AU1314699A - Modular circuit board construction and method of producing the same - Google Patents

Modular circuit board construction and method of producing the same

Info

Publication number
AU1314699A
AU1314699A AU13146/99A AU1314699A AU1314699A AU 1314699 A AU1314699 A AU 1314699A AU 13146/99 A AU13146/99 A AU 13146/99A AU 1314699 A AU1314699 A AU 1314699A AU 1314699 A AU1314699 A AU 1314699A
Authority
AU
Australia
Prior art keywords
producing
circuit board
same
modular circuit
board construction
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU13146/99A
Inventor
Walter E. Earleson
Paul C. Gottshall
Brian G. Mcgee
Paul M. Young
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Caterpillar Inc
Original Assignee
Caterpillar Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Caterpillar Inc filed Critical Caterpillar Inc
Publication of AU1314699A publication Critical patent/AU1314699A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/045—Hierarchy auxiliary PCB, i.e. more than two levels of hierarchy for daughter PCBs are important
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09072—Hole or recess under component or special relationship between hole and component
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/368—Assembling printed circuits with other printed circuits parallel to each other

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)
AU13146/99A 1997-11-10 1998-11-09 Modular circuit board construction and method of producing the same Abandoned AU1314699A (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US96757797A 1997-11-10 1997-11-10
US08967577 1997-11-10
PCT/US1998/023862 WO1999025163A1 (en) 1997-11-10 1998-11-09 Modular circuit board construction and method of producing the same

Publications (1)

Publication Number Publication Date
AU1314699A true AU1314699A (en) 1999-05-31

Family

ID=25512998

Family Applications (1)

Application Number Title Priority Date Filing Date
AU13146/99A Abandoned AU1314699A (en) 1997-11-10 1998-11-09 Modular circuit board construction and method of producing the same

Country Status (2)

Country Link
AU (1) AU1314699A (en)
WO (1) WO1999025163A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ES2168070B1 (en) * 2000-07-19 2003-11-01 Lear Automotive Eeds Spain COMPOSITE PRINTED CIRCUIT PLATE, WITH TRACK ZONES OF DIFFERENT THICKNESS LINKS, PROCEDURE FOR MANUFACTURING, AND DISTRIBUTION BOX USING THE SAME.
DE202004002332U1 (en) * 2004-02-11 2004-04-22 Siemens Ag circuit board
AT12319U1 (en) 2009-07-10 2012-03-15 Austria Tech & System Tech METHOD FOR PRODUCING A PCB CONTAINING AT LEAST TWO PCB SURFACES AND PCB
CN109121293B (en) * 2018-09-30 2020-05-15 西安易朴通讯技术有限公司 Printed circuit board assembly and electronic device

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1591751C3 (en) * 1967-11-02 1978-09-07 Telefunken Patentverwertungsgesellschaft Mbh, 7900 Ulm Circuit arrangement
GB2098398A (en) * 1981-05-13 1982-11-17 Honeywell Ltd Electronic packaging system
JPH0679990A (en) * 1992-09-04 1994-03-22 Mitsubishi Electric Corp Ic memory card
DE9309973U1 (en) * 1993-07-05 1993-09-16 Blaupunkt Werke Gmbh Printed circuit board with light-emitting components

Also Published As

Publication number Publication date
WO1999025163A1 (en) 1999-05-20

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase