AU2000225122A1 - Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles - Google Patents
Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particlesInfo
- Publication number
- AU2000225122A1 AU2000225122A1 AU2000225122A AU2512200A AU2000225122A1 AU 2000225122 A1 AU2000225122 A1 AU 2000225122A1 AU 2000225122 A AU2000225122 A AU 2000225122A AU 2512200 A AU2512200 A AU 2512200A AU 2000225122 A1 AU2000225122 A1 AU 2000225122A1
- Authority
- AU
- Australia
- Prior art keywords
- metal
- chelates
- decomposition
- association
- forming thin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
- H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
- H01L21/76838—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the conductors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0047—Digital printing on surfaces other than ordinary paper by ink-jet printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/0064—Digital printing on surfaces other than ordinary paper on plastics, horn, rubber, or other organic polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
- B41M5/0041—Digital printing on surfaces other than ordinary paper
- B41M5/007—Digital printing on surfaces other than ordinary paper on glass, ceramic, tiles, concrete, stones, etc.
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/06—Coating on selected surface areas, e.g. using masks
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/02—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition
- C23C18/08—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by thermal decomposition characterised by the deposition of metallic material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/288—Deposition of conductive or insulating materials for electrodes conducting electric current from a liquid, e.g. electrolytic deposition
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/105—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by conversion of non-conductive material on or in the support into conductive material, e.g. by using an energy beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M3/00—Printing processes to produce particular kinds of printed work, e.g. patterns
- B41M3/006—Patterns of chemical products used for a specific purpose, e.g. pesticides, perfumes, adhesive patterns; use of microencapsulated material; Printing on smoking articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
- B41M7/009—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock using thermal means, e.g. infrared radiation, heat
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/14—Decomposition by irradiation, e.g. photolysis, particle radiation or by mixed irradiation sources
- C23C18/143—Radiation by light, e.g. photolysis or pyrolysis
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/US2000/001432 WO2001053007A1 (en) | 2000-01-21 | 2000-01-21 | Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2000225122A1 true AU2000225122A1 (en) | 2001-07-31 |
Family
ID=21740983
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2000225122A Abandoned AU2000225122A1 (en) | 2000-01-21 | 2000-01-21 | Method for forming thin-film conductors through the decomposition of metal-chelates in association with metal particles |
AU2001224743A Abandoned AU2001224743A1 (en) | 2000-01-21 | 2001-01-05 | Direct printing of thin-film conductors using metal-chelate inks |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001224743A Abandoned AU2001224743A1 (en) | 2000-01-21 | 2001-01-05 | Direct printing of thin-film conductors using metal-chelate inks |
Country Status (6)
Country | Link |
