material
US8866861B2 (en) 2012-10-19 2014-10-21 Zink Imaging, Inc. Systems and methods for automatic print alignment
US20140282786A1 (en) 2013-03-12 2014-09-18 Time Warner Cable Enterprises Llc Methods and apparatus for providing and uploading content to personalized network storage
US9826662B2 (en) 2013-12-12 2017-11-21 General Electric Company Reusable phase-change thermal interface structures
KR20170108766A (en) * 2016-03-18 2017-09-27 헤베이 리신 테크놀로지 컴퍼니 리미티드 Lead free solder composition with high ductility
JP7482415B2 (en) * 2018-11-16 2024-05-14 株式会社日本スペリア社 Solder joint and manufacturing method thereof
US20230054798A1 (en) * 2020-03-27 2023-02-23 Mitsubishi Electric Corporation Metal jointed body, semiconductor device, wave guide tube, and method for joining members to be joined
CN115808748A (en) * 2021-09-14 2023-03-17 戴尔产品有限公司 System and method for thermoelectrically cooling optical ports

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Also Published As

Publication number Publication date
KR100459794B1 (en) 2004-12-03
US6343647B2 (en) 2002-02-05
TW503544B (en) 2002-09-21
US20010032719A1 (en) 2001-10-25
WO2001052323A2 (en) 2001-07-19
JP2001257298A (en) 2001-09-21
WO2001052323A3 (en) 2001-12-13
KR20010070181A (en) 2001-07-25

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