AU2001225742A1 - Low haze adhesive sheet - Google Patents

Low haze adhesive sheet

Info

Publication number
AU2001225742A1
AU2001225742A1 AU2001225742A AU2574201A AU2001225742A1 AU 2001225742 A1 AU2001225742 A1 AU 2001225742A1 AU 2001225742 A AU2001225742 A AU 2001225742A AU 2574201 A AU2574201 A AU 2574201A AU 2001225742 A1 AU2001225742 A1 AU 2001225742A1
Authority
AU
Australia
Prior art keywords
adhesive sheet
low haze
haze adhesive
low
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001225742A
Inventor
Karunasena A. Alahapperuma
Steven S. Kanter
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2001225742A1 publication Critical patent/AU2001225742A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L75/00—Compositions of polyureas or polyurethanes; Compositions of derivatives of such polymers
    • C08L75/04—Polyurethanes
    • C08L75/14—Polyurethanes having carbon-to-carbon unsaturated bonds
    • C08L75/16—Polyurethanes having carbon-to-carbon unsaturated bonds having terminal carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2809—Web or sheet containing structurally defined element or component and having an adhesive outermost layer including irradiated or wave energy treated component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2878—Adhesive compositions including addition polymer from unsaturated monomer
    • Y10T428/2891—Adhesive compositions including addition polymer from unsaturated monomer including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/28—Web or sheet containing structurally defined element or component and having an adhesive outermost layer
    • Y10T428/2852—Adhesive compositions
    • Y10T428/2896—Adhesive compositions including nitrogen containing condensation polymer [e.g., polyurethane, polyisocyanate, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
AU2001225742A 2000-07-13 2000-11-16 Low haze adhesive sheet Abandoned AU2001225742A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09615389 2000-07-13
US09/615,389 US6472065B1 (en) 2000-07-13 2000-07-13 Clear adhesive sheet
PCT/US2000/031587 WO2002006413A1 (en) 2000-07-13 2000-11-16 Low haze adhesive sheet

Publications (1)

Publication Number Publication Date
AU2001225742A1 true AU2001225742A1 (en) 2002-01-30

Family

ID=24465146

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001225742A Abandoned AU2001225742A1 (en) 2000-07-13 2000-11-16 Low haze adhesive sheet

Country Status (3)

Country Link
US (1) US6472065B1 (en)
AU (1) AU2001225742A1 (en)
WO (1) WO2002006413A1 (en)