---|---|
US (1) | US6830778B1 (en) |
EP (2) | EP1441864B1 (en) |
JP (1) | JP5247962B2 (en) |
AU (2) | AU2000225122A1 (en) |
DE (2) | DE60043359D1 (en) |
WO (2) | WO2001053007A1 (en) |
Families Citing this family (56)
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US20030148024A1 (en) * | 2001-10-05 | 2003-08-07 | Kodas Toivo T. | Low viscosity precursor compositons and methods for the depositon of conductive electronic features |
AU2002337822A1 (en) * | 2001-10-05 | 2003-04-22 | Superior Micropowders Llc | Low viscosity precursor compositions and methods for the deposition of conductive electronic features |
US6951666B2 (en) * | 2001-10-05 | 2005-10-04 | Cabot Corporation | Precursor compositions for the deposition of electrically conductive features |
KR20040077655A (en) * | 2001-10-19 | 2004-09-06 | 슈페리어 마이크로파우더스 엘엘씨 | Tape compositions for the deposition of electronic features |
JP3920802B2 (en) * | 2003-03-28 | 2007-05-30 | Jsr株式会社 | Wiring, electrode and method for forming them |
WO2004112151A2 (en) * | 2003-06-12 | 2004-12-23 | Patterning Technologies Limited | Transparent conducting structures and methods of production thereof |
JP4932150B2 (en) * | 2003-10-21 | 2012-05-16 | 株式会社半導体エネルギー研究所 | Manufacturing method of semiconductor element |
US20050129843A1 (en) | 2003-12-11 | 2005-06-16 | Xerox Corporation | Nanoparticle deposition process |
KR20060035052A (en) * | 2004-10-20 | 2006-04-26 | 삼성전자주식회사 | Method of an electrode, display devices and method of manufacturing the same |
US7931941B1 (en) | 2004-10-29 | 2011-04-26 | Pchem Associates, Inc. | Synthesis of metallic nanoparticle dispersions capable of sintering at low temperatures |
WO2006056090A1 (en) * | 2004-11-24 | 2006-06-01 | Sensirion Ag | Method for applying selectively a layer to a structured substrate by the usage of a temperature gradient in the substrate |
WO2006076609A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Printable electronic features on non-uniform substrate and processes for making same |
US8334464B2 (en) | 2005-01-14 | 2012-12-18 | Cabot Corporation | Optimized multi-layer printing of electronics and displays |
US8383014B2 (en) | 2010-06-15 | 2013-02-26 | Cabot Corporation | Metal nanoparticle compositions |
WO2006076611A2 (en) | 2005-01-14 | 2006-07-20 | Cabot Corporation | Production of metal nanoparticles |
US7824466B2 (en) | 2005-01-14 | 2010-11-02 | Cabot Corporation | Production of metal nanoparticles |
US20070144305A1 (en) * | 2005-12-20 | 2007-06-28 | Jablonski Gregory A | Synthesis of Metallic Nanoparticle Dispersions |
WO2007149881A2 (en) * | 2006-06-19 | 2007-12-27 | Cabot Corporation | Metal-containing nanoparticles, their synthesis and use |
US20080003364A1 (en) * | 2006-06-28 | 2008-01-03 | Ginley David S | Metal Inks |
DE102006029947B4 (en) * | 2006-06-29 | 2013-01-17 | Basf Se | Method for applying a metallic cover layer to a high-temperature superconductor |
US8057850B2 (en) * | 2006-11-09 | 2011-11-15 | Alliance For Sustainable Energy, Llc | Formation of copper-indium-selenide and/or copper-indium-gallium-selenide films from indium selenide and copper selenide precursors |
WO2008063190A2 (en) * | 2006-11-09 | 2008-05-29 | Midwest Research Institute | Precursors for formation of copper selenide, indium selenide, copper indium diselenide, and/or copper indium gallium diselenide films |
EP2131979A4 (en) | 2007-03-01 | 2013-03-06 | Pchem Associates Inc | Shielding based on metallic nanoparticle compositions and devices and methods thereof |
US8759144B2 (en) * | 2007-11-02 | 2014-06-24 | Alliance For Sustainable Energy, Llc | Fabrication of contacts for silicon solar cells including printing burn through layers |
US20100209594A1 (en) * | 2007-11-02 | 2010-08-19 | Alliance For Sustainable Energy, Llc | Printing aluminum films and patterned contacts using organometallic precursor inks |
US8308993B2 (en) | 2008-01-30 | 2012-11-13 | Basf Se | Conductive inks |
US8383011B2 (en) | 2008-01-30 | 2013-02-26 | Basf Se | Conductive inks with metallo-organic modifiers |
US7736546B2 (en) | 2008-01-30 | 2010-06-15 | Basf Se | Glass frits |
US20100015462A1 (en) * | 2008-02-29 | 2010-01-21 | Gregory Jablonski | Metallic nanoparticle shielding structure and methods thereof |
DE102008032554A1 (en) * | 2008-07-10 | 2010-01-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Metal-containing composition, process for the production of electrical contact structures on electronic components and electronic component |
DE102008051469A1 (en) * | 2008-10-13 | 2010-04-15 | Malibu Gmbh & Co. Kg | Method for contacting thin-film solar cells and thin-film solar module |
KR101142416B1 (en) * | 2008-12-31 | 2012-05-07 | 주식회사 잉크테크 | Method for manufacturing metal film |
US8721930B2 (en) * | 2009-08-04 | 2014-05-13 | Precursor Energetics, Inc. | Polymeric precursors for AIGS silver-containing photovoltaics |
SG178227A1 (en) * | 2009-08-04 | 2012-03-29 | Precursor Energetics Inc | Polymeric precursors for cis and cigs photovoltaics |
JP2013501054A (en) * | 2009-08-04 | 2013-01-10 | プリカーサー エナジェティクス, インコーポレイテッド | CAIGAS Aluminum-Containing Polymer Precursor for Photovoltaic Device |
KR20120047282A (en) * | 2009-08-04 | 2012-05-11 | 프리커서 에너제틱스, 인코퍼레이티드. | Methods for photovoltaic absorbers with controlled stoichiometry |
CN102822385B (en) | 2009-11-09 | 2016-09-07 | 卡内基·梅隆大学 | Metallic ink composition, conductive pattern, method and device |
WO2011084171A1 (en) * | 2009-12-17 | 2011-07-14 | Precursor Energetics, Inc. | Molecular precursors for optoelectronics |
WO2011146115A1 (en) | 2010-05-21 | 2011-11-24 | Heliovolt Corporation | Liquid precursor for deposition of copper selenide and method of preparing the same |
US9142408B2 (en) | 2010-08-16 | 2015-09-22 | Alliance For Sustainable Energy, Llc | Liquid precursor for deposition of indium selenide and method of preparing the same |
WO2012037391A2 (en) | 2010-09-15 | 2012-03-22 | Precursor Energetics, Inc. | Annealing processes for photovoltaics |
US20120132272A1 (en) | 2010-11-19 | 2012-05-31 | Alliance For Sustainable Energy, Llc. | Solution processed metal oxide thin film hole transport layers for high performance organic solar cells |
US9297742B2 (en) | 2011-01-06 | 2016-03-29 | General Electric Company | Method for manufacturing a corrosion sensor |
US8643389B2 (en) | 2011-01-06 | 2014-02-04 | General Electric Company | Corrosion sensor and method for manufacturing a corrosion sensor |
US8359728B2 (en) | 2011-01-06 | 2013-01-29 | General Electric Company | Method for manufacturing a corrosion sensor |
JP2013058562A (en) | 2011-09-07 | 2013-03-28 | Semiconductor Energy Lab Co Ltd | Photoelectric conversion device |
WO2013063320A1 (en) | 2011-10-28 | 2013-05-02 | Liquid X Printed Metals, Inc. | Transparent conductive- and ito-replacement materials and structures |
US20130202901A1 (en) * | 2012-02-03 | 2013-08-08 | Empire Technology Development Llc | Printable electronics substrate |
TWI696668B (en) | 2012-02-27 | 2020-06-21 | 美商黎可德X印製金屬公司 | Self-reducing metal complex inks soluble in polar protic solvents and improved curing methods |
CN104284952A (en) | 2012-02-29 | 2015-01-14 | 耶路撒冷希伯来大学伊森姆研究发展有限公司 | Inks containing metal precursors nanoparticles |