Families Citing this family (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6759121B2 (en) * 2000-07-13 2004-07-06 3M Innovative Properties Company Clear adhesive sheet
JP4812963B2 (en) * 2001-05-18 2011-11-09 リンテック株式会社 Adhesive sheet for processing semiconductor wafer and method for processing semiconductor wafer
US6949297B2 (en) 2001-11-02 2005-09-27 3M Innovative Properties Company Hybrid adhesives, articles, and methods
JP2003218063A (en) * 2002-01-24 2003-07-31 Canon Inc Adhesive sheet for water sticking, and processing method using the sheet
EP1391493A1 (en) * 2002-08-22 2004-02-25 Lintec Corporation Surface protecting film for polycarbonate
US6887917B2 (en) 2002-12-30 2005-05-03 3M Innovative Properties Company Curable pressure sensitive adhesive compositions
US7951687B2 (en) 2003-04-02 2011-05-31 Polymer Vision Limited Method of manufacturing a flexible electronic device and flexible device
US7927703B2 (en) 2003-04-11 2011-04-19 3M Innovative Properties Company Adhesive blends, articles, and methods
DE10322964B4 (en) 2003-05-21 2006-03-23 Seleon Gmbh Control unit for anti-snoring device and anti-snoring device
WO2004113491A1 (en) * 2003-06-20 2004-12-29 Nitto Denko Corporation Cell microchip
JP2005027659A (en) * 2003-06-20 2005-02-03 Nitto Denko Corp Cell microchip
JP2005150235A (en) 2003-11-12 2005-06-09 Three M Innovative Properties Co Semiconductor surface protection sheet and method therefor
JP4519476B2 (en) * 2004-02-03 2010-08-04 株式会社東芝 Wireless communication device
US20060082002A1 (en) * 2004-10-06 2006-04-20 Lintec Corporation Sheet for circuit substrates and sheet of a circuit substrate for displays
US20070114366A1 (en) * 2005-11-21 2007-05-24 General Electric Company Optical article having a multi-component structure as an anti-theft feature and a system and method for inhibiting theft of same
JP4976075B2 (en) * 2005-12-26 2012-07-18 リンテック株式会社 Adhesive for polarizing plate, polarizing plate with adhesive and method for producing the same
US7807754B2 (en) * 2006-03-13 2010-10-05 3M Innovative Properties Company Dry apply adhesive graphic films
JP2007273714A (en) * 2006-03-31 2007-10-18 Lintec Corp Circuit board and manufacturing method therefor
JP5057697B2 (en) * 2006-05-12 2012-10-24 日東電工株式会社 Adhesive sheet for processing semiconductor wafers or semiconductor substrates
JP5863157B2 (en) * 2006-12-18 2016-02-16 日東電工株式会社 Adhesive sheet
DE102007006251B4 (en) * 2007-02-08 2016-07-07 Lohmann Gmbh & Co. Kg Method for the edge-side passivation of PSA tapes, PSA roll produced by the process and their use
JP2010521555A (en) * 2007-03-16 2010-06-24 スリーエム イノベイティブ プロパティズ カンパニー Dicing and die attach adhesives
US20090068458A1 (en) * 2007-09-06 2009-03-12 3M Innovative Properties Company Adhesive-coated backing for flexible circuit
JP5400061B2 (en) 2007-12-27 2014-01-29 スリーエム イノベイティブ プロパティズ カンパニー Urea pressure sensitive adhesive
JP5063389B2 (en) * 2008-01-30 2012-10-31 リンテック株式会社 Circuit board resin sheet, circuit board sheet, and display circuit board
WO2009114345A1 (en) 2008-03-07 2009-09-17 3M Innovative Properties Company Dicing tape and die attach adhesive with patterned backing
US8488428B2 (en) 2008-05-14 2013-07-16 Nbcuniversal Media, Llc Enhanced security of optical article
US20110250375A1 (en) * 2008-12-31 2011-10-13 Bries James L Stretch releasable pressure-sensitive adhesives
CN102459490B (en) 2009-05-15 2014-04-23 3M创新有限公司 Urethane-based pressure sensitive adhesives
US20140178681A1 (en) * 2011-09-14 2014-06-26 3M Innovative Properties Company Methods of modulating tackiness
EP2779265B1 (en) * 2011-11-11 2018-07-18 Dai Nippon Printing Co., Ltd. Electrochemical cell packaging material
CN106103620A (en) * 2014-01-08 2016-11-09 艾利丹尼森公司 Selectivity is used to take off the goods of glutinous binder, composition, system and method
US10526511B2 (en) 2016-12-22 2020-01-07 Avery Dennison Corporation Convertible pressure sensitive adhesives comprising urethane (meth)acrylate oligomers

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3639266A1 (en) 1985-12-27 1987-07-02 Fsk K K ADHESIVE FILM
US5281473A (en) * 1987-07-08 1994-01-25 Furakawa Electric Co., Ltd. Radiation-curable adhesive tape
DE3850451T2 (en) 1987-07-08 1995-03-09 Furukawa Electric Co Ltd Radiation-crosslinkable adhesive strips.
IT1224960B (en) 1988-10-26 1990-10-29 Castellini Spa TARTAR SCALER WITH OWN LIGHTING
JPH02164357A (en) 1988-12-19 1990-06-25 Toray Ind Inc Method and device for producing cylindrical fiber body
JP3410202B2 (en) 1993-04-28 2003-05-26 日本テキサス・インスツルメンツ株式会社 Adhesive sheet for attaching wafer and method for manufacturing semiconductor device using the same
JP3348923B2 (en) * 1993-07-27 2002-11-20 リンテック株式会社 Adhesive sheet for attaching wafer
US5480842A (en) 1994-04-11 1996-01-02 At&T Corp. Method for fabricating thin, strong, and flexible die for smart cards
JPH10510237A (en) 1994-11-29 1998-10-06 デー エス エム エヌ．ヴェー． Radiation curable coating composition and coating
JP3035179B2 (en) * 1995-01-13 2000-04-17 住友ベークライト株式会社 Adhesive sheet for semiconductor wafer processing
KR100249313B1 (en) 1997-07-25 2000-03-15 윤종용 Tape laminating system for semiconductor device and its driving method
US6013722A (en) 1998-01-27 2000-01-11 3M Innovative Properties Company Non-whitening emulsion pressure sensitive adhesives
JP3669196B2 (en) 1998-07-27 2005-07-06 日東電工株式会社 UV curable adhesive sheet

Also Published As

Publication number Publication date
US6472065B1 (en) 2002-10-29
WO2002006413A1 (en) 2002-01-24

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