US9105797B2 (en) | 2012-05-31 | 2015-08-11 | Alliance For Sustainable Energy, Llc | Liquid precursor inks for deposition of In—Se, Ga—Se and In—Ga—Se |
WO2014138558A1 (en) | 2013-03-07 | 2014-09-12 | Alliance For Sustainable Energy, Llc | Methods for producing thin film charge selective transport layers |
US9508635B2 (en) | 2013-06-27 | 2016-11-29 | STATS ChipPAC Pte. Ltd. | Methods of forming conductive jumper traces |
US9406533B2 (en) | 2013-06-27 | 2016-08-02 | STATS ChipPAC Pte. Ltd. | Methods of forming conductive and insulating layers |
US10918356B2 (en) | 2016-11-22 | 2021-02-16 | General Electric Company | Ultrasound transducers having electrical traces on acoustic backing structures and methods of making the same |
DE102019219615A1 (en) | 2019-12-13 | 2021-06-17 | Heraeus Deutschland GmbH & Co. KG | Manufacturing process for precious metal electrodes |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4599277A (en) | 1984-10-09 | 1986-07-08 | International Business Machines Corp. | Control of the sintering of powdered metals |
US5316796A (en) * | 1990-03-09 | 1994-05-31 | Nippon Telegraph And Telephone Corporation | Process for growing a thin metallic film |
US5281635A (en) * | 1991-05-17 | 1994-01-25 | Johnson Matthey Public Limited Company | Precious metal composition |
US5474800A (en) * | 1991-06-20 | 1995-12-12 | Tokyo Gas Company, Ltd. | Method for preparing anode for solid oxide fuel cells |
US5176744A (en) * | 1991-08-09 | 1993-01-05 | Microelectronics Computer & Technology Corp. | Solution for direct copper writing |
DE69311680T2 (en) * | 1992-08-20 | 1997-10-02 | Mitsuboshi Belting Ltd | Glassy material with ultrafine dispersed particles and process for its production |
JP3195072B2 (en) * | 1992-09-29 | 2001-08-06 | 三井金属鉱業株式会社 | Fibrous conductive filler and method for producing the same |
US5882722A (en) * | 1995-07-12 | 1999-03-16 | Partnerships Limited, Inc. | Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds |
JP3137035B2 (en) * | 1997-05-26 | 2001-02-19 | 昭栄化学工業株式会社 | Nickel powder and method for producing the same |
EP1027723B1 (en) * | 1997-10-14 | 2009-06-17 | Patterning Technologies Limited | Method of forming an electric capacitor |
-
2000
- 2000-01-21 WO PCT/US2000/001432 patent/WO2001053007A1/en active Application Filing
- 2000-01-21 DE DE60043359T patent/DE60043359D1/en not_active Expired - Lifetime
- 2000-01-21 AU AU2000225122A patent/AU2000225122A1/en not_active Abandoned
- 2000-01-21 EP EP00903364A patent/EP1441864B1/en not_active Expired - Lifetime
-
2001
- 2001-01-05 DE DE60125174T patent/DE60125174T2/en not_active Expired - Lifetime
- 2001-01-05 EP EP01900331A patent/EP1295344B1/en not_active Expired - Lifetime
- 2001-01-05 JP JP2001553593A patent/JP5247962B2/en not_active Expired - Fee Related
- 2001-01-05 US US10/088,760 patent/US6830778B1/en not_active Expired - Fee Related
- 2001-01-05 WO PCT/US2001/000430 patent/WO2001054203A2/en active IP Right Grant
- 2001-01-05 AU AU2001224743A patent/AU2001224743A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
US6830778B1 (en) | 2004-12-14 |
EP1295344B1 (en) | 2006-12-13 |
AU2001224743A1 (en) | 2001-07-31 |
EP1441864A4 (en) | 2004-08-04 |
EP1441864A1 (en) | 2004-08-04 |
DE60125174T2 (en) | 2007-10-25 |
WO2001054203A2 (en) | 2001-07-26 |
JP2004500711A (en) | 2004-01-08 |
EP1441864B1 (en) | 2009-11-18 |
DE60043359D1 (en) | 2009-12-31 |
WO2001053007A1 (en) | 2001-07-26 |
WO2001054203A3 (en) | 2003-01-23 |
EP1295344A2 (en) | 2003-03-26 |
JP5247962B2 (en) | 2013-07-24 |
DE60125174D1 (en) | 2007-01-25 |
